PUBLISHER: Stratistics Market Research Consulting | PRODUCT CODE: 1284189
PUBLISHER: Stratistics Market Research Consulting | PRODUCT CODE: 1284189
3D IC and 2.5D IC Packaging Market Forecasts to 2028 - Global Analysis By Packaging Technology (3D Through-Silicon Via, 3D Wafer-Level Chip-Scale Packaging and 2.5D), Application, End User and By Geography
According to Stratistics MRC, the Global 3D IC and 2.5D IC Packaging Market is accounted for $49.3 billion in 2022 and is expected to reach $101.0 billion by 2028 growing at a CAGR of 12.7% during the forecast period. 2.5D / 3D packaging is a way of putting numerous integrated circuits (IC) into the same package. Two or more active semiconductor chips are put side by side atop a silicon interposer in a 2.5D arrangement to achieve extraordinarily high die-to-die connection density. Active chips in 3D structures are integrated via die stacking for the shortest connectivity and lowest package footprint. Because of their advantages in obtaining exceptionally high package density and great energy efficiency, 2.5D and 3D have gained traction as an appropriate chiplet integration platform in recent years.
According to WSTS, the IC market for semiconductors reached USD 463 billion in revenue in 2021 and is expected to grow by over 10% to USD 510.96 billion in 2022 due to the surging usage of advanced wafer-level packaging technologies in sensors and MEMS, is expected to provide growth prospects for the 3D IC packaging market during the forecast period.
Market Dynamics:
Driver:
Consumer gadgets and gaming devices are becoming increasingly popular
Many new gadgets are entering the market as a result of recent technological advancements, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products, all of which require high-performance electronic components. By shortening the critical route and lowering latency, 3D IC packaging technology has helped overcome the processor memory performance gap. It also enables scaling to continue in an effective manner by shifting the emphasis from device-level scaling to circuit- and system-level scaling.
Restraint:
Thermal difficulties caused by a higher level of integration
3D integrated circuits provide extremely dense multi-level integration per unit footprint. Though this is appealing for many applications where miniaturisation is a concern, it also poses thermal management challenges; increased integration leads to high on-chip temperatures. A bigger form factor, the need for a larger silicon interposer, and lengthier design cycles are all difficulties that must be addressed with 3D ICs. During the production of 3D ICs with TSVs, overheating has been observed. Elevated temperatures cause a decrease in threshold voltage and mobility deterioration.
Opportunity:
A growing number of smart infrastructure and smart city initiatives are being developed
3D IC packaging has the potential to play an important role in the development and deployment of smart city technologies. Smart cities use a range of electronic devices, sensors, and systems to gather and analyse data in real time, allowing for better decision-making and resource management. These devices and systems can be made smaller, more powerful, and energy efficient by utilising 3D IC packaging. This contributes to lowering the total cost and size of smart city infrastructure while enhancing performance and dependability.
Threat:
3D IC packaging reliability challenges
Applications like as information centred, cloud, accessibility, and the Internet of Things (IoT) drive the semiconductor sector business. To meet the needs of modern information and communication technology (ICT) systems, packaging technology must improve in tandem with the scaling of integrated circuit (IC) technology. Package development and design must fulfil price, efficiency, form factor, and dependability goals all at the same time. When it comes to operating the layout, the power density for a given footprint is higher than for typical 2D chips. However, addressing issues of dependability will be critical which hampers the growth of the market.
COVID-19 Impact:
The COVID-19 pandemic has had a huge influence on different businesses while also propelling the development of new medical equipment and gadgets throughout the world. Following the pandemic outbreak, several medical equipment manufacturing companies announced an increase in the production of several new equipment and devices. Because 3D IC packaging has numerous applications in the medical and healthcare industries, increased manufacturing initiatives are expected to increase demand for 3D IC and 2.5D IC packaging.
The 3D wafer-level chip-scale packaging (WLCSP) segment is expected to be the largest during the forecast period
The 3D wafer-level chip-scale packaging (WLCSP) segment is estimated to have a lucrative growth, due to its one of most tightly packaging type, offering enhanced capabilities and improved thermal stability in printed circuit boards. 3D WLCSP is a simpler process architecture for producing 3D ICs, which employs polymers that can withstand high temperatures, resolving the thermal stability issue, which is the market's biggest difficulty. Because it provides economical, small, lightweight, exceptional performance semiconductor solutions, 3D WLCSP has been gaining prominence in facility-constrained consumer's electronic applications and other portable consumer devices, as well as industrial products.
The MEMS/Sensors segment is expected to have the highest CAGR during the forecast period
The MEMS/Sensors segment is anticipated to witness the highest CAGR growth during the forecast period, because MEMS functional components include micro sensors, micro actuators, and microelectronics. MEMS advanced elements include accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The essential need in all of these parts and sensors is a miniaturised construction. As a result, many sensors are now using 3D IC and 2.5D IC packaging.
Region with highest share:
Asia Pacific is projected to hold the highest market share during the forecast period owing to its extensive reach in numerous consumer electronics applications, notably smartphone and tablets, the Asia Pacific area is one of the important markets for 3D IC and 2.5D IC packaging. This is mostly due to the region's high population density, which makes it the greatest potential market for 3D IC and 2.5D IC packaging among the four key areas.
Region with highest CAGR:
North America is projected to have the highest CAGR over the forecast period, owing to rising demand for electronics; growing patterns of remote work and remote operations, and boosting digitalization have all contributed to the need for cutting-edge semiconductor devices in the United States. As the demand for semiconductor devices rises, modern packaging techniques provide the processing power and form factor required for today's digital world. These factors are expected to drive 3D IC and 2.5D IC sales in the United States.
Key players in the market:
Some of the key players profiled in the 3D IC and 2.5D IC Packaging Market include Samsung, ASE Technology Holding Co., Ltd., Amkor Technology, Broadcom, United Microelectronics Corporation, Texas Instruments Inc, Powertech Technology Inc., JCET Group Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, Toshiba Corporation, Invensas, GlobalFoundries, Siliconware Precision Industries Co. Ltd (SPIL) and Jiangsu Changjiang Electronics Technology Co., Ltd.
Key Developments:
In April 2023, Samsung Opens Free-to-Play Gaming Zones in Collaboration With Xbox at Microsoft Experience Centers in London, New York, with this partnership, Samsung Gaming Hub users are now able to stream over 100 high-quality games through the Xbox App by subscribing to Xbox Game Pass Ultimate.
In April 2023, Samsung and TOILETPAPER Collaborate to Introduce Edgy, Iconic Designs for Bespoke Appliances, together with creative partner TOILETPAPER, Samsung offers new, limited-edition Bespoke panels that maximize bold self-expression and personalization in the kitchen.
In March 2023, Amkor Expands Power Solutions for Automotive Electrification, as the demand for electrification, renewable energy, and efficient power delivery continues to grow, Amkor is focusing increased effort on silicon carbide
Packaging Technologies Covered:
- 3D Through-Silicon Via (TSV)
- 3D Wafer-Level Chip-Scale Packaging (WLCSP)
- 2.5D
Applications Covered:
- Imaging & Optoelectronics
- Memory
- Logic
- MEMS/Sensors
- LED
- Other Applications
End Users Covered:
- Industrial
- Telecommunications
- Consumer Electronics
- Military & Aerospace
- Medical Devices
- Automotive
Regions Covered:
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- UK
- Italy
- France
- Spain
- Rest of Europe
- Asia Pacific
- Japan
- China
- India
- Australia
- New Zealand
- South Korea
- Rest of Asia Pacific
- South America
- Argentina
- Brazil
- Chile
- Rest of South America
- Middle East & Africa
- Saudi Arabia
- UAE
- Qatar
- South Africa
- Rest of Middle East & Africa
What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
- Company Profiling
- Comprehensive profiling of additional market players (up to 3)
- SWOT Analysis of key players (up to 3)
- Regional Segmentation
- Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
- Competitive Benchmarking
- Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Table of Contents
1 Executive Summary
2 Preface
- 2.1 Abstract
- 2.2 Stake Holders
- 2.3 Research Scope
- 2.4 Research Methodology
- 2.4.1 Data Mining
- 2.4.2 Data Analysis
- 2.4.3 Data Validation
- 2.4.4 Research Approach
- 2.5 Research Sources
- 2.5.1 Primary Research Sources
- 2.5.2 Secondary Research Sources
- 2.5.3 Assumptions
3 Market Trend Analysis
- 3.1 Introduction
- 3.2 Drivers
- 3.3 Restraints
- 3.4 Opportunities
- 3.5 Threats
- 3.6 Application Analysis
- 3.7 End User Analysis
- 3.8 Emerging Markets
- 3.9 Impact of Covid-19
4 Porters Five Force Analysis
- 4.1 Bargaining power of suppliers
- 4.2 Bargaining power of buyers
- 4.3 Threat of substitutes
- 4.4 Threat of new entrants
- 4.5 Competitive rivalry
5 Global 3D IC and 2.5D IC Packaging Market, By Packaging Technology
- 5.1 Introduction
- 5.2 3D Through-Silicon Via (TSV)
- 5.3 3D Wafer-Level Chip-Scale Packaging (WLCSP)
- 5.4 2.5D
6 Global 3D IC and 2.5D IC Packaging Market, By Application
- 6.1 Introduction
- 6.2 Imaging & Optoelectronics
- 6.3 Memory
- 6.4 Logic
- 6.5 MEMS/Sensors
- 6.6 LED
- 6.7 Other Applications
7 Global 3D IC and 2.5D IC Packaging Market, By End User
- 7.1 Introduction
- 7.2 Industrial
- 7.3 Telecommunications
- 7.4 Consumer Electronics
- 7.5 Military & Aerospace
- 7.6 Medical Devices
- 7.7 Automotive
8 Global 3D IC and 2.5D IC Packaging Market, By Geography
- 8.1 Introduction
- 8.2 North America
- 8.2.1 US
- 8.2.2 Canada
- 8.2.3 Mexico
- 8.3 Europe
- 8.3.1 Germany
- 8.3.2 UK
- 8.3.3 Italy
- 8.3.4 France
- 8.3.5 Spain
- 8.3.6 Rest of Europe
- 8.4 Asia Pacific
- 8.4.1 Japan
- 8.4.2 China
- 8.4.3 India
- 8.4.4 Australia
- 8.4.5 New Zealand
- 8.4.6 South Korea
- 8.4.7 Rest of Asia Pacific
- 8.5 South America
- 8.5.1 Argentina
- 8.5.2 Brazil
- 8.5.3 Chile
- 8.5.4 Rest of South America
- 8.6 Middle East & Africa
- 8.6.1 Saudi Arabia
- 8.6.2 UAE
- 8.6.3 Qatar
- 8.6.4 South Africa
- 8.6.5 Rest of Middle East & Africa
9 Key Developments
- 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
- 9.2 Acquisitions & Mergers
- 9.3 New Product Launch
- 9.4 Expansions
- 9.5 Other Key Strategies
10 Company Profiling
- 10.1 Samsung
- 10.2 ASE Technology Holding Co., Ltd.
- 10.3 Amkor Technology
- 10.4 Broadcom
- 10.5 United Microelectronics Corporation
- 10.6 Texas Instruments Inc
- 10.7 Powertech Technology Inc.
- 10.8 JCET Group Co., Ltd.
- 10.9 Taiwan Semiconductor Manufacturing Company, Ltd.
- 10.10 Intel Corporation
- 10.11 Toshiba Corporation
- 10.12 Invensas
- 10.13 GlobalFoundries
- 10.14 Siliconware Precision Industries Co. Ltd (SPIL)
- 10.15 Jiangsu Changjiang Electronics Technology Co., Ltd.
List of Tables
- Table 1 Global 3D IC and 2.5D IC Packaging Market Outlook, By Region (2020-2028) ($MN)
- Table 2 Global 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
- Table 3 Global 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
- Table 4 Global 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
- Table 5 Global 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
- Table 6 Global 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
- Table 7 Global 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
- Table 8 Global 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
- Table 9 Global 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
- Table 10 Global 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
- Table 11 Global 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
- Table 12 Global 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
- Table 13 Global 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
- Table 14 Global 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
- Table 15 Global 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
- Table 16 Global 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
- Table 17 Global 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
- Table 18 Global 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
- Table 19 Global 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
- Table 20 North America 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
- Table 21 North America 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
- Table 22 North America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
- Table 23 North America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
- Table 24 North America 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
- Table 25 North America 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
- Table 26 North America 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
- Table 27 North America 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
- Table 28 North America 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
- Table 29 North America 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
- Table 30 North America 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
- Table 31 North America 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
- Table 32 North America 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
- Table 33 North America 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
- Table 34 North America 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
- Table 35 North America 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
- Table 36 North America 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
- Table 37 North America 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
- Table 38 North America 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
- Table 39 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
- Table 40 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
- Table 41 Europe 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
- Table 42 Europe 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
- Table 43 Europe 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
- Table 44 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
- Table 45 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
- Table 46 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
- Table 47 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
- Table 48 Europe 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
- Table 49 Europe 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
- Table 50 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
- Table 51 Europe 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
- Table 52 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
- Table 53 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
- Table 54 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
- Table 55 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
- Table 56 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
- Table 57 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
- Table 58 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
- Table 59 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
- Table 60 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
- Table 61 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
- Table 62 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
- Table 63 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
- Table 64 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
- Table 65 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
- Table 66 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
- Table 67 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
- Table 68 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
- Table 69 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
- Table 70 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
- Table 71 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
- Table 72 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
- Table 73 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
- Table 74 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
- Table 75 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
- Table 76 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
- Table 77 South America 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
- Table 78 South America 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
- Table 79 South America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
- Table 80 South America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
- Table 81 South America 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
- Table 82 South America 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
- Table 83 South America 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
- Table 84 South America 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
- Table 85 South America 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
- Table 86 South America 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
- Table 87 South America 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
- Table 88 South America 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
- Table 89 South America 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
- Table 90 South America 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
- Table 91 South America 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
- Table 92 South America 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
- Table 93 South America 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
- Table 94 South America 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
- Table 95 South America 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
- Table 96 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
- Table 97 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
- Table 98 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
- Table 99 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
- Table 100 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
- Table 101 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
- Table 102 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
- Table 103 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
- Table 104 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
- Table 105 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
- Table 106 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
- Table 107 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
- Table 108 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
- Table 109 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
- Table 110 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
- Table 111 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
- Table 112 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
- Table 113 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
- Table 114 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
