Envelope Tracking Chip Global Market Report 2026

An envelope tracking chip is categorized as a power management integrated circuit (PMIC) utilized in mobile devices to enhance energy efficiency and prolong battery life. This methodology entails monitoring the amplitude envelope of the RF signal and adjusting the bias voltage to optimize power amplifier efficiency.

The primary technology types of envelope tracking chips include cellular communications, wireless communications, and satellite communications. Cellular communications pertain to the technology enabling the use of mobile phones for communication purposes. Various applications encompass smartphones, wearable devices, and others, spanning industries such as telecommunications, healthcare, consumer electronics, defense, automotive, among others.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Tariffs have impacted the envelope tracking chip market by raising costs for imported semiconductor wafers, RF materials, and precision manufacturing equipment essential for chip fabrication. Telecommunications, consumer electronics, and automotive sectors in Asia-Pacific, North America, and Europe face higher sourcing costs and production delays. However, tariffs are also prompting increased investment in local semiconductor foundries, fostering regional supply chain resilience, and supporting innovation in more efficient and cost-optimized envelope tracking chip technologies.

The envelope tracking chip market research report is one of a series of new reports from The Business Research Company that provides envelope tracking chip market statistics, including envelope tracking chip industry global market size, regional shares, competitors with an envelope tracking chip market share, detailed envelope tracking chip market segments, market trends and opportunities, and any further data you may need to thrive in the envelope tracking chip industry. This envelope tracking chip market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The envelope tracking chip market size has grown strongly in recent years. It will grow from $2.43 billion in 2025 to $2.65 billion in 2026 at a compound annual growth rate (CAGR) of 8.9%. The growth in the historic period can be attributed to growth in smartphone adoption, early deployment of 4g lte technologies, increasing demand for battery-efficient mobile devices, expansion of wireless communication standards, rise in rf component integration.

The envelope tracking chip market size is expected to see strong growth in the next few years. It will grow to $3.81 billion in 2030 at a compound annual growth rate (CAGR) of 9.6%. The growth in the forecast period can be attributed to increasing rollout of 5g and beyond networks, rising demand for advanced pmic solutions, development of high-efficiency rf front-end modules, growing adoption of wearable devices, expansion of satellite communication-enabled consumer applications. Major trends in the forecast period include adoption of cloud-connected envelope tracking architectures, expansion of IoT-enabled rf power management, integration of AI-enhanced signal optimization, advancement of automated chip manufacturing technologies, development of high-efficiency smart amplification systems.

Significant growth in the electronics industry is expected to drive the expansion of the envelope tracking chip market in the coming years. The electronics industry encompasses the design, development, production, and sale of electronic components, devices, and systems, including consumer electronics, telecommunications equipment, computers, semiconductors, and industrial electronics. Envelope tracking chips are employed in electronic devices such as mobile phones, wearables, and IoT devices to extend battery life and enhance overall performance by allowing power amplifiers to operate at maximum efficiency, reducing energy waste and improving battery longevity. For instance, in May 2023, the Japan Electronics and Information Technology Industries Association, a Japan-based trade organization, reported that Japan's electronic equipment production reached approximately USD 5.6 billion (771,457 million yen). Production of consumer electronics increased to around USD 233 million (32,099 million yen), up from approximately USD 183 million (25,268 million yen) in May 2022. Therefore, growth in the electronics industry is driving the expansion of the envelope tracking chip market.

Prominent companies operating in the envelope tracking chip market are actively involved in creating groundbreaking solutions, such as the Snapdragon X35 5G Modem-RF System featuring Qualcomm QET5100 Envelope Tracking, to drive the global expansion of 5G RedCap. Qualcomm QET5100 Envelope Tracking is a power management technology that enhances the efficiency of the power amplifier in a mobile device by dynamically adjusting the voltage supplied to the power amplifier based on the instantaneous signal envelope. For example, in February 2023, Qualcomm Incorporated, a US-based semiconductor manufacturer, integrated the QET5100 envelope tracking technology into Qualcomm's Snapdragon X35 5G modem-RF system, marking the world's first 5G NR-Light modem-RF system. The QET5100 envelope tracking technology collaborates with the modem to deliver power-efficient performance while upholding high RF performance.

In February 2023, Navitas Semiconductor Corporation, a technology firm based in the United States, purchased Halo Microelectronics Inc. for $20 million. This acquisition is intended to improve Navitas Semiconductor's power management integrated circuit (PMIC) portfolio and bolster its standing in the semiconductor industry, especially in areas linked to electric vehicles and data centers. Halo Microelectronics Co. Ltd., located in China, focuses on the design and production of advanced power management integrated circuits (PMIC).

Major companies operating in the envelope tracking chip market are Analog Devices Inc., Broadcom Inc., Efficient Power Conversion Corporation, MediaTek Inc., Qorvo Inc., Qualcomm Incorporated., R2 Semiconductor Inc., Skyworks Solutions Inc., Texas Instruments Incorporated., Maxim Integrated Products Inc., Nujira Ltd., Samsung Electronics Co. Ltd., NXP Semiconductors N.V., Infineon Technologies AG, STMicroelectronics N.V., MACOM Technology Solutions Holdings Inc., Murata Manufacturing Co. Ltd., TDK Corporation, Taiyo Yuden Co. Ltd., Microchip Technology Inc., Renesas Electronics Corporation, Toshiba Corporation, ROHM Semiconductor, ON Semiconductor Corporation

North America was the largest region in the envelope tracking chip market in 2025. Asia-Pacific is expected to be the fastest-growing region in the global envelope tracking chip market report during the forecast period. The regions covered in the envelope tracking chip market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the envelope tracking chip market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The envelope tracking chip market consists of revenues earned by entities by providing power management services to improve energy efficiency, extend battery life, and enhance overall device performance. The market value includes the value of related goods sold by the service provider or included within the service offering. The envelope tracking chip market also includes sales of standalone ET chips, integrated ET modules, and multi-mode ET chips. Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Envelope Tracking Chip Market Global Report 2026 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses envelope tracking chip market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for envelope tracking chip ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The envelope tracking chip market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
• The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
• The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
• The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
• The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
• The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
• Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.

Scope

• Markets Covered:1) By Technology: Cellular Communications; Wireless Communications; Satellite Communications
• 2) By Application: Smart Phones; Wearable Devices; Other Application
• 3) By Industry: Telecommunications; Healthcare; Consumer Electronics; Defense; Automotive; Other Industry
• Subsegments:
• 1) By Cellular Communications: 4G LTE; 5G NR; 3G UMTS; 2G GSM
• 2) By Wireless Communications: Wi-Fi; Bluetooth; ZigBee; NFC (Near Field Communication)
• 3) By Satellite Communications: L-Band; S-Band; C-Band; Ku-Band; Ka-Band
• Companies Mentioned: Analog Devices Inc.; Broadcom Inc.; Efficient Power Conversion Corporation; MediaTek Inc.; Qorvo Inc.; Qualcomm Incorporated.; R2 Semiconductor Inc.; Skyworks Solutions Inc.; Texas Instruments Incorporated.; Maxim Integrated Products Inc.; Nujira Ltd.; Samsung Electronics Co. Ltd.; NXP Semiconductors N.V.; Infineon Technologies AG; STMicroelectronics N.V.; MACOM Technology Solutions Holdings Inc.; Murata Manufacturing Co. Ltd.; TDK Corporation; Taiyo Yuden Co. Ltd.; Microchip Technology Inc.; Renesas Electronics Corporation; Toshiba Corporation; ROHM Semiconductor; ON Semiconductor Corporation
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
• Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time Series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
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