PUBLISHER: The Business Research Company | PRODUCT CODE: 1927239
PUBLISHER: The Business Research Company | PRODUCT CODE: 1927239
A soft chemical-mechanical polishing (CMP) pad is a flexible, low-hardness pad used in semiconductor manufacturing during chemical-mechanical planarization. Its main function is to gently polish wafer surfaces, ensuring uniform material removal while reducing surface defects and dishing. These pads are particularly well-suited for delicate layers or fine features that require controlled, low-pressure planarization.
The primary types of CMP pads include hard pads and soft pads. Hard pads are made from rigid materials that offer firm support and high durability for precise material removal during surface finishing. They are typically composed of materials such as polyurethane, silicon carbide, polyester, and composites. These pads are applied in various processes including wafer polishing, film chemical-mechanical polishing, memory device fabrication, and photonic device production, serving industries such as electronics, automotive, aerospace, and medical devices.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
Tariffs have influenced the soft CMP pad market by increasing costs of imported polymers and conditioning equipment. These impacts are most evident in semiconductor fabrication hubs across Asia Pacific and the United States. Higher tariffs have affected consumable pricing for foundries. However, tariffs have encouraged domestic pad manufacturing investments. This has strengthened local supply chains and reduced reliance on imports.
The soft chemical-mechanical polishing (cmp) pad market research report is one of a series of new reports from The Business Research Company that provides soft chemical-mechanical polishing (cmp) pad market statistics, including soft chemical-mechanical polishing (cmp) pad industry global market size, regional shares, competitors with a soft chemical-mechanical polishing (cmp) pad market share, detailed soft chemical-mechanical polishing (cmp) pad market segments, market trends and opportunities, and any further data you may need to thrive in the soft chemical-mechanical polishing (cmp) pad industry. This soft chemical-mechanical polishing (cmp) pad market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The soft chemical-mechanical polishing (cmp) pad market size has grown strongly in recent years. It will grow from $1.15 billion in 2025 to $1.24 billion in 2026 at a compound annual growth rate (CAGR) of 7.8%. The growth in the historic period can be attributed to semiconductor scaling, wafer surface uniformity needs, CMP process standardization, memory chip demand, electronics manufacturing growth.
The soft chemical-mechanical polishing (cmp) pad market size is expected to see strong growth in the next few years. It will grow to $1.69 billion in 2030 at a compound annual growth rate (CAGR) of 8.0%. The growth in the forecast period can be attributed to advanced logic chip production, AI hardware demand, automotive semiconductor growth, photonic device manufacturing, precision planarization requirements. Major trends in the forecast period include increasing use in advanced node fabrication, rising demand for defect free planarization, growth in memory device manufacturing, shift toward low pressure polishing solutions, advancements in pad material engineering.
The expanding semiconductor industry is expected to drive the growth of the soft chemical-mechanical polishing (CMP) pad market. This industry, which designs, manufactures, and sells semiconductor devices such as integrated circuits and transistors, is growing due to rising demand for advanced electronics such as smartphones, computers, and IoT devices that depend on sophisticated semiconductor components for optimal performance. Soft CMP pads play a critical role by enabling precise planarization, ensuring uniform wafer surfaces, and producing high-quality thin films. These pads help reduce defects and material inconsistencies, thereby enhancing device performance and manufacturing efficiency. For example, in July 2025, the Semiconductor Industry Association reported that semiconductor industry sales reached $630.5 billion and are projected to increase by 11.2% to $701 billion in 2025. As a result, the growth of the semiconductor industry is fueling demand for soft CMP pads.
The growing automotive industry is expected to drive the growth of the soft chemical-mechanical polishing (CMP) pad market in the coming years. The automotive industry encompasses the design, development, manufacture, marketing, and sale of motor vehicles, including cars, trucks, motorcycles, and their components. This growth is fueled by consumer demand for advanced, fuel-efficient, and technologically equipped vehicles. Soft CMP pads support the automotive industry by enabling precise polishing of semiconductor components used in modern vehicle electronics, enhancing component reliability and performance to meet the requirements of technology-driven automobiles. For instance, in May 2025, according to the European Automobile Manufacturers' Association (ACEA), a Belgium-based organization, South American car production increased by 1.7% in 2024 compared to 2023, largely driven by Brazil, which recorded a 6.3% rise, producing approximately 1.9 million cars. Meanwhile, global bus production reached 362,005 units last year, marking a 10.3% increase from 2023. Therefore, the growing automotive industry is fueling the growth of the soft CMP pad market.
In April 2025, Enpulse Co. Ltd., a South Korea-based electronics company, acquired the CMP PAD Business Division from SKC Solmics Co., Ltd. for an undisclosed amount. Through this acquisition, Enpulse aims to expand its semiconductor materials portfolio and strengthen its position in the semiconductor manufacturing supply chain by integrating SKC Solmics' CMP PAD technologies and expertise. SKC Solmics Co. Ltd. is a South Korea-based company specializing in chemical mechanical planarization (CMP) pads and related semiconductor process materials.
Major companies operating in the soft chemical-mechanical polishing (cmp) pad market are 3M Company, DuPont de Nemours Inc., Entegris Inc., Cabot Corporation, SKC Co. Ltd., Fujibo Holdings Inc., JSR Corporation, Hubei DingLong Chemical Co. Ltd., Beijing Grish Hitech Co. Ltd., Nitta Corporation, KPX Chemical Co. Ltd., Pureon AG, IV Technologies Inc., FNS TECH Co. Ltd., TWI Incorporated, Coorstek Inc., Resonac Corporation, KCTech Co. Ltd., Anji Microelectronics Co. Ltd., Jiangsu Nata Opto-electronic Material Co. Ltd.
Asia-Pacific was the largest region in the soft chemical-mechanical polishing (CMP) pad market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the soft chemical-mechanical polishing (cmp) pad market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa
The countries covered in the soft chemical-mechanical polishing (cmp) pad market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain
The soft chemical-mechanical polishing (CMP) pad market consists of sales of oxide polishing pads, metal polishing pads, advanced slurry-compatible pads, hard texture pads, and soft texture pads. Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
Soft Chemical-Mechanical Polishing (CMP) Pad Market Global Report 2026 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.
This report focuses soft chemical-mechanical polishing (cmp) pad market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
Where is the largest and fastest growing market for soft chemical-mechanical polishing (cmp) pad ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The soft chemical-mechanical polishing (cmp) pad market global report from the Business Research Company answers all these questions and many more.
The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.
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