Dry Etching Equipment Global Market Report 2026

Dry etching equipment is a semiconductor manufacturing tool that removes material from a substrate using plasma or reactive gases instead of liquid chemicals. It enables the creation of fine patterns and complex structures on microchips with high precision while minimizing damage to surrounding areas. This equipment plays a key role in advanced device fabrication, including integrated circuits, by providing controlled, anisotropic etching.

The main types of dry etching equipment include inductively coupled plasma (ICP) etching, capacitively coupled plasma etching, reactive ion etching, deep reactive ion etching, and others. ICP etching is a high-density plasma technique that uses inductive coils to generate plasma, allowing precise, anisotropic, and high-aspect-ratio etching of semiconductor materials. Key components of these systems include etch chambers, gas control systems, power supplies, cooling systems, and software/control systems. The equipment is available in various configurations, such as batch etchers, single-wafer etchers, high-volume production etchers, modular etching systems, and advanced automated etch tools. These systems are widely applied in semiconductor fabrication, micro-electro-mechanical systems (MEMS), LED production, and other areas, serving end users across electronics, automotive, aerospace, healthcare, and more.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Tariffs have impacted the dry etching equipment market by increasing costs of imported plasma components, gas delivery systems, and control electronics. Semiconductor manufacturing equipment is most affected, particularly in asia pacific fabrication hubs. Higher capital expenditure has influenced fab expansion timelines. However, tariffs are encouraging localized tool manufacturing and supply chain resilience.

The dry etching equipment market research report is one of a series of new reports from The Business Research Company that provides dry etching equipment market statistics, including dry etching equipment industry global market size, regional shares, competitors with a dry etching equipment market share, detailed dry etching equipment market segments, market trends and opportunities, and any further data you may need to thrive in the dry etching equipment industry. This dry etching equipment market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The dry etching equipment market size has grown strongly in recent years. It will grow from $11.94 billion in 2025 to $12.92 billion in 2026 at a compound annual growth rate (CAGR) of 8.2%. The growth in the historic period can be attributed to scaling of semiconductor nodes, growth of integrated circuit manufacturing, demand for precision patterning, expansion of foundry capacity, advancement in plasma etching technologies.

The dry etching equipment market size is expected to see strong growth in the next few years. It will grow to $17.49 billion in 2030 at a compound annual growth rate (CAGR) of 7.9%. The growth in the forecast period can be attributed to growth of advanced logic and memory chips, expansion of EV semiconductor demand, adoption of 3 nm and below nodes, rising investment in chip manufacturing plants, demand for low damage etching processes. Major trends in the forecast period include adoption of atomic layer etching, rising demand for high aspect ratio etching, integration of advanced process control software, expansion of single wafer etching systems, increased focus on yield optimization.

The increasing demand for semiconductor devices is expected to drive the growth of the dry etching equipment market going forward. Semiconductor devices are electronic components that control electrical current using the unique properties of semiconductor materials. The rise in demand for these devices is primarily fueled by the rapid growth of consumer electronics, as products like smartphones, laptops, and smart home devices increasingly rely on advanced chips for enhanced performance and functionality. Dry etching equipment supports semiconductor manufacturing by precisely shaping and patterning microscopic circuits on silicon wafers, enabling miniaturization, improved efficiency, and higher performance in electronic components. For instance, in April 2024, according to SEMI, a China-based semiconductor industry association, global sales of semiconductor manufacturing equipment, including front-end tools such as dry etch systems, reached US$ 106.3 billion in 2023. Therefore, the increasing demand for semiconductor devices is driving the growth of the dry etching equipment market.

Leading players in the dry etching equipment market are developing innovative solutions, including plasma etching-based tools, to improve precision, scalability, and efficiency in semiconductor fabrication. Plasma etching equipment uses ionized gases to remove material from substrates, enabling precise and controlled etching of micro-scale patterns and structures. For example, in November 2024, Japan-based Hitachi High-Technologies Corporation launched the DCR Etch System 9060 Series, designed for precise isotropic (horizontal) etching at the atomic layer level. The system employs plasma etching technology to support the fabrication of advanced three-dimensional semiconductor devices, such as 3D-NAND and 3D-DRAM. It offers high-throughput processing and a compact footprint through a unique wafer-cooling mechanism combined with an infrared lamp that rapidly alternates wafer temperatures, allowing atomic-level control of wafer pattern shapes essential for complex 3D architectures. The system is suitable for both R&D and mass production, helping reduce development cycles, lower costs, and boost productivity in semiconductor manufacturing.

In November 2023, U.S.-based plasma processing equipment provider Plasma-Therm LLC acquired Thin Film Equipment SRL for an undisclosed sum. This acquisition enables Plasma-Therm to expand its European footprint as part of its long-term strategic growth plan and significantly broaden its power device offerings by integrating TFE's suite of physical vapor deposition (PVD) tools designed for MEMS, power, RFID, and other semiconductor applications. Thin Film Equipment SRL, headquartered in Italy, specializes in semiconductor and MEMS equipment for dry-etch technologies.

Major companies operating in the dry etching equipment market are Panasonic Corporation, Applied Materials Inc., Lam Research Corporation, Tokyo Electron Limited, KLA Corporation, Hitachi High-Technologies Corporation, NAURA Technology Group Co. Ltd., DISCO Corporation, Advanced Energy Industries Inc., ULVAC Inc., Advanced Micro-Fabrication Equipment Inc., Oxford Instruments plc, Shibaura Mechatronics Corporation, GigaLane Co. Ltd., Plasma-Therm LLC, Samco Inc., SENTECH Instruments GmbH, Plasma Etch Inc., Nano-Master Inc., PVA TePla AG

Asia-Pacific was the largest region in the dry etching equipment market in 2025. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the dry etching equipment market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa

The countries covered in the dry etching equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The dry etching equipment market consists of revenues earned by entities by providing services such as installation and commissioning services, maintenance and repair services, process development and optimization services, training and technical support services, and upgrade and retrofit services. The market value includes the value of related goods sold by the service provider or included within the service offering. The dry etching equipment market also includes sales of metal etching systems, dielectric etching systems, and hybrid etching systems. Values in this market are 'factory gate' values; that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Dry Etching Equipment Market Global Report 2026 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses dry etching equipment market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for dry etching equipment ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The dry etching equipment market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
• The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
• The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
• The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
• The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
• The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
• Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.

Scope

• Markets Covered:1) By Type: Inductively Coupled Plasma Etching; Capacitive Coupled Plasma Etching; Reactive Ion Etching; Deep Reactive Ion Etching; Others Types
• 2) By Component: Etch Chambers; Gas Control Systems; Power Supplies; Cooling Systems; Software And Control Systems
• 3) By Equipment Type: Batch Etchers; Single Wafer Etchers; High Volume Production Etchers; Modular Etching Systems; Etch Tools With Advanced Automation
• 4) By Application: Semiconductor Manufacturing; Micro-Electro-Mechanical Systems; Light Emitting Diode Production; Other Applications
• 5) By End-User: Electronics; Automotive; Aerospace; Healthcare; Other End-Users
• Subsegments:
• 1) By Inductively Coupled Plasma Etching: High Density Plasma Systems; Low Pressure Plasma Systems; Advanced Wafer Etching Systems
• 2) By Capacitive Coupled Plasma Etching: Parallel Plate Plasma Etching Systems; Medium Frequency Plasma Systems; Single Wafer Processing Systems
• 3) By Reactive Ion Etching: Parallel Plate Reactive Ion Etching Systems; High Selectivity Etching Systems; Low Damage Etching Systems
• 4) By Deep Reactive Ion Etching: Bosch Process Etching Systems; Cryogenic Process Etching Systems; High Aspect Ratio Etching Systems
• 5) By Others Types: Microwave Plasma Etching Systems; Neutral Beam Etching Systems; Atomic Layer Etching Systems
• Companies Mentioned: Panasonic Corporation; Applied Materials Inc.; Lam Research Corporation; Tokyo Electron Limited; KLA Corporation; Hitachi High-Technologies Corporation; NAURA Technology Group Co. Ltd.; DISCO Corporation; Advanced Energy Industries Inc.; ULVAC Inc.; Advanced Micro-Fabrication Equipment Inc.; Oxford Instruments plc; Shibaura Mechatronics Corporation; GigaLane Co. Ltd.; Plasma-Therm LLC; Samco Inc.; SENTECH Instruments GmbH; Plasma Etch Inc.; Nano-Master Inc.; PVA TePla AG
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
• Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time Series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
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