Metal Chemicals for FE & Advanced Packaging Market Report (a Critical Materials Report) 2023-2024

Description

List of Tables

This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

1. EXECUTIVE SUMMARY

1.1. EXECUTIVE SUMMARY
1.2. ADVANCED PACKAGING PER WAFER STARTS
1.3. DEVICE DEMAND DRIVERS-LOGIC
1.4. CU PLATING FORECAST FOR DAMASCENE (FE) AND ADVANCED PACKAGING
1.5. MARKET SHARES
1.6. SUPPLIER ACTIVITIES-VARIOUS ANNOUNCEMENTS
1.7. RISK FACTORS
1.8. ANALYST ASSESSMENT

2. SCOPE, PURPOSE AND METHODOLOGY

2.1. SCOPE
2.2. PURPOSE
2.3. METHODOLOGY
2.4. OVERVIEW OF OTHER TECHCET CMR™ 2022 REPORTS

3. SEMICONDUCTOR INDUSTRY MARKET OUTLOOK

3.1. WORLDWIDE ECONOMY
- 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2. SEMICONDUCTOR SALES GROWTH
- 3.1.3. TAIWAN MONTHLY SALES TRENDS
- 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023-SLOWER TO NEGATIVE SEMI REVENUE GROWTH EXPECTED
3.2. ELECTRONIC GOODS MARKET
- 3.2.1. SMARTPHONES
- 3.2.2. PC UNIT SHIPMENTS
  - 3.2.2.1. ELECTRIC VEHICLE (EV) MARKET TRENDS
  - 3.2.2.2. INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
- 3.2.3. SERVERS / IT MARKET
3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
- 3.3.2. WW FAB EXPANSION DRIVING GROWTH
- 3.3.3. EQUIPMENT SPENDING TRENDS
- 3.3.4. TECHNOLOGY ROADMAPS
- 3.3.5. FAB INVESTMENT ASSESSMENT
3.4. POLICY & TRADE TRENDS AND IMPACT
- 3.4.1. POLICY AND TRADE ISSUES
3.5. SEMICONDUCTOR MATERIALS OUTLOOK
- 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
- 3.5.2. CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD
- 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2026
  - 3.5.3.1. TECHCET WAFER START MODELING METHODOLOGY
- 3.5.4. TECHCET'S MATERIAL FORECAST

4. METAL CHEMICALS MARKET BY SEGMENT

4.1. DEFINITIONS
4.2. METAL PLATING CHEMICALS MARKET OVERVIEW
- 4.2.1. OVERVIEW-ADVANCED PACKAGING AND DAMASCENE METALLIZATION
- 4.2.2. OVERVIEW-PLATING MARKET TRANSITIONAL TRENDS
4.3. ADVANCED PACKAGING METALLIZATION-MARKET DRIVERS
- 4.3.1. ADVANCED PACKAGING-ADDITIVES FOR CU PLATING REVENUE
- 4.3.2. ADVANCED PACKAGING-COPPER CHEMICALS REVENUE
- 4.3.3. ADVANCED PACKAGING ADDITIVE VOLUMES
- 4.3.4. OTHER PLATING MATERIALS FOR ADVANCED PACKAGING
- 4.3.5. SN / SNAG PLATING
  - 4.3.5.1. WW NI PLATING MARKET FORECAST
4.4. DAMASCENE GROWTH TRENDS
- 4.4.1. DAMASCENE GROWTH DRIVERS
- 4.4.2. DAMASCENE CU PLATING REVENUES
- 4.4.3. DAMASCENE ADDITIVE VOLUMES

5. TECHNICAL TRENDS

5.1. PACKAGING TECH TRENDS
- 5.1.1. PACKAGING TECHNICAL CHALLENGES
5.2. TECH TRENDS
- 5.2.1. MARKET DRIVES TECHNOLOGY TRENDS
- 5.2.2. ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION
  - 5.2.2.1. TRENDS-MOL AND BEOL IRDS ROADMAP
- 5.2.3. CU DAMASCENE QUALIFICATION REQUIREMENTS
- 5.2.4. LOGIC METALLIZATION ROADMAP
  - 5.2.4.1. INTERCONNECT FOR ADVANCED LOGIC
- 5.2.5. ADV LOGIC BURIED POWER RAIL
- 5.2.6. TECHNOLOGY ROADMAP: DRAM WITH MO OR RU
  - 5.2.6.1. GENERAL PROCESS FLOW ADVANCED DRAM
- 5.2.7. PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU
  - 5.2.7.1. 3D-NAND GENERATIONS 2020-2025
- 5.2.8. EXAMPLE OF LOGIC PRO CESS FLOW 20 NM TO 32 NM LOGIC PVD
- 5.2.8. TECHNICAL REQUIREMENTS SUMMARY 1/2
  - 5.2.8.1. TECHNICAL REQUIREMENTS SUMMARY 2/2

6. COMPETITIVE LANDSCAPE

6.1. TOTAL ADVANCED PACKAGING AND DAMASCENE MARKET SHARES
6.2. OEM MARKET SHARE-PLATING EQUIPMENT
6.3. MARKET SHARE BY APPLICATION-CU PLATING FOR ADVANCED PACKAGING
6.4. REGIONAL PLAYERS AND OTHERS
6.5. M&A ACTIVITY

7. ANALYST ASSESSMENT

7.1. ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT

8. SUPPLIER PROFILES

BASF
DUPONT
CHANG CHUN GROUP
INCHEON CHEMICAL COMPANY
ISHIHARA CHEMICAL/UNICON
JX NIPPON MINING AND METALS
AND MORE...

9. APPENDIX A: PACKAGING TECH TRENDS

LIST OF FIGURES

FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M'S)
FIGURE 2: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST
FIGURE 4: COPPER PLATING CHEMICALS REVENUES ($M'S) FOR ADVANCED PACKAGING & FE/DAMASCENE
FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED PACKAGING AND SEMICONDUCTOR DEVICE MFG. 2022
FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2021)
FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 8: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX*
FIGURE 9: 2022 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
FIGURE 11: SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES
FIGURE 13: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3
FIGURE 14: GLOBAL EV TRENDS
FIGURE 15: SEMICONDUCTOR SPEND PER VEHICLE TYPE
FIGURE 16: TSMC CONSTRUCTION SITE IN ARIZONA
FIGURE 17: CHIP EXPANSIONS 2021-2026 > US$460 B
FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 19: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS
FIGURE 20: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP
FIGURE 21: EUROPE CHIP EXPANSION UPSIDE
FIGURE 22: TECHCET WAFER START FORECAST BY NODE
FIGURE 23: TECHCET MATERIALS FORECAST
FIGURE 24: PACKAGING METALLIZATION APPLICATIONS
FIGURE 25: USE OF SILICON INTERPOSER
FIGURE 26: VERSIONS OF TSV & PROCESS FLOW EXAMPLE
FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M'S)
FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST
FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
FIGURE 30: CU PLATING ADVANCED PACKAGING REVENUE FORECAST ESTIMATES
FIGURE 31: CU PILLAR & CU RDL SEGMENTED FORECAST
FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST
FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES VOLUME DEMAND FORECAST
FIGURE 34: MATERIALS STACK USING CU PILLAR (< 40 UM PITCH)
FIGURE 35: SN AND SNAG PLATING REVENUE
FIGURE 36: NICKEL PLATING REVENUE
FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST
FIGURE 38: ADV LOGIC METAL PLATING WAFER PASSES
FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES
FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND FORECAST ESTIMATES
FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL VOLUME DEMAND FORECAST
FIGURE 42: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 43: CHALLENGES OF ELECTROPLATING VIA FILL
FIGURE 44: METAL LEVELS PER LOGIC NODE
FIGURE 45: INTERCONNECT METAL COMPARISON BY RESISTIVITY
FIGURE 46: CU DAMASCENE QUALIFICATION
FIGURE 47: LEADING EDGE LOGIC POWER RAIL SCHEMES
FIGURE 48: DRAM STRUCTURE
FIGURE 49: 3D NAND STRUCTURE
FIGURE 50: TOTAL PLATING FOR ADV. PACKAGING AND SEMICONDUCTOR DEVICE MANUFACTURING 2022
FIGURE 51: PLATING EQUIPMENT OEM MARKET SHARES 2020%
FIGURE 52: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND ADVANCED PACKAGING APPLICATIONS
FIGURE 53: CLEANING COMPLEXITY
FIGURE 54: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND
FIGURE 55: WAFER LEVEL PLATING
FIGURE 56: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS.
FIGURE 57: COMPARISON WITH DAMASCENE-TYPE RDL
FIGURE 58: USE OF SILICON INTERPOSER
FIGURE 59: APPLE EXAMPLE INTERPOSERS
FIGURE 60: TSV PROCESS FLOW EXAMPLE

LIST OF TABLES

TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
TABLE 2: IMF ECONOMIC OUTLOOK*
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES FORECAST 2021
TABLE 4: IRDS 2022 LOGIC CORE INTERCONNECT ROADMAP
TABLE 5: LOGIC DEVICE ROADMAP FOR METALS
TABLE 6: METALS REQUIRED FOR DEVICE FEATURES
TABLE 7: DRAM USE OF MO OR RU PRESENT & FUTURE
TABLE 8: GENERAL PROCESS FLOW ADVANCED DRAM
TABLE 9: 3D NAND MATERIAL CHANGES PRESENT & FUTURE
TABLE 10: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 3DNAND
TABLE 11: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD
TABLE 12: TECHNICAL REQUIREMENTS SUMMARY 1/2
TABLE 13: TECHNICAL REQUIREMENTS SUMMARY 2/2
TABLE 14: REGIONAL PLAYERS-MARKET LEADER AND "OTHERS"
TABLE 15: CU PACKAGING APPLICATIONS AND REQUIREMENTS