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PUBLISHER: TrendForce | PRODUCT CODE: 2026997
PUBLISHER: TrendForce | PRODUCT CODE: 2026997
2026 Outlook: NVIDIA Rubin Drives New Wave of AI Hardware Upgrades
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PAGES: 31 Pages
DELIVERY TIME: 1-2 business days
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As data centers adopt HVDC architectures to reduce grid-to-chip power losses, demand for advanced power conversion and next-gen semiconductors surges. Meanwhile, Asian manufacturers continue to dominate the PCB and specialized substrate supply chains.
Key Highlights
- PCB Supply: Asian firms lead from raw materials to advanced substrates.
- Materials: Glass fibers are tailored for either signal transmission or stability.
- Efficiency: High-voltage designs minimize massive power step-down losses.
- Power Tech: Demand rises for advanced power conversion and backup systems.
- Semiconductors: Next-gen, low-loss semiconductors highly benefit from this shift.
Product Code: TRi-175
Table of Contents
- 1. Rubin Generation Marks a Major Step Change, Reshaping the AI Hardware Stack
- 2. Surging Power Consumption in AI Servers Makes Liquid Cooling a Standard Configuration
- 3. Rising Rack Power Density Drives Power Architecture Upgrades
- 4. PCBs Undergo Major Design Transformation to Meet Signal Integrity and Space Constraints
- 5. Physical Limits of Coopper—Distance and Signal Loss—Accelerate the Shift to Optical Interconnects
- 6. TRI’s View
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