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PUBLISHER: TrendForce | PRODUCT CODE: 2026998
PUBLISHER: TrendForce | PRODUCT CODE: 2026998
SiC/GaN Power Semiconductors Break "AI Power Wall," Reshaping Data Center Power Supply
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PAGES: 17 Pages
DELIVERY TIME: 1-2 business days
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In 2026, power semiconductors have evolved from conventional components into strategic enablers reshaping the global energy landscape. SiC and GaN technologies are entering a phase of large-scale deployment across global infrastructure as AI data centers confront the “power wall” bottleneck and EVs accelerate the adoption of 800V high-voltage architectures.
Key Highlights
- Power semiconductors have transformed from conventional components into strategic enablers reshaping the global energy landscape.
- SiC and GaN technologies are entering large-scale deployment phase across global infrastructure.
- AI data centers are confronting the "power wall" bottleneck, driving demand for advanced power solutions.
- Electric vehicles are accelerating adoption of high-voltage architectures, further boosting power semiconductor requirements.
- The convergence of AI infrastructure needs and EV technological advancement is creating unprecedented demand for next-generation power semiconductor technologies.
Product Code: TRi-176
Table of Contents
1. SiC/GaN Evolves from Emerging Technology to Standard Infrastructure for Green Energy and AI Ecosystems
- Figure 1: Four transformation pathways and the core competitiveness of SiC/GaN
- Figure 2: Clear division of roles for third-gen semiconductors in AIDC: SiC anchors infrastructure, while GaN targets end-point power conversion
- Figure 3: SiC as a key enabler in reducing data center OpEx and energy loss
- Figure 4: Energy efficiency and conversion performance of GaN in power supply units (PSU)
- Figure 5: Global automaker adoption roadmap for SiC technologies
2. VIS expands GaN-on-Si product portfolio, opening a new front in power semiconductors
3. Innoscience enters Tier 1, reshaping the AI power supply chain landscape
4. STMicroelectronics accelerates market penetration with a “SiC foundation + GaN expansion” strategy
5. TI builds the core of AI-era power management with an integrated GaN architecture
6. ROHM builds a global power electronics defense line through in-house GaN production and “Make in India” collaboration
7. Infineon drives the high-efficiency power revolution with a “SiC core, GaN expansion” strategy
8. TRI’s View
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