PUBLISHER: TechSci Research | PRODUCT CODE: 1383844
PUBLISHER: TechSci Research | PRODUCT CODE: 1383844
We offer 8 hour analyst time for an additional research. Please contact us for the details.
Global System on Chip Market has valued at USD 124 Billion in 2022 and is anticipated to project robust growth in the forecast period with a CAGR of 8.1% through 2028. The Global System on Chip (SoC) market is experiencing robust growth, driven by the ever-increasing demand for advanced electronic devices across a wide spectrum of industries. SoCs, which integrate multiple electronic components onto a single chip, have emerged as a cornerstone technology for powering smartphones, tablets, IoT devices, automotive systems, and more. This market's growth is propelled by several key factors. Firstly, the rapid proliferation of 5G technology has created a need for more powerful and efficient SoCs to support enhanced connectivity and data processing capabilities. Secondly, the Internet of Things (IoT) continues to expand, with SoCs at its core, facilitating smart home appliances, wearables, and industrial automation. Additionally, the automotive industry's transition to electric and autonomous vehicles relies heavily on SoCs for advanced driver-assistance systems and in-vehicle infotainment. As a result, leading semiconductor manufacturers are fiercely competing to innovate and meet the escalating demands of this dynamic market, with a focus on power efficiency, performance, and integration to maintain their competitive edge. The global SoC market is poised for sustained growth, offering lucrative opportunities for companies across the semiconductor ecosystem.
Market Overview | |
---|---|
Forecast Period | 2024-2028 |
Market Size 2022 | USD 124 Billion |
Market Size 2028 | USD 199.65 Billion |
CAGR 2023-2028 | 8.1% |
Fastest Growing Segment | Digital Signal |
Largest Market | Asia Pacific |
In this report, the Global System on Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below: