Semiconductor Manufacturing Equipment Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Equipment Type, By Dimension, By Supply Chain Process, By Region & Competition, 2021-2031F

Description

The Global Semiconductor Manufacturing Equipment Market is projected to expand from USD 119.43 Billion in 2025 to USD 184.01 Billion by 2031, registering a compound annual growth rate of 7.47%. This sector includes the specialized tools and machinery required for the fabrication, assembly, packaging, and testing of microchips and integrated circuits. Market growth is primarily underpinned by the intensifying demand for artificial intelligence infrastructure, automotive electronics, and high-performance computing, all of which necessitate the large-scale production of advanced memory and logic devices. According to SEMI forecasts, total global sales of semiconductor manufacturing equipment are expected to hit a record $133 billion in 2025, marking a 13.7% increase compared to the previous year.

Market Overview
Forecast Period	2027-2031
Market Size 2025	USD 119.43 Billion
Market Size 2031	USD 184.01 Billion
CAGR 2026-2031	7.47%
Fastest Growing Segment	Wafer Manufacturing Equipment
Largest Market	North America

Despite these favorable growth prospects, the industry confronts significant hurdles stemming from geopolitical tensions and shifting trade regulations. Heightened export controls and restrictions on cross-border technology transfers are generating considerable supply chain difficulties and limiting market access for manufacturers. These regulatory barriers force companies to reorganize their operational strategies and threaten the smooth global distribution of essential manufacturing technologies, thereby hindering broader market expansion.

Market Driver

The escalating demand for High-Bandwidth Memory (HBM) to sustain generative AI workloads is fundamentally transforming the semiconductor equipment sector. Because AI models demand greater computational density, manufacturers are rapidly scaling up production of advanced memory architectures such as HBM3E, a shift that requires specialized tools for wafer fabrication and advanced packaging. This technological transition is driving significant capital expenditure, particularly for deep silicon etch and hybrid bonding machinery needed for 3D stacking. A November 2024 SEMI report highlights that memory-related capital spending jumped 67% year-on-year in the third quarter of 2024, underscoring the urgency to boost capacity for high-performance components; this investment wave is structurally linked to long-term AI data center infrastructure rather than traditional memory cycles.

Simultaneously, the growth of domestic fab capacity, spurred by the US CHIPS Act and international sovereign incentives, is triggering a substantial surge in equipment procurement. Governments around the globe are subsidizing local manufacturing hubs to reduce geopolitical supply chain risks, prompting foundries and integrated device manufacturers to speed up facility construction. According to a September 2024 report by the Semiconductor Industry Association (SIA), over 90 new manufacturing projects totaling nearly $450 billion in private investments have been announced in the United States since the CHIPS Act's inception. This policy-led expansion extends beyond the West, fueling a global spending race; for example, SEMI reported in September 2024 that China's semiconductor equipment spending hit $25 billion in the first half of 2024, surpassing the combined investments of the United States, South Korea, and Taiwan.

Market Challenge

Geopolitical friction and changing trade regulations constitute a major barrier to the expansion of the global semiconductor manufacturing equipment industry. Rigorous export controls and restrictions on technology transfer limit entry into crucial international markets, effectively shrinking the customer base for advanced fabrication tools. Manufacturers face growing operational complexities as they are forced to realign supply chains to adhere to differing regional policies, resulting in shipment delays and increased logistical expenses. This regulatory fragmentation undermines the efficiency of global distribution networks and restricts companies' ability to fully capitalize on increasing demand within specific economic regions.

The negative financial impact of these current market conditions is evident in recent industry performance metrics. Data from SEMI indicates that worldwide semiconductor equipment billings contracted by 2% year-over-year to $26.4 billion in the first quarter of 2024. This decrease highlights a direct link between intensified trade barriers and the suppression of revenue growth, as manufacturers struggle to sustain sales momentum within a trading environment that is both restricted and politically sensitive.

Market Trends

The widespread adoption of chiplet-based heterogeneous integration is fundamentally altering equipment needs, moving substantial value from front-end fabrication to back-end assembly operations. Because monolithic scaling has become cost-prohibitive for large logic dies, manufacturers are shifting to disaggregated architectures that integrate various functional blocks-such as logic, I/O, and memory-onto advanced interposers. This structural change demands a new category of high-precision bonding and die-attach tools with sub-micron accuracy to guarantee reliable die interconnects. According to an April 2025 SEMI report, global sales of assembly and packaging equipment rose by 25% year-over-year in 2024, a growth rate significantly exceeding other segments that is driven by the growing complexity of packaging multi-die systems for high-performance computing.

Concurrently, the deployment of High-Numerical Aperture (High-NA) EUV lithography systems is creating a new standard for defining angstrom-scale features. By increasing the projection optics' numerical aperture to 0.55, these next-generation machines allow for the printing of 2nm and smaller geometries in a single exposure, removing the need for expensive and slow multi-patterning techniques. However, this technological advancement requires massive capital investment and significant modifications to fab infrastructure to handle the equipment's larger size. A May 2025 CNBC report notes that the cost of a single High-NA EUV system is approximately $400 million, with ASML planning to deliver at least five such units in 2025 to support the development roadmaps of leading-edge logic foundries.

Key Market Players

Applied Materials, Inc.
Lam Research Corporation
ASML Holding N.V.
KLA Corporation
Tokyo Electron Limited
Advantest Corporation
SCREEN Semiconductor Solutions Co., Ltd.
Nikon Corporation
Ushio Inc.
Hitachi High-Tech Corporation

Report Scope

In this report, the Global Semiconductor Manufacturing Equipment Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Semiconductor Manufacturing Equipment Market, By Equipment Type

Front-end Equipment
Back-end Equipment

Semiconductor Manufacturing Equipment Market, By Dimension

2D
2.5D
3D

Semiconductor Manufacturing Equipment Market, By Supply Chain Process

Outsourced Semiconductor Assembly and Test (OSAT)
Integrated Device Manufacturer (IDM)
Foundry

Semiconductor Manufacturing Equipment Market, By Region

North America
- United States
- Canada
- Mexico
Europe
- France
- United Kingdom
- Italy
- Germany
- Spain
Asia Pacific
- China
- India
- Japan
- Australia
- South Korea
South America
- Brazil
- Argentina
- Colombia
Middle East & Africa
- South Africa
- Saudi Arabia
- UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Semiconductor Manufacturing Equipment Market.

Available Customizations:

Global Semiconductor Manufacturing Equipment Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

1. Product Overview

1.1. Market Definition
1.2. Scope of the Market
- 1.2.1. Markets Covered
- 1.2.2. Years Considered for Study
- 1.2.3. Key Market Segmentations

2. Research Methodology

2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations

3. Executive Summary

3.1. Overview of the Market
3.2. Overview of Key Market Segmentations
3.3. Overview of Key Market Players
3.4. Overview of Key Regions/Countries
3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Semiconductor Manufacturing Equipment Market Outlook

5.1. Market Size & Forecast
- 5.1.1. By Value
5.2. Market Share & Forecast
- 5.2.1. By Equipment Type (Front-end Equipment (Lithography Equipment, Etching Equipment, Deposition Equipment, Metrology/Inspection Equipment, Material Removal/Cleaning Equipment, Photoresist Processing Equipment), Back-end Equipment (Wafer Manufacturing Equipment, Assembly & Packaging Equipment, Test Equipment))
- 5.2.2. By Dimension (2D, 2.5D, 3D)
- 5.2.3. By Supply Chain Process (Outsourced Semiconductor Assembly and Test (OSAT), Integrated Device Manufacturer (IDM), Foundry)
- 5.2.4. By Region
- 5.2.5. By Company (2025)
5.3. Market Map

6. North America Semiconductor Manufacturing Equipment Market Outlook

6.1. Market Size & Forecast
- 6.1.1. By Value
6.2. Market Share & Forecast
- 6.2.1. By Equipment Type
- 6.2.2. By Dimension
- 6.2.3. By Supply Chain Process
- 6.2.4. By Country
6.3. North America: Country Analysis
- 6.3.1. United States Semiconductor Manufacturing Equipment Market Outlook
  - 6.3.1.1. Market Size & Forecast
    - 6.3.1.1.1. By Value
  - 6.3.1.2. Market Share & Forecast
    - 6.3.1.2.1. By Equipment Type
    - 6.3.1.2.2. By Dimension
    - 6.3.1.2.3. By Supply Chain Process
- 6.3.2. Canada Semiconductor Manufacturing Equipment Market Outlook
  - 6.3.2.1. Market Size & Forecast
    - 6.3.2.1.1. By Value
  - 6.3.2.2. Market Share & Forecast
    - 6.3.2.2.1. By Equipment Type
    - 6.3.2.2.2. By Dimension
    - 6.3.2.2.3. By Supply Chain Process
- 6.3.3. Mexico Semiconductor Manufacturing Equipment Market Outlook
  - 6.3.3.1. Market Size & Forecast
    - 6.3.3.1.1. By Value
  - 6.3.3.2. Market Share & Forecast
    - 6.3.3.2.1. By Equipment Type
    - 6.3.3.2.2. By Dimension
    - 6.3.3.2.3. By Supply Chain Process

7. Europe Semiconductor Manufacturing Equipment Market Outlook

7.1. Market Size & Forecast
- 7.1.1. By Value
7.2. Market Share & Forecast
- 7.2.1. By Equipment Type
- 7.2.2. By Dimension
- 7.2.3. By Supply Chain Process
- 7.2.4. By Country
7.3. Europe: Country Analysis
- 7.3.1. Germany Semiconductor Manufacturing Equipment Market Outlook
  - 7.3.1.1. Market Size & Forecast
    - 7.3.1.1.1. By Value
  - 7.3.1.2. Market Share & Forecast
    - 7.3.1.2.1. By Equipment Type
    - 7.3.1.2.2. By Dimension
    - 7.3.1.2.3. By Supply Chain Process
- 7.3.2. France Semiconductor Manufacturing Equipment Market Outlook
  - 7.3.2.1. Market Size & Forecast
    - 7.3.2.1.1. By Value
  - 7.3.2.2. Market Share & Forecast
    - 7.3.2.2.1. By Equipment Type
    - 7.3.2.2.2. By Dimension
    - 7.3.2.2.3. By Supply Chain Process
- 7.3.3. United Kingdom Semiconductor Manufacturing Equipment Market Outlook
  - 7.3.3.1. Market Size & Forecast
    - 7.3.3.1.1. By Value
  - 7.3.3.2. Market Share & Forecast
    - 7.3.3.2.1. By Equipment Type
    - 7.3.3.2.2. By Dimension
    - 7.3.3.2.3. By Supply Chain Process
- 7.3.4. Italy Semiconductor Manufacturing Equipment Market Outlook
  - 7.3.4.1. Market Size & Forecast
    - 7.3.4.1.1. By Value
  - 7.3.4.2. Market Share & Forecast
    - 7.3.4.2.1. By Equipment Type
    - 7.3.4.2.2. By Dimension
    - 7.3.4.2.3. By Supply Chain Process
- 7.3.5. Spain Semiconductor Manufacturing Equipment Market Outlook
  - 7.3.5.1. Market Size & Forecast
    - 7.3.5.1.1. By Value
  - 7.3.5.2. Market Share & Forecast
    - 7.3.5.2.1. By Equipment Type
    - 7.3.5.2.2. By Dimension
    - 7.3.5.2.3. By Supply Chain Process

8. Asia Pacific Semiconductor Manufacturing Equipment Market Outlook

8.1. Market Size & Forecast
- 8.1.1. By Value
8.2. Market Share & Forecast
- 8.2.1. By Equipment Type
- 8.2.2. By Dimension
- 8.2.3. By Supply Chain Process
- 8.2.4. By Country
8.3. Asia Pacific: Country Analysis
- 8.3.1. China Semiconductor Manufacturing Equipment Market Outlook
  - 8.3.1.1. Market Size & Forecast
    - 8.3.1.1.1. By Value
  - 8.3.1.2. Market Share & Forecast
    - 8.3.1.2.1. By Equipment Type
    - 8.3.1.2.2. By Dimension
    - 8.3.1.2.3. By Supply Chain Process
- 8.3.2. India Semiconductor Manufacturing Equipment Market Outlook
  - 8.3.2.1. Market Size & Forecast
    - 8.3.2.1.1. By Value
  - 8.3.2.2. Market Share & Forecast
    - 8.3.2.2.1. By Equipment Type
    - 8.3.2.2.2. By Dimension
    - 8.3.2.2.3. By Supply Chain Process
- 8.3.3. Japan Semiconductor Manufacturing Equipment Market Outlook
  - 8.3.3.1. Market Size & Forecast
    - 8.3.3.1.1. By Value
  - 8.3.3.2. Market Share & Forecast
    - 8.3.3.2.1. By Equipment Type
    - 8.3.3.2.2. By Dimension
    - 8.3.3.2.3. By Supply Chain Process
- 8.3.4. South Korea Semiconductor Manufacturing Equipment Market Outlook
  - 8.3.4.1. Market Size & Forecast
    - 8.3.4.1.1. By Value
  - 8.3.4.2. Market Share & Forecast
    - 8.3.4.2.1. By Equipment Type
    - 8.3.4.2.2. By Dimension
    - 8.3.4.2.3. By Supply Chain Process
- 8.3.5. Australia Semiconductor Manufacturing Equipment Market Outlook
  - 8.3.5.1. Market Size & Forecast
    - 8.3.5.1.1. By Value
  - 8.3.5.2. Market Share & Forecast
    - 8.3.5.2.1. By Equipment Type
    - 8.3.5.2.2. By Dimension
    - 8.3.5.2.3. By Supply Chain Process

9. Middle East & Africa Semiconductor Manufacturing Equipment Market Outlook

9.1. Market Size & Forecast
- 9.1.1. By Value
9.2. Market Share & Forecast
- 9.2.1. By Equipment Type
- 9.2.2. By Dimension
- 9.2.3. By Supply Chain Process
- 9.2.4. By Country
9.3. Middle East & Africa: Country Analysis
- 9.3.1. Saudi Arabia Semiconductor Manufacturing Equipment Market Outlook
  - 9.3.1.1. Market Size & Forecast
    - 9.3.1.1.1. By Value
  - 9.3.1.2. Market Share & Forecast
    - 9.3.1.2.1. By Equipment Type
    - 9.3.1.2.2. By Dimension
    - 9.3.1.2.3. By Supply Chain Process
- 9.3.2. UAE Semiconductor Manufacturing Equipment Market Outlook
  - 9.3.2.1. Market Size & Forecast
    - 9.3.2.1.1. By Value
  - 9.3.2.2. Market Share & Forecast
    - 9.3.2.2.1. By Equipment Type
    - 9.3.2.2.2. By Dimension
    - 9.3.2.2.3. By Supply Chain Process
- 9.3.3. South Africa Semiconductor Manufacturing Equipment Market Outlook
  - 9.3.3.1. Market Size & Forecast
    - 9.3.3.1.1. By Value
  - 9.3.3.2. Market Share & Forecast
    - 9.3.3.2.1. By Equipment Type
    - 9.3.3.2.2. By Dimension
    - 9.3.3.2.3. By Supply Chain Process

10. South America Semiconductor Manufacturing Equipment Market Outlook

10.1. Market Size & Forecast
- 10.1.1. By Value
10.2. Market Share & Forecast
- 10.2.1. By Equipment Type
- 10.2.2. By Dimension
- 10.2.3. By Supply Chain Process
- 10.2.4. By Country
10.3. South America: Country Analysis
- 10.3.1. Brazil Semiconductor Manufacturing Equipment Market Outlook
  - 10.3.1.1. Market Size & Forecast
    - 10.3.1.1.1. By Value
  - 10.3.1.2. Market Share & Forecast
    - 10.3.1.2.1. By Equipment Type
    - 10.3.1.2.2. By Dimension
    - 10.3.1.2.3. By Supply Chain Process
- 10.3.2. Colombia Semiconductor Manufacturing Equipment Market Outlook
  - 10.3.2.1. Market Size & Forecast
    - 10.3.2.1.1. By Value
  - 10.3.2.2. Market Share & Forecast
    - 10.3.2.2.1. By Equipment Type
    - 10.3.2.2.2. By Dimension
    - 10.3.2.2.3. By Supply Chain Process
- 10.3.3. Argentina Semiconductor Manufacturing Equipment Market Outlook
  - 10.3.3.1. Market Size & Forecast
    - 10.3.3.1.1. By Value
  - 10.3.3.2. Market Share & Forecast
    - 10.3.3.2.1. By Equipment Type
    - 10.3.3.2.2. By Dimension
    - 10.3.3.2.3. By Supply Chain Process

11. Market Dynamics

11.1. Drivers
11.2. Challenges

12. Market Trends & Developments

12.1. Merger & Acquisition (If Any)
12.2. Product Launches (If Any)
12.3. Recent Developments

13. Global Semiconductor Manufacturing Equipment Market: SWOT Analysis

14. Porter's Five Forces Analysis

14.1. Competition in the Industry
14.2. Potential of New Entrants
14.3. Power of Suppliers
14.4. Power of Customers
14.5. Threat of Substitute Products

15. Competitive Landscape

15.1. Applied Materials, Inc.
- 15.1.1. Business Overview
- 15.1.2. Products & Services
- 15.1.3. Recent Developments
- 15.1.4. Key Personnel
- 15.1.5. SWOT Analysis
15.2. Lam Research Corporation
15.3. ASML Holding N.V.
15.4. KLA Corporation
15.5. Tokyo Electron Limited
15.6. Advantest Corporation
15.7. SCREEN Semiconductor Solutions Co., Ltd.
15.8. Nikon Corporation
15.9. Ushio Inc.
15.10. Hitachi High-Tech Corporation