Global Radiation Hardened Electronics Market Report

Description

List of Tables

The global demand for Radiation Hardened Electronics Market is presumed to reach the market size of nearly USD 3.69 MN by 2030 from USD 2.5 MN in 2022 with a CAGR of 5% under the study period 2023 - 2030.

Radiation hardened electronics refers to electronic components. It consists of circuits, resistors, transistors, capacitors, diodes, single-board computer CPUs, packages, and products primarily used in industries to protect devices from extremely high radiation exposure. The radiation hardened electronics play a crucial role in protecting electronic equipment from physical damage and failure caused by harmful radiation in outer space. They are designed to withstand radiation and extreme temperatures ranging from -55°C to 125°C.

MARKET DYNAMICS:

The market for radiation hardened electronics is driven by growing demand for communication satellites and increasing surveillance. The increasing number of commercial space programs and growing adoption of electronics radiation exposure systems are other major factors contributing to market growth. Moreover, increased demand for radiation-hardened electronics used in satellites has been driven by rising space exploration programmes and long-distance communication. Other major factors fuelling market growth are various technological advancements, such as developing highly reliable integrated circuits and improving field-programmable gate array (FPGA) technology, which will boost the market. However, the high maintenance cost of radiation hardened electronics may hamper its market growth during the assessment period.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of radiation hardened electronics. The growth and trends of radiation hardened electronics industry provide a holistic approach to this study.

MARKET SEGMENTATION:

This section of the radiation hardened electronics market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Component

Mixed Signal ICs
Processors & Controllers
Memory
Power Management

By Manufacturing Technique

Radiation-Hardening by Design (RHBD)
Radiation-Hardening by Process (RHBP)

By Product Type

Commercial-off-the-Shelf (COTS)
Custom Made

By Application

Space
Aerospace & Defense
Nuclear Power Plant
Medical
Others

REGIONAL ANALYSIS:

This section covers the regional outlook, which accentuates current and future demand for the Radiation Hardened Electronics market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the radiation hardened electronics market include Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

Product Code: VMR11218590

1 . PREFACE

1.1. Report Description
- 1.1.1. Objective
- 1.1.2. Target Audience
- 1.1.3. Unique Selling Proposition (USP) & offerings
1.2. Research Scope
1.3. Research Methodology
- 1.3.1. Market Research Process
- 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

2.1. Highlights of Market
2.2. Global Market Snapshot

3 . RADIATION HARDENED ELECTRONICS - INDUSTRY ANALYSIS

3.1. Introduction - Market Dynamics
3.2. Market Drivers
3.3. Market Restraints
3.4. Opportunities
3.5. Industry Trends
3.6. Porter's Five Force Analysis
3.7. Market Attractiveness Analysis
- 3.7.1 Market Attractiveness Analysis By Component
- 3.7.2 Market Attractiveness Analysis By Manufacturing Technique
- 3.7.3 Market Attractiveness Analysis By Product Type
- 3.7.4 Market Attractiveness Analysis By Application
- 3.7.5 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

4.1. Value Chain Analysis
4.2. Raw Material Analysis
- 4.2.1. List of Raw Materials
- 4.2.2. Raw Material Manufactures List
- 4.2.3. Price Trend of Key Raw Materials
4.3. List of Potential Buyers
4.4. Marketing Channel
- 4.4.1. Direct Marketing
- 4.4.2. Indirect Marketing
- 4.4.3. Marketing Channel Development Trend

5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK

6 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY COMPONENT

6.1 Overview by Component
6.2 Historical and Forecast Data
6.3 Analysis by Component
6.4 Mixed Signal ICs Historic and Forecast Sales by Regions
6.5 Processors & Controllers Historic and Forecast Sales by Regions
6.6 Memory Historic and Forecast Sales by Regions
6.7 Power Management Historic and Forecast Sales by Regions

7 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY MANUFACTURING TECHNIQUE

7.1 Overview by Manufacturing Technique
7.2 Historical and Forecast Data
7.3 Analysis by Manufacturing Technique
7.4 Radiation-Hardening Design (RHBD) Historic and Forecast Sales by Regions
7.5 Radiation-Hardening Process (RHBP) Historic and Forecast Sales by Regions

8 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY PRODUCT TYPE

8.1 Overview by Product Type
8.2 Historical and Forecast Data
8.3 Analysis by Product Type
8.4 Commercial-off-the-Shelf (COTS) Historic and Forecast Sales by Regions
8.5 Custom Made Historic and Forecast Sales by Regions

9 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY APPLICATION

9.1 Overview by Application
9.2 Historical and Forecast Data
9.3 Analysis by Application
9.4 Space Historic and Forecast Sales by Regions
9.5 Aerospace & Defense Historic and Forecast Sales by Regions
9.6 Nuclear Power Plant Historic and Forecast Sales by Regions
9.7 Medical Historic and Forecast Sales by Regions
9.8 Others Historic and Forecast Sales by Regions

10 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY GEOGRAPHY

10.1. Regional Outlook
10.2. Introduction
10.3. North America Sales Analysis
- 10.3.1. Overview, Historic and Forecast Sales Analysis
- 10.3.2. North America By Segment Sales Analysis
- 10.3.3. North America By Country Sales Analysis
- 10.3.4. United State Sales Analysis
- 10.3.5. Canada Sales Analysis
- 10.3.6. Mexico Sales Analysis
10.4. Europe Sales Analysis
- 10.4.1. Overview, Historic and Forecast Sales Analysis
- 10.4.2. Europe by Segment Sales Analysis
- 10.4.3. Europe by Country Sales Analysis
- 10.4.4. United Kingdom Sales Analysis
- 10.4.5. France Sales Analysis
- 10.4.6. Germany Sales Analysis
- 10.4.7. Italy Sales Analysis
- 10.4.8. Russia Sales Analysis
- 10.4.9. Rest Of Europe Sales Analysis
10.5. Asia Pacific Sales Analysis
- 10.5.1. Overview, Historic and Forecast Sales Analysis
- 10.5.2. Asia Pacific by Segment Sales Analysis
- 10.5.3. Asia Pacific by Country Sales Analysis
- 10.5.4. China Sales Analysis
- 10.5.5. India Sales Analysis
- 10.5.6. Japan Sales Analysis
- 10.5.7. South Korea Sales Analysis
- 10.5.8. Australia Sales Analysis
- 10.5.9. Rest Of Asia Pacific Sales Analysis
10.6. Latin America Sales Analysis
- 10.6.1. Overview, Historic and Forecast Sales Analysis
- 10.6.2. Latin America by Segment Sales Analysis
- 10.6.3. Latin America by Country Sales Analysis
- 10.6.4. Brazil Sales Analysis
- 10.6.5. Argentina Sales Analysis
- 10.6.6. Peru Sales Analysis
- 10.6.7. Chile Sales Analysis
- 10.6.8. Rest of Latin America Sales Analysis
10.7. Middle East & Africa Sales Analysis
- 10.7.1. Overview, Historic and Forecast Sales Analysis
- 10.7.2. Middle East & Africa by Segment Sales Analysis
- 10.7.3. Middle East & Africa by Country Sales Analysis
- 10.7.4. Saudi Arabia Sales Analysis
- 10.7.5. UAE Sales Analysis
- 10.7.6. Israel Sales Analysis
- 10.7.7. South Africa Sales Analysis
- 10.7.8. Rest Of Middle East And Africa Sales Analysis

11 . COMPETITIVE LANDSCAPE OF THE RADIATION HARDENED ELECTRONICS COMPANIES

11.1. Radiation Hardened Electronics Market Competition
11.2. Partnership/Collaboration/Agreement
11.3. Merger And Acquisitions
11.4. New Product Launch
11.5. Other Developments

12 . COMPANY PROFILES OF RADIATION HARDENED ELECTRONICS INDUSTRY

12.1. Top Company Share Analysis
12.2. Market Concentration Rate
12.3. Microchip Technology Inc. (US)
- 12.3.1. Company Overview
- 12.3.2. Company Revenue
- 12.3.3. Products
- 12.3.4. Recent Developments
12.4. BAE Systems (UK)
- 12.4.1. Company Overview
- 12.4.2. Company Revenue
- 12.4.3. Products
- 12.4.4. Recent Developments
12.5. Renesas Electronics Corporation (Japan)
- 12.5.1. Company Overview
- 12.5.2. Company Revenue
- 12.5.3. Products
- 12.5.4. Recent Developments
12.6. Infineon Technologies AG (Germany)
- 12.6.1. Company Overview
- 12.6.2. Company Revenue
- 12.6.3. Products
- 12.6.4. Recent Developments
12.7. STMicroelectronics (Switzerland)
- 12.7.1. Company Overview
- 12.7.2. Company Revenue
- 12.7.3. Products
- 12.7.4. Recent Developments
12.8. Xilinx Inc. (US)
- 12.8.1. Company Overview
- 12.8.2. Company Revenue
- 12.8.3. Products
- 12.8.4. Recent Developments
12.9. Texas Instruments Incorporated (US)
- 12.9.1. Company Overview
- 12.9.2. Company Revenue
- 12.9.3. Products
- 12.9.4. Recent Developments
12.10. Honeywell International Inc. (US)
- 12.10.1. Company Overview
- 12.10.2. Company Revenue
- 12.10.3. Products
- 12.10.4. Recent Developments
12.11. Teledyne Technologies Inc. (US)
- 12.11.1. Company Overview
- 12.11.2. Company Revenue
- 12.11.3. Products
- 12.11.4. Recent Developments
12.12. TTM Technologies Inc. (US).
- 12.12.1. Company Overview
- 12.12.2. Company Revenue
- 12.12.3. Products
- 12.12.4. Recent Developments

Note - in company profiling, financial details and recent development are subject to availability or might not be covered in case of private companies