Cellular and LPWA IoT Device Ecosystems - 9th Edition

Table of Contents

Table of Contents

List of Figures

Executive Summary

1. Wide Area Networks for the Internet of Things

• 1.1. Which things will be connected to wide area networks?
  • 1.1.1. Utility meters
  • 1.1.2. Motor vehicles
  • 1.1.3. Buildings
  • 1.1.4. Asset tracking and supply chain visibility
  • 1.1.5. The opportunity to create smarter and safer cities
  • 1.1.6. The convergence of IoT and AI
• 1.2. What are the technology options?
  • 1.2.1. Network deployment models
  • 1.2.2. Licensed and unlicensed frequency bands
  • 1.2.3. Cost comparison for cellular and LPWA technologies
• 1.3. Which are the leading technology ecosystems?

2. 3GPP Ecosystem

• 2.1. Technology characteristics
  • 2.1.1. 3GPP Release 13-Introducing LTE-M and NB-IoT
  • 2.1.2. 3GPP Release 14-IoT enhancements and C-V2X
  • 2.1.3. 3GPP Release 15-The first phase of 5G specifications
  • 2.1.4. 3GPP Release 16-URLLC enhancements, IIoT features and 5G NR C-V2X
  • 2.1.5. 3GPP Release 17-RedCap and non-terrestrial network communications
  • 2.1.6. 3GPP Release 18-The first 5G-Advanced specifications and eRedCap
  • 2.1.7. Network footprint
  • 2.1.8. 2G/3G mobile networks
  • 2.1.9. 4G mobile networks
  • 2.1.10. 4G/5G mobile IoT networks (LTE-M and NB-IoT)
  • 2.1.11. 5G mobile networks
• 2.2. Semiconductor vendors
  • 2.2.1. ASR Microelectronics
  • 2.2.2. Eigencomm
  • 2.2.3. MediaTek
  • 2.2.4. MLINK
  • 2.2.5. Qualcomm
  • 2.2.6. Samsung Electronics
  • 2.2.7. Sequans Communications
  • 2.2.8. Sony
  • 2.2.9. UNISOC
  • 2.2.10. Xinyi Information Technology
  • 2.2.11. Other semiconductor vendors
• 2.3. Module vendors
  • 2.3.1. Cavli Wireless
  • 2.3.2. China Mobile IoT
  • 2.3.3. Fibocom
  • 2.3.4. Kontron
  • 2.3.5. MeiG Smart Technology
  • 2.3.6. Murata
  • 2.3.7. Neoway
  • 2.3.8. Nordic Semiconductor
  • 2.3.9. Quectel
  • 2.3.10. Rolling Wireless
  • 2.3.11. Semtech
  • 2.3.12. Sunsea AIoT (SIMCom & Longsung)
  • 2.3.13. Telit Cinterion
  • 2.3.14. Trasna
  • 2.3.15. Other cellular IoT module vendors

3. LoRa and LoRaWAN Ecosystem

• 3.1. Technology characteristics
• 3.2. Network footprint
  • 3.2.1. Europe
  • 3.2.2. Asia-Pacific
  • 3.2.3. The Americas
  • 3.2.4. Middle East & Africa
• 3.3. Semiconductor and module vendors
  • 3.3.1. Semtech
  • 3.3.2. Other semiconductor vendors
  • 3.3.3. LoRa module vendors

4. Sigfox Ecosystem

• 4.1. Technology characteristics
• 4.2. Network footprint
  • 4.2.1. Europe
  • 4.2.2. The Americas
  • 4.2.3. Asia-Pacific
  • 4.2.4. Middle East & Africa
  • 4.2.5. UnaBiz partners with the LoRaWAN ecosystem
  • 4.2.6. Examples of major Sigfox use cases
• 4.3. Semiconductor and module vendors
  • 4.3.1. Semiconductor vendors
  • 4.3.2. Sigfox module vendors

5. Emerging LPWA Ecosystems

• 5.1. IEEE 802.15.4
  • 5.1.1. Connectivity stacks based on 802.15.4
  • 5.1.2. Network footprint
• 5.2. Wirepas Mesh
• 5.3. DECT-2020 NR (NR+)
• 5.4. Mioty
• 5.5. Chipset and module vendors

6. Market Forecasts and Trends

• 6.1. Market summary
• 6.2. The cellular IoT device market
  • 6.2.1. Europe
  • 6.2.2. North America
  • 6.2.3. Latin America
  • 6.2.4. China
  • 6.2.5. Rest of Asia-Pacific
  • 6.2.6. Middle East & Africa
• 6.3. The LoRa device market
• 6.4. The Sigfox device market
• 6.5. Emerging LPWA technologies
• List of Acronyms and Abbreviations

List of Figures

• Figure 1.1: Top wide area IoT target segments (2024)
• Figure 1.2: Building stock by category (EU27+3/US 2024)
• Figure 1.3: Unlicensed and reserved radio frequencies available for wireless IoT
• Figure 1.4: Cost comparison for wireless modules (2025)
• Figure 2.1: Comparison of LTE Cat-1, LTE Cat-1 bis, LTE-M and NB-IoT specifications
• Figure 2.2: Comparison of RedCap and eRedCap specifications
• Figure 2.3: Technology positioning of RedCap in relation to eMBB, URLLC and mMTC
• Figure 2.4: IoT solution design options
• Figure 2.5: Cost comparison between module and chipset designs
• Figure 2.6: Routes to market for cellular IoT chipsets
• Figure 2.7: Cellular IoT chipset vendor volume market shares (World 2024)
• Figure 2.8: Business activities of key cellular chipset providers (Q2-2025)
• Figure 2.9: ASR Microelectronics' cellular IoT chipsets (Q2-2025)
• Figure 2.10: Eigencomm's cellular IoT chipsets (Q2-2025)
• Figure 2.11: MediaTek's cellular IoT chipsets (Q2-2025)
• Figure 2.12: MLINK's IoT chipsets (Q2-2025)
• Figure 2.13: Qualcomm's IoT modem chipsets (Q2-2025)
• Figure 2.14: QCT revenues by segment (2022-2024)
• Figure 2.15: Samsung's automotive chip solutions
• Figure 2.16: Sequans' revenues by product segment (2020-2024)
• Figure 2.17: UNISOC's cellular IoT chipsets (Q2-2025)
• Figure 2.18: Xinyi's cellular IoT chipsets (Q2-2025)
• Figure 2.19: Business activities of other cellular chipset providers (Q2-2025)
• Figure 2.20: Top cellular IoT module vendors, by revenues and shipments (World 2024)
• Figure 2.21: Fibocom's embedded wireless IoT modules (Q2-2025)
• Figure 2.22: Fibocom's AI-powered robot solution
• Figure 2.23: MeiG's embedded cellular IoT modules (Q2-2025)
• Figure 2.24: Neoway's revenue by segment (2021-2024)
• Figure 2.25: Neoway's embedded cellular IoT modules (Q2-2025)
• Figure 2.26: Nordic Semiconductor's revenues by segment (2020-2024)
• Figure 2.27: Feature comparison of the nRF91 Series SiPs
• Figure 2.28: Quectel's cellular IoT module series (Q2-2025)
• Figure 2.29: Semtech's embedded cellular module series (Q2-2025)
• Figure 2.30: Semtech's embedded cellular modules (Q2-2025)
• Figure 2.31: Sunsea AIoT's revenue by segment (2021-2024)
• Figure 2.32: Embedded cellular IoT modules from SIMCom and Longsung (Q2-2025)
• Figure 2.33: Overview of the SIMCom AI stack
• Figure 2.34: Telit Cinterion's embedded cellular IoT modules (Q2-2025)
• Figure 2.35: Trasna's embedded cellular IoT modules (Q2-2025)
• Figure 3.1: LoRaWAN network architecture
• Figure 3.2: Public LoRaWAN network operators in Europe (Q1-2025)
• Figure 3.3: Public LoRaWAN network operators in Asia-Pacific (Q1-2025)
• Figure 3.4: Public LoRaWAN network operators in the Americas (Q1-2025)
• Figure 3.5: Amazon Sidewalk network coverage (Q2-2025)
• Figure 3.6: Public LoRaWAN network operators in Middle East & Africa (Q1-2025)
• Figure 3.7: Semtech's LoRa business KPIs (FY-2022-FY-2025)
• Figure 3.8: LoRa module vendors (Q2-2025)
• Figure 4.1: Sigfox network architecture
• Figure 4.2: Sigfox network partners in Europe (Q1-2025)
• Figure 4.3: Sigfox networks in the Americas (Q1-2025)
• Figure 4.4: Sigfox networks in Asia-Pacific and MEA (Q1-2025)
• Figure 4.5: List of Sigfox module vendors by supported regions (Q1-2025)
• Figure 5.1: Major 802.15.4 networking platforms for smart metering (Q1-2025)
• Figure 5.2: Technology positioning for NR+ in relation to eMBB, URLLC and mMTC
• Figure 5.3: The Mioty telegram splitting technology
• Figure 5.4: Members of the Mioty Alliance (Q1-2025)
• Figure 6.1: Cellular/non-3GPP LPWA IoT device shipments by region (World 2023-2029)
• Figure 6.2: Cellular/non-3GPP LPWA IoT device shipments by technology (World 2024)
• Figure 6.3: Cellular IoT module shipments by region and vertical (World 2023-2029)
• Figure 6.4: Cellular IoT module shipment forecast by technology (World 2023-2029)
• Figure 6.5: Cellular IoT module shipment forecast (Europe 2023-2029)
• Figure 6.6: Cellular IoT module shipment forecast (North America 2023-2029)
• Figure 6.7: Cellular IoT module shipment forecast (Latin America 2023-2029)
• Figure 6.8: Cellular IoT module shipment forecast (China 2023-2029)
• Figure 6.9: Cellular IoT module shipment forecast (Rest of Asia-Pacific 2023-2029)
• Figure 6.10: Cellular IoT module shipment forecast (Middle East & Africa 2023-2029)
• Figure 6.11: LoRa device shipments forecast (World 2023-2029)
• Figure 6.12: Sigfox device shipments forecast (World 2023-2029)
• Figure 6.13: 802.15.4 WAN device shipments forecast (World 2023-2029)