The Cellular IoT and LPWA Chipset and Module Market - 10th Edition

Table of Contents

List of Figures

Executive Summary

1 Wide Area Networks for the Internet of Things

• 1.1 Which things will be connected to wide area networks?
  • 1.1.1 Utility meters
  • 1.1.2 Motor vehicles
  • 1.1.3 Buildings
  • 1.1.4 Asset tracking and supply chain visibility
  • 1.1.5 The opportunity to create smarter and safer cities
  • 1.1.6 The convergence of IoT and AI
• 1.2 What are the technology options?
  • 1.2.1 Network deployment models
  • 1.2.2 Licensed and unlicensed frequency bands
  • 1.2.3 Cost comparison for cellular and LPWA technologies
• 1.3 Which are the leading technology ecosystems?
• 2.1 Technology characteristics
  • 2.1.1 3GPP Release 13 (2016) – Introducing LTE-M and NB-IoT
  • 2.1.2 3GPP Release 14 (2017) – IoT enhancements and C-V2X
  • 2.1.3 3GPP Release 15 (2019) – The first phase of 5G specifications
  • 2.1.4 3GPP Release 16 (2020) – URLLC and 5G NR C-V2X
  • 2.1.5 3GPP Release 17 (2022) – RedCap and NTN communications
  • 2.1.6 3GPP Release 18 (2024) – The first 5G-Advanced specifications and eRedCap .
  • 2.1.7 3GPP Release 19 (2025) – Ambient IoT as a new low-power cellular IoT class
• 2.2 Network footprint
  • 2.2.1 2G/3G mobile networks
  • 2.2.2 4G LTE mobile networks
  • 2.2.3 4G/5G mobile IoT networks (LTE-M and NB-IoT)
  • 2.2.4 5G mobile networks
• 2.3 Semiconductor vendors
  • 2.3.1 Altair Semiconductor
  • 2.3.2 ASR Microelectronics
  • 2.3.3 Eigencomm
  • 2.3.4 HiSilicon
  • 2.3.5 MediaTek
  • 2.3.6 MLINK
  • 2.3.7 Qualcomm
  • 2.3.8 Samsung Electronics
  • 2.3.9 Sequans Communications
  • 2.3.10 UNISOC
  • 2.3.11 Xinyi Information Technology
  • 2.3.12 Other semiconductor vendors
• 2.4 Module vendors
  • 2.4.1 Cavli Wireless
  • 2.4.2 China Mobile IoT
  • 2.4.3 Eagle Wireless
  • 2.4.4 Fibocom
  • 2.4.5 Kontron
  • 2.4.6 Lierda
  • 2.4.7 MeiG Smart Technology
  • 2.4.8 Murata
  • 2.4.9 Neoway
  • 2.4.10 Nordic Semiconductor
  • 2.4.11 Quectel
  • 2.4.12 Rolling Wireless
  • 2.4.13 Semtech
  • 2.4.14 Sunsea AIoT (SIMCom & Longsung)
  • 2.4.15 Telit Cinterion
  • 2.4.16 Trasna
  • 2.4.17 ZxInfoTek
  • 2.4.18 Other cellular IoT module vendors

3 LoRa and LoRaWAN Ecosystem

• 3.1 Technology characteristics
• 3.2 Network footprint
  • 3.2.1 Europe
  • 3.2.2 Asia-Pacific
  • 3.2.3 The Americas
  • 3.2.4 Middle East & Africa
• 3.3 Semiconductor and module vendors
  • 3.3.1 Semtech
  • 3.3.2 Other semiconductor vendors
  • 3.3.3 LoRa module vendors

4 Sigfox Ecosystem

• 4.1 Technology characteristics
• 4.2 Network footprint
  • 4.2.1 Europe
  • 4.2.2 The Americas
  • 4.2.3 Asia-Pacific
  • 4.2.4 Middle East & Africa
  • 4.2.5 UnaBiz partners with the LoRaWAN ecosystem
  • 4.2.6 Examples of major Sigfox use cases
• 4.3 Semiconductor and module vendors
  • 4.3.1 Semiconductor vendors
  • 4.3.2 Sigfox module vendors

5 Emerging Low-Power IoT Connectivity Ecosystems

• 5.1 IEEE 802.15.4
  • 5.1.1 Connectivity stacks based on 802.15.4
  • 5.1.2 Network footprint
• 5.2 Wirepas Mesh
• 5.3 DECT-2020 NR (NR+)
• 5.4 Mioty
• 5.5 Chipset and module vendors

6 Market Forecasts and Trends

• 6.1 Market summary
• 6.2 The cellular IoT device market
  • 6.2.1 The cellular IoT chipset market shares
  • 6.2.2 Cellular IoT module market shares
  • 6.2.3 Automotive cellular IoT chipset market shares
  • 6.2.4 NAD module market shares
• 6.3 The cellular IoT technology landscape
• 6.4 Cellular IoT regional market trends
  • 6.4.1 Europe
  • 6.4.2 North America
  • 6.4.3 Latin America
  • 6.4.4 China
  • 6.4.5 Rest of Asia-Pacific
  • 6.4.6 Middle East & Africa
• 6.5 The LoRa device market
• 6.6 The Sigfox device market
• 6.7 Emerging low-power IoT connectivity technologies

List of Acronyms and Abbreviations

List of Figures

• Figure 1.1: Top wide area IoT target segments (2025)
• Figure 1.2: Building stock by category (EU27+3/US 2025)
• Figure 1.3: Unlicensed frequency bands for wireless IoT applications
• Figure 1.4: Cost comparison for wireless modules (2026)
• Figure 2.1: Comparison of LTE Cat-1, LTE Cat-1 bis, LTE-M and NB-IoT specifications
• Figure 2.2: Comparison of RedCap and eRedCap specifications
• Figure 2.3: Technology positioning of RedCap in relation to eMBB, URLLC and mMTC
• Figure 2.4: IoT solution design options
• Figure 2.5: Cost comparison between module and chip-down designs
• Figure 2.6: Routes to market for cellular IoT chipsets
• Figure 2.7: Business activities of key cellular chipset providers (Q2-2026)
• Figure 2.8: ASR Microelectronics’ cellular IoT chipsets (Q2-2026)
• Figure 2.9: Eigencomm revenues by product/service (2022–2024)
• Figure 2.10: Eigencomm’s cellular IoT chipsets (Q2-2026)
• Figure 2.11: MediaTek’s cellular IoT chipsets (Q2-2026)
• Figure 2.12: MLINK’s IoT chipsets (Q2-2026)
• Figure 2.13: Qualcomm’s IoT modem chipsets (Q2-2026)
• Figure 2.14: QCT revenues by segment (2023–2025)
• Figure 2.15: Samsung’s automotive chip solutions
• Figure 2.16: Sequans’ product and licence revenues (2022–2025)
• Figure 2.17: UNISOC’s cellular IoT chipsets (Q2-2026)
• Figure 2.18: Xinyi’s cellular IoT chipsets (Q2-2026)
• Figure 2.19: Business activities of other cellular chipset providers (Q2-2026)
• Figure 2.20: Fibocom’s embedded wireless IoT modules (Q2-2026)
• Figure 2.21: Fibocom’s AI-powered robot solution
• Figure 2.22: MeiG’s embedded cellular IoT modules (Q2-2026)
• Figure 2.23: Neoway’s revenue by segment (2023–2025)
• Figure 2.24: Neoway’s embedded cellular IoT modules (Q2-2026)
• Figure 2.25: Nordic Semiconductor’s revenues by segment (2021–2025)
• Figure 2.26: Feature comparison of the nRF91 and nRF93 modules
• Figure 2.27: Quectel’s cellular IoT module series (Q2-2026)
• Figure 2.28: Semtech’s embedded cellular module series (Q2-2026)
• Figure 2.29: Semtech’s embedded cellular modules (Q2-2026)
• Figure 2.30: Sunsea AIoT’s revenue by segment (2022–2025)
• Figure 2.31: Embedded cellular IoT modules from SIMCom and Longsung (Q2-2026)
• Figure 2.32: Overview of the SIMCom AI stack
• Figure 2.33: Telit Cinterion’s embedded cellular IoT modules (Q2-2026)
• Figure 2.34: Trasna’s embedded cellular IoT modules (Q2-2026)
• Figure 2.35: ZxInfoTek’s LTE Cat-1 bis modules (Q2-2026)
• Figure 3.1: LoRaWAN network architecture
• Figure 3.2: Public LoRaWAN network operators in Europe (Q2-2026)
• Figure 3.3: Public LoRaWAN network operators in Asia-Pacific (Q2-2026)
• Figure 3.4: Public LoRaWAN network operators in the Americas (Q2-2026)
• Figure 3.5: Amazon Sidewalk network coverage (Q2-2026)
• Figure 3.6: Public LoRaWAN network operators in Middle East & Africa (Q2-2026)
• Figure 3.7: Semtech’s LoRa business KPIs (FY-2023–FY-2026)
• Figure 3.8: LoRa module vendors (Q2-2026)
• Figure 4.1: Sigfox network architecture
• Figure 4.2: Sigfox network partners in Europe (Q1-2026)
• Figure 4.3: Sigfox networks in the Americas (Q1-2026)
• Figure 4.4: Sigfox networks in Asia-Pacific and MEA (Q1-2026)
• Figure 4.5: List of Sigfox module vendors by supported regions (Q1-2026)
• Figure 5.1: Major 802.15.4 networking platforms for smart metering (Q4-2025)
• Figure 5.2: Technology positioning for NR+ in relation to eMBB, URLLC and mMTC
• Figure 5.3: The Mioty telegram splitting technology
• Figure 5.4: Members of the Mioty Alliance (Q2-2026)
• Figure 6.1: Cellular/non-3GPP LPWA IoT device shipments by region (World 2024–2030)
• Figure 6.2: Cellular/non-3GPP LPWA IoT device shipments by technology (World 2025)
• Figure 6.3: Cellular IoT device design architectures
• Figure 6.4: Cellular IoT device shipments by design architecture
• Figure 6.5: Cellular IoT chipset vendor volume market shares (World 2025)
• Figure 6.6: Cellular IoT chipset vendor volume by technology (World 2025)
• Figure 6.7: Top cellular IoT module vendors, by revenues and shipments (World 2025)
• Figure 6.8: Automotive cellular IoT chipset volume market shares (World 2025)
• Figure 6.9: NAD module volume market shares (World 2025)
• Figure 6.10: Cellular IoT module shipment forecast by technology (World 2024–2030)
• Figure 6.11: Top 10 LTE Cat-4+ device types by module shipments (World 2025)
• Figure 6.12: Top 10 LTE Cat-1 device types by module shipments (World 2025)
• Figure 6.13: Top 10 LTE Cat-1 bis device types by module shipments (World 2025)
• Figure 6.14: Top 10 LTE-M device types by module shipments (World 2025)
• Figure 6.15: Top 6 NB-IoT device types by module shipments (World 2025)
• Figure 6.16: Top 6 5G eMBB device types by module shipments (World 2025)
• Figure 6.17: Cellular IoT module shipments by region and vertical (World 2024–2030)
• Figure 6.18: Cellular IoT module shipment forecast (Europe 2024–2030)
• Figure 6.19: Cellular IoT module shipment forecast (North America 2024–2030)
• Figure 6.20: Cellular IoT module shipment forecast (Latin America 2024–2030)
• Figure 6.21: Cellular IoT module shipment forecast (China 2024–2030)
• Figure 6.22: Cellular IoT module shipment forecast (Rest of Asia-Pacific 2024–2030)
• Figure 6.23: Cellular IoT module shipment forecast (Middle East & Africa 2024–2030)
• Figure 6.24: LoRa device shipments forecast (World 2024–2030)
• Figure 6.25: Sigfox device shipments forecast (World 2024–2030)
• Figure 6.26: 802.15.4 WAN device shipments forecast (World 2024–2030)