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Medical Electronics

PUBLISHER: Blueweave Consulting | PRODUCT CODE: 1147255

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PUBLISHER: Blueweave Consulting | PRODUCT CODE: 1147255

Radiation Hardened Electronics Market - Global Size, Share, Trend Analysis, Opportunity and Forecast Report, 2018-2028, Segmented By Product Type, By Component, By Manufacturing Technique, By Material, By Application, By Region

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Table of Contents

Global Radiation Hardened Electronics Market to Grow at a CAGR of 5.3%, during Forecast Period

Global Radiation Hardened Electronics Market is flourishing owing to the expanding semiconductor sector and rising demand for commercial-off-the-shelf space components.

A recent study conducted by the strategic consulting and market research firm, BlueWeave Consulting, revealed that the Global Radiation Hardened Electronics Market was worth USD 1.78 billion in the year 2021. The market is projected to grow at a CAGR of 5.3%, earning revenues of around USD 2.53 billion by the end of 2028. The Global Radiation Hardened Electronics Market is booming because of the growing number of space missions and exploratory activities. In line with this, the rising demand for communication satellites for intelligence, surveillance, and reconnaissance (ISR) operations is driving market expansion. Radiation-hardened electronics are critical for preventing physical damage and failure caused by harmful radiation in space. Furthermore, widespread product adoption for power management device manufacturing is having a positive impact on the market. These electronics are also used in the production of diodes, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs) for a variety of defense and military applications. The low production and high maintenance costs for radiation-hardened electronics, however, are anticipated to impede market revenue growth over the forecast period.

Growing Market for Commercial Satellites

The need for low-cost satellite communication for a range of uses, including agriculture surveillance, television content and cell phone connectivity, and military surveillance and monitoring, is driving up demand for small satellites. These commercial satellites have a lifespan of 15-20 years and are frequently launched into geosynchronous orbits for the best coverage. As more communication satellites orbit the earth, the demand for radiation-hardened electronics systems has grown. The New Space entrepreneurs, including OneWeb, SpaceX, Amazon, and Telesat, intend to launch a mega constellation of thousands of low-earth orbit satellites in the upcoming years to enhance the global connectivity network.

Challenge: Customised Demands from Affluent Customers

Custom radiation-hardened products with high integration, efficiency, and compact features are preferred by space agencies. The businesses are embracing several innovations, which involve investing a sizable amount of time, money, and R&D. Additionally, the need to adapt the design process based on the specific requirements of the end user causes long development cycles for radiation-hardened components. Further, it is anticipated that a lack of lab time will impact the supply of customized product lines for the certification of radiation-hardened chipsets.

Segmental Coverage

Global Radiation Hardened Electronics Market - By Material

Based on material, the Global Radiation Hardened Electronics Market is segmented into Silicon, Hydrogenated amorphous silicon, Silicon carbide, Gallium nitride, Gallium arsenide, and others. Among these, Silicon is expected to grow significantly during the forecast period. Silicon-based electronic components are chosen for innovative solutions that aid both strategic and space missions, resulting in significant market growth. The segment is growing due to manufacturers' increased interest in developing critical microelectronic equipment, such as microprocessors, that are more reliable in hostile environments, such as space and military field deployments. All these factors boost the growth of the Global Radiation Hardened Electronics Market during the forecast period (2022-2028).

Impact of COVID-19 on Global Radiation Hardened Electronics Market

COVID-19 has had a sizable impact on the value chain as well as the demand for radiation-hardened electronics in various end-use industries. The use of radiation-hardened electronic components in satellite construction has been significantly influenced by COVID-19. This market is characterized by low production volumes, high levels of specialization, and few suppliers. Furthermore, COVID-19 has resulted in supply chain interruptions, extended lead times for raw material and component shipments, postponed contract execution, and lockdowns in several countries, particularly in the European region, where the third phase of the lockdown took place in the first quarter of 2021. The industry also relies on outside silicon foundries and back-end subcontractors for some of its manufacturing tasks.

Competitive Landscape

The leading market players in the Global Radiation Hardened Electronics Market are Microchip Technology Inc., BAE Systems, Renesas Electronics Corporation, Infineon Technologies AG, STMicroelectronics, Xilinx, Inc., Texas Instruments Incorporated, Honeywell International Inc., Teledyne Technologies Inc., TTM Technologies, Inc., Cobham Limited, Analog Devices, Inc, Data Devices Corporation, 3D Plus (France), Mercury Systems, Inc., PCB Piezotronics, Inc, Vorago (US), Micropac Industries, Inc, GSI Technology, Inc, Everspin Technologies Inc, Semiconductor Components Industries, LLC, and other prominent players. The Global Radiation Hardened Electronics Market is highly fragmented with the presence of several manufacturing companies in the country. The market leaders retain their supremacy by spending on research and development, incorporating cutting-edge technology into their goods, and releasing upgraded items for customers. Various tactics, including strategic alliances, agreements, mergers, and partnerships, are used.

The in-depth analysis of the report provides information about growth potential, upcoming trends, and statistics of the Global Radiation Hardened Electronics Market. It also highlights the factors driving forecasts of total market size. The report promises to provide recent technology trends in the Global Radiation Hardened Electronics Market and industry insights to help decision-makers make sound strategic decisions. Furthermore, the report also analyzes the growth drivers, challenges, and competitive dynamics of the market.

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Product Code: BWC22405

Table of Contents

1. Research Framework

  • 1.1. Research Objective
  • 1.2. Type Overview
  • 1.3. Market Segmentation

2. Executive Summary

3. Global Radiation Hardened Electronics Market Insights

  • 3.1. Application Value Chain Analysis
  • 3.2. DROC Analysis
    • 3.2.1. Growth Drivers
      • 3.2.1.1. Increasing Demand in Commercial Satellites
      • 3.2.1.2. Rise in the intelligence, surveillance, and reconnaissance (ISR) operations
      • 3.2.1.3. Expanding semiconductor sector
    • 3.2.2. Restraints
      • 3.2.2.1. Difficulties in creating real testing environment
      • 3.2.2.2. High costs of development and designing
    • 3.2.3. Opportunities
      • 3.2.3.1. Increasing space missions globally
      • 3.2.3.2. Rising Demand for Commercial-Off-The-Shelf Components in Space Satellites
      • 3.2.3.3. Rising Military Applications
    • 3.2.4. Challenge
      • 3.2.4.1. Customized requirements from high-end consumers
  • 3.3. Technological Advancements/Recent Developments
  • 3.4. Regulatory Framework
  • 3.5. Porter's Five Forces Analysis
    • 3.5.1. Bargaining Power of Suppliers
    • 3.5.2. Bargaining Power of Buyers
    • 3.5.3. Threat of New Entrants
    • 3.5.4. Threat of Substitutes
    • 3.5.5. Intensity of Rivalry

4. Global Radiation Hardened Electronics Market Overview

  • 4.1. Market Size & Forecast by Value, 2018-2028
    • 4.1.1. By Value (USD Billion)
  • 4.2. Market Share & Forecast
    • 4.2.1. By Product Type
      • 4.2.1.1. Commercial-off-the-Shelf (COTS)
      • 4.2.1.2. Custom Made
    • 4.2.2. By Component
      • 4.2.2.1. Mixed Signal ICs
      • 4.2.2.2. Processors & Controllers
      • 4.2.2.3. Memory
      • 4.2.2.4. Power Management
    • 4.2.3. By Manufacturing Technique
      • 4.2.3.1. Radiation-Hardening by Design (RHBD)
      • 4.2.3.2. Radiation-Hardening by Process (RHBP)
    • 4.2.4. By Material
      • 4.2.4.1. Silicon
      • 4.2.4.2. Hydrogenated amorphous silicon
      • 4.2.4.3. Silicon carbide
      • 4.2.4.4. Gallium nitride
      • 4.2.4.5. Gallium arsenide
      • 4.2.4.6. Others
    • 4.2.5. By Application
      • 4.2.5.1. Space
      • 4.2.5.2. Aerospace & Defense
      • 4.2.5.3. Nuclear Power Plant
      • 4.2.5.4. Medical
      • 4.2.5.5. Others
    • 4.2.6. By Region
      • 4.2.6.1. North America
      • 4.2.6.2. Europe
      • 4.2.6.3. Asia Pacific
      • 4.2.6.4. Latin America
      • 4.2.6.5. Middle East and Africa

5. North America Radiation Hardened Electronics Market

    • 5.1.1. Market Size & Forecast by Value, 2018-2028
    • 5.1.2. By Value (USD Billion)
  • 5.2. Market Share & Forecast
    • 5.2.1. By Product Type
    • 5.2.2. By Component
    • 5.2.3. By Manufacturing Technique
    • 5.2.4. By Material
    • 5.2.5. By Application
    • 5.2.6. By Country
      • 5.2.6.1. US
      • 5.2.6.1.1. By Product Type
      • 5.2.6.1.2. By Component
      • 5.2.6.1.3. By Manufacturing Technique
      • 5.2.6.1.4. By Material
      • 5.2.6.1.5. By Application
      • 5.2.6.2. Canada
      • 5.2.6.2.1. By Product Type
      • 5.2.6.2.2. By Component
      • 5.2.6.2.3. By Manufacturing Technique
      • 5.2.6.2.4. By Material
      • 5.2.6.2.5. By Application

6. Europe Radiation Hardened Electronics Market

  • 6.1. Market Size & Forecast by Value, 2018-2028
    • 6.1.1. By Value (USD Billion)
  • 6.2. Market Share & Forecast
    • 6.2.1. By Product Type
    • 6.2.2. By Component
    • 6.2.3. By Manufacturing Technique
    • 6.2.4. By Material
    • 6.2.5. By Application
    • 6.2.6. By Country
      • 6.2.6.1. Germany
      • 6.2.6.1.1. By Product Type
      • 6.2.6.1.2. By Component
      • 6.2.6.1.3. By Manufacturing Technique
      • 6.2.6.1.4. By Material
      • 6.2.6.1.5. By Application
      • 6.2.6.2. UK
      • 6.2.6.2.1. By Product Type
      • 6.2.6.2.2. By Component
      • 6.2.6.2.3. By Manufacturing Technique
      • 6.2.6.2.4. By Material
      • 6.2.6.2.5. By Application
      • 6.2.6.2.6.
      • 6.2.6.3. Italy
      • 6.2.6.3.1. By Product Type
      • 6.2.6.3.2. By Component
      • 6.2.6.3.3. By Manufacturing Technique
      • 6.2.6.3.4. By Material
      • 6.2.6.3.5. By Application
      • 6.2.6.4. France
      • 6.2.6.4.1. By Product Type
      • 6.2.6.4.2. By Component
      • 6.2.6.4.3. By Manufacturing Technique
      • 6.2.6.4.4. By Material
      • 6.2.6.4.5. By Application
      • 6.2.6.5. Spain
      • 6.2.6.5.1. By Product Type
      • 6.2.6.5.2. By Component
      • 6.2.6.5.3. By Manufacturing Technique
      • 6.2.6.5.4. By Material
      • 6.2.6.5.5. By Application
      • 6.2.6.6. The Netherlands
      • 6.2.6.6.1. By Product Type
      • 6.2.6.6.2. By Component
      • 6.2.6.6.3. By Manufacturing Technique
      • 6.2.6.6.4. By Material
      • 6.2.6.6.5. By Application
      • 6.2.6.7. Belgium
      • 6.2.6.7.1. By Product Type
      • 6.2.6.7.2. By Component
      • 6.2.6.7.3. By Manufacturing Technique
      • 6.2.6.7.4. By Material
      • 6.2.6.7.5. By Application
      • 6.2.6.8. NORDIC Countries
      • 6.2.6.8.1. By Product Type
      • 6.2.6.8.2. By Component
      • 6.2.6.8.3. By Manufacturing Technique
      • 6.2.6.8.4. By Material
      • 6.2.6.8.5. By Application
      • 6.2.6.9. Rest of Europe
      • 6.2.6.9.1. By Product Type
      • 6.2.6.9.2. By Component
      • 6.2.6.9.3. By Manufacturing Technique
      • 6.2.6.9.4. By Material
      • 6.2.6.9.5. By Application
    • 6.2.7. Asia Pacific Radiation Hardened Electronics Market
  • 6.3. Market Size & Forecast by Value, 2018-2028
    • 6.3.1. By Value (USD Billion)
  • 6.4. Market Share & Forecast
    • 6.4.1. By Product Type
    • 6.4.2. By Component
    • 6.4.3. By Manufacturing Technique
    • 6.4.4. By Material
    • 6.4.5. By Application
    • 6.4.6. By Country
      • 6.4.6.1. China
      • 6.4.6.1.1. By Product Type
      • 6.4.6.1.2. By Component
      • 6.4.6.1.3. By Manufacturing Technique
      • 6.4.6.1.4. By Material
      • 6.4.6.1.5. By Application
      • 6.4.6.2. India
      • 6.4.6.2.1. By Product Type
      • 6.4.6.2.2. By Component
      • 6.4.6.2.3. By Manufacturing Technique
      • 6.4.6.2.4. By Material
      • 6.4.6.2.5. By Application
      • 6.4.6.2.6.
      • 6.4.6.3. Japan
      • 6.4.6.3.1. By Product Type
      • 6.4.6.3.2. By Component
      • 6.4.6.3.3. By Manufacturing Technique
      • 6.4.6.3.4. By Material
      • 6.4.6.3.5. By Application
      • 6.4.6.4. South Korea
      • 6.4.6.4.1. By Product Type
      • 6.4.6.4.2. By Component
      • 6.4.6.4.3. By Manufacturing Technique
      • 6.4.6.4.4. By Material
      • 6.4.6.4.5. By Application
      • 6.4.6.5. Australia & New Zealand
      • 6.4.6.5.1. By Product Type
      • 6.4.6.5.2. By Component
      • 6.4.6.5.3. By Manufacturing Technique
      • 6.4.6.5.4. By Material
      • 6.4.6.5.5. By Application
      • 6.4.6.6. Indonesia
      • 6.4.6.6.1. By Product Type
      • 6.4.6.6.2. By Component
      • 6.4.6.6.3. By Manufacturing Technique
      • 6.4.6.6.4. By Material
      • 6.4.6.6.5. By Application
      • 6.4.6.7. Malaysia
      • 6.4.6.7.1. By Product Type
      • 6.4.6.7.2. By Component
      • 6.4.6.7.3. By Manufacturing Technique
      • 6.4.6.7.4. By Material
      • 6.4.6.7.5. By Application
      • 6.4.6.8. Singapore
      • 6.4.6.8.1. By Product Type
      • 6.4.6.8.2. By Component
      • 6.4.6.8.3. By Manufacturing Technique
      • 6.4.6.8.4. By Material
      • 6.4.6.8.5. By Application
      • 6.4.6.9. Philippines
      • 6.4.6.9.1. By Product Type
      • 6.4.6.9.2. By Component
      • 6.4.6.9.3. By Manufacturing Technique
      • 6.4.6.9.4. By Material
      • 6.4.6.9.5. By Application
      • 6.4.6.10. Vietnam
      • 6.4.6.10.1. By Product Type
      • 6.4.6.10.2. By Component
      • 6.4.6.10.3. By Manufacturing Technique
      • 6.4.6.10.4. By Material
      • 6.4.6.10.5. By Application
      • 6.4.6.11. Rest of Asia Pacific
      • 6.4.6.11.1. By Product Type
      • 6.4.6.11.2. By Component
      • 6.4.6.11.3. By Manufacturing Technique
      • 6.4.6.11.4. By Material
      • 6.4.6.11.5. By Application

7. Latin America Radiation Hardened Electronics Market

  • 7.1. Market Size & Forecast by Value, 2018-2028
    • 7.1.1. By Value (USD Billion)
  • 7.2. Market Share & Forecast
    • 7.2.1. By Product Type
    • 7.2.2. By Component
    • 7.2.3. By Manufacturing Technique
    • 7.2.4. By Material
    • 7.2.5. By Application
    • 7.2.6. By Country
      • 7.2.6.1. Brazil
      • 7.2.6.1.1. By Product Type
      • 7.2.6.1.2. By Component
      • 7.2.6.1.3. By Manufacturing Technique
      • 7.2.6.1.4. By Material
      • 7.2.6.1.5. By Application
      • 7.2.6.2. Mexico
      • 7.2.6.2.1. By Product Type
      • 7.2.6.2.2. By Component
      • 7.2.6.2.3. By Manufacturing Technique
      • 7.2.6.2.4. By Material
      • 7.2.6.2.5. By Application
      • 7.2.6.3. Argentina
      • 7.2.6.3.1. By Product Type
      • 7.2.6.3.2. By Component
      • 7.2.6.3.3. By Manufacturing Technique
      • 7.2.6.3.4. By Material
      • 7.2.6.3.5. By Application
      • 7.2.6.3.6.
      • 7.2.6.4. Peru
      • 7.2.6.4.1. By Product Type
      • 7.2.6.4.2. By Component
      • 7.2.6.4.3. By Manufacturing Technique
      • 7.2.6.4.4. By Material
      • 7.2.6.4.5. By Application
      • 7.2.6.5. Colombia
      • 7.2.6.5.1. By Product Type
      • 7.2.6.5.2. By Component
      • 7.2.6.5.3. By Manufacturing Technique
      • 7.2.6.5.4. By Material
      • 7.2.6.5.5. By Application
      • 7.2.6.6. Rest of Latin America
      • 7.2.6.6.1. By Product Type
      • 7.2.6.6.2. By Component
      • 7.2.6.6.3. By Manufacturing Technique
      • 7.2.6.6.4. By Material
      • 7.2.6.6.5. By Application

8. Middle East & Africa Radiation Hardened Electronics Market

  • 8.1. Market Size & Forecast by Value, 2018-2028
    • 8.1.1. By Value (USD Billion)
  • 8.2. Market Share & Forecast
    • 8.2.1. By Product Type
    • 8.2.2. By Component
    • 8.2.3. By Manufacturing Technique
    • 8.2.4. By Material
    • 8.2.5. By Application
    • 8.2.6. By Country
      • 8.2.6.1. Saudi Arabia
      • 8.2.6.1.1. By Product Type
      • 8.2.6.1.2. By Component
      • 8.2.6.1.3. By Manufacturing Technique
      • 8.2.6.1.4. By Material
      • 8.2.6.1.5. By Application
      • 8.2.6.2. UAE
      • 8.2.6.2.1. By Product Type
      • 8.2.6.2.2. By Component
      • 8.2.6.2.3. By Manufacturing Technique
      • 8.2.6.2.4. By Material
      • 8.2.6.2.5. By Application
      • 8.2.6.3. Qatar
      • 8.2.6.3.1. By Product Type
      • 8.2.6.3.2. By Component
      • 8.2.6.3.3. By Manufacturing Technique
      • 8.2.6.3.4. By Material
      • 8.2.6.3.5. By Application
      • 8.2.6.4. Kuwait
      • 8.2.6.4.1. By Product Type
      • 8.2.6.4.2. By Component
      • 8.2.6.4.3. By Manufacturing Technique
      • 8.2.6.4.4. By Material
      • 8.2.6.4.5. By Application
      • 8.2.6.4.6.
      • 8.2.6.5. Iran
      • 8.2.6.5.1. By Product Type
      • 8.2.6.5.2. By Component
      • 8.2.6.5.3. By Manufacturing Technique
      • 8.2.6.5.4. By Material
      • 8.2.6.5.5. By Application
      • 8.2.6.6. South Africa
      • 8.2.6.6.1. By Product Type
      • 8.2.6.6.2. By Component
      • 8.2.6.6.3. By Manufacturing Technique
      • 8.2.6.6.4. By Material
      • 8.2.6.6.5. By Application
      • 8.2.6.6.6.
      • 8.2.6.7. Nigeria
      • 8.2.6.7.1. By Product Type
      • 8.2.6.7.2. By Component
      • 8.2.6.7.3. By Manufacturing Technique
      • 8.2.6.7.4. By Material
      • 8.2.6.7.5. By Application
      • 8.2.6.7.6.
      • 8.2.6.8. Kenya
      • 8.2.6.8.1. By Product Type
      • 8.2.6.8.2. By Component
      • 8.2.6.8.3. By Manufacturing Technique
      • 8.2.6.8.4. By Material
      • 8.2.6.8.5. By Application
      • 8.2.6.9. Egypt
      • 8.2.6.9.1. By Product Type
      • 8.2.6.9.2. By Component
      • 8.2.6.9.3. By Manufacturing Technique
      • 8.2.6.9.4. By Material
      • 8.2.6.9.5. By Application
      • 8.2.6.10. Morocco
      • 8.2.6.10.1. By Product Type
      • 8.2.6.10.2. By Component
      • 8.2.6.10.3. By Manufacturing Technique
      • 8.2.6.10.4. By Material
      • 8.2.6.10.5. By Application
      • 8.2.6.11. Algeria
      • 8.2.6.11.1. By Product Type
      • 8.2.6.11.2. By Component
      • 8.2.6.11.3. By Manufacturing Technique
      • 8.2.6.11.4. By Material
      • 8.2.6.11.5. By Application
      • 8.2.6.12. Rest of Middle East & Africa
      • 8.2.6.12.1. By Product Type
      • 8.2.6.12.2. By Component
      • 8.2.6.12.3. By Manufacturing Technique
      • 8.2.6.12.4. By Material
      • 8.2.6.12.5. By Application

9. Competitive Landscape

  • 9.1. List of Key Players and Their Offerings
  • 9.2. Global Radiation Hardened Electronics Company Market Share Analysis, 2021
  • 9.3. Competitive Benchmarking, By Operating Parameters
  • 9.4. Key Strategic Developments (Mergers, Acquisitions, Partnerships, etc.)

10. Impact of Covid-19 on Global Radiation Hardened Electronics Market

11. Company Profile (Company Overview, Financial Matrix, Competitive Landscape, Key Personnel, Key Competitors, Contact Address, SWOT, and Strategic Outlook)

  • 11.1. Microchip Technology Inc.
  • 11.2. BAE Systems
  • 11.3. Renesas Electronics Corporation
  • 11.4. Infineon Technologies AG
  • 11.5. STMicroelectronics
  • 11.6. Xilinx, Inc.
  • 11.7. Texas Instruments Incorporated
  • 11.8. Honeywell International Inc.
  • 11.9. Teledyne Technologies Inc.
  • 11.10. TTM Technologies, Inc.
  • 11.11. Cobham Limited
  • 11.12. Analog Devices, Inc
  • 11.13. Data Devices Corporation
  • 11.14. 3D Plus (France), Mercury Systems, Inc.
  • 11.15. PCB Piezotronics, Inc
  • 11.16. Vorago (US), Micropac Industries, Inc
  • 11.17. GSI technology, Inc
  • 11.18. Everspin Technologies Inc
  • 11.19. Semiconductor Components Industries, LLC
  • 11.20. Other Prominent Players

12. Key Strategic Recommendations

13. Research Methodology

  • 13.1. Qualitative Research
    • 13.1.1. Primary & Secondary Research
  • 13.2. Quantitative Research
  • 13.3. Market Breakdown & Data Triangulation
    • 13.3.1. Secondary Research
    • 13.3.2. Primary Research
  • 13.4. Breakdown of Primary Research Respondents, By Region
  • 13.5. Assumptions & Limitations
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Jeroen Van Heghe

Manager - EMEA

+32-2-535-7543

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Christine Sirois

Manager - Americas

+1-860-674-8796

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