PUBLISHER: Bizwit Research & Consulting LLP | PRODUCT CODE: 1681065
PUBLISHER: Bizwit Research & Consulting LLP | PRODUCT CODE: 1681065
Global Electrical and Electronic Adhesive Market Size Study, by Product (Thermal Conductive, Electrically Conductive), by Application (Surface-Mount Devices) and Regional Forecasts 2022-2032
The Global Electrical and Electronic Adhesive Market was valued at approximately USD 5.81 billion in 2023 and is anticipated to grow at a CAGR of 8.00% over the forecast period 2024-2032. The escalating adoption of advanced adhesive solutions in the electrical and electronics industry, particularly for circuit assembly, semiconductor packaging, and component bonding, is fueling market expansion. These adhesives, known for their superior conductivity, mechanical stability, and thermal resistance, are increasingly replacing traditional soldering techniques, ensuring enhanced performance, cost-effectiveness, and environmental compliance in electronic manufacturing.
Rapid innovations in adhesive formulations, coupled with the surging demand for miniaturized and high-performance electronic devices, are reinforcing the need for thermally conductive and electrically conductive adhesives. The increasing preference for lead-free and environmentally friendly materials, driven by stringent RoHS and REACH regulations, has further accelerated the adoption of next-generation conductive adhesives. However, challenges such as high material costs and performance limitations in extreme conditions may restrain market growth. Nonetheless, ongoing R&D efforts are poised to enhance adhesive properties, reliability, and application versatility, paving the way for sustained expansion.
Regionally, North America holds a dominant position in the market, driven by the strong presence of electronics manufacturers, technological advancements, and high R&D investments in the semiconductor sector. The United States remains a key contributor, leveraging its robust electronic manufacturing ecosystem and increasing deployment of electrically conductive adhesives in flexible printed circuit boards (FPCBs). Meanwhile, Europe follows closely, benefitting from the rising emphasis on automotive electronics, consumer electronics, and renewable energy applications.
The Asia-Pacific region is set to experience the fastest growth over the forecast period, fueled by the booming electronics industry in China, Japan, South Korea, and India. The region's expanding semiconductor and consumer electronics manufacturing sector, coupled with increasing government support for PCB and microelectronics production, is expected to drive substantial market demand. Additionally, Latin America and the Middle East & Africa are witnessing steady growth, supported by expanding industrialization, infrastructure development, and growing demand for smart electronic solutions.
Major Market Players Included in This Report:
- 3M Company
- Henkel AG & Co. KGaA
- H.B. Fuller Company
- Dow Inc.
- BASF SE
- Avery Dennison Corporation
- Lord Corporation
- Permabond Engineering Adhesives
- Master Bond Inc.
- Aremco Products Inc.
- Panacol-Elosol GmbH
- DELO Industrial Adhesives
- Parker Hannifin Corporation
- Shin-Etsu Chemical Co., Ltd.
- Bostik SA
The Detailed Segments and Sub-Segments of the Market Are Explained Below:
By Product:
- Thermal Conductive
- Electrically Conductive
By Application:
- Surface-Mount Devices
By Region:
North America:
- U.S.
- Canada
Europe:
- UK
- Germany
- France
- Spain
- Italy
- Rest of Europe
Asia Pacific:
- China
- India
- Japan
- Australia
- South Korea
- Rest of Asia Pacific
Latin America:
- Brazil
- Mexico
- Rest of Latin America
Middle East & Africa:
- Saudi Arabia
- South Africa
- Rest of Middle East & Africa
Years Considered for the Study:
- Historical Year: 2022
- Base Year: 2023
- Forecast Period: 2024 to 2032
Key Takeaways:
- Market estimates & forecasts for 10 years (2022-2032).
- Annualized revenue breakdown and regional-level analysis for each market segment.
- Detailed geographical assessment with country-level insights.
- Competitive landscape overview with insights on major industry players.
- Analysis of key business strategies and recommendations for future market expansion.
- Evaluation of market structure and competition in the electrical and electronic adhesive sector.
- Demand-side and supply-side dynamics analysis.
Table of Contents
Chapter 1. Global Electrical and Electronic Adhesive Market Executive Summary
- 1.1. Global Electrical and Electronic Adhesive Market Size & Forecast (2022-2032)
- 1.2. Regional Summary
- 1.3. Segmental Summary
- 1.3.1. {By Product}
- 1.3.2. {By Application}
- 1.4. Key Trends
- 1.5. Recession Impact
- 1.6. Analyst Recommendation & Conclusion
Chapter 2. Global Electrical and Electronic Adhesive Market Definition and Research Assumptions
- 2.1. Research Objective
- 2.2. Market Definition
- 2.3. Research Assumptions
- 2.3.1. Inclusion & Exclusion
- 2.3.2. Limitations
- 2.3.3. Supply Side Analysis
- 2.3.3.1. Availability
- 2.3.3.2. Infrastructure
- 2.3.3.3. Regulatory Environment
- 2.3.3.4. Market Competition
- 2.3.3.5. Economic Viability (Consumer's Perspective)
- 2.3.4. Demand Side Analysis
- 2.3.4.1. Regulatory Frameworks
- 2.3.4.2. Technological Advancements
- 2.3.4.3. Environmental Considerations
- 2.3.4.4. Consumer Awareness & Acceptance
- 2.4. Estimation Methodology
- 2.5. Years Considered for the Study
- 2.6. Currency Conversion Rates
Chapter 3. Global Electrical and Electronic Adhesive Market Dynamics
- 3.1. Market Drivers
- 3.1.1. Escalating Adoption of Advanced Adhesive Solutions
- 3.1.2. Innovative Adhesive Formulations and Regulatory Pressures
- 3.1.3. Rising Demand for Miniaturized Electronic Devices
- 3.2. Market Challenges
- 3.2.1. High Material Costs
- 3.2.2. Performance Limitations under Extreme Conditions
- 3.3. Market Opportunities
- 3.3.1. Expansion in Emerging Markets
- 3.3.2. Shift towards Lead-Free and Environmentally Friendly Adhesives
- 3.3.3. Growth in Semiconductor Packaging and Component Bonding Applications
Chapter 4. Global Electrical and Electronic Adhesive Market Industry Analysis
- 4.1. Porter's 5 Force Model
- 4.1.1. Bargaining Power of Suppliers
- 4.1.2. Bargaining Power of Buyers
- 4.1.3. Threat of New Entrants
- 4.1.4. Threat of Substitutes
- 4.1.5. Competitive Rivalry
- 4.1.6. Futuristic Approach to Porter's 5 Force Model
- 4.1.7. Porter's 5 Force Impact Analysis
- 4.2. PESTEL Analysis
- 4.2.1. Political
- 4.2.2. Economical
- 4.2.3. Social
- 4.2.4. Technological
- 4.2.5. Environmental
- 4.2.6. Legal
- 4.3. Top Investment Opportunity
- 4.4. Top Winning Strategies
- 4.5. Disruptive Trends
- 4.6. Industry Expert Perspective
- 4.7. Analyst Recommendation & Conclusion
Chapter 5. Global Electrical and Electronic Adhesive Market Size & Forecasts by Product 2022-2032
- 5.1. Segment Dashboard
- 5.2. Global Electrical and Electronic Adhesive Market: {Product} Revenue Trend Analysis, 2022 & 2032 (USD Million/Billion)
- 5.2.1. Thermal Conductive
- 5.2.2. Electrically Conductive
Chapter 6. Global Electrical and Electronic Adhesive Market Size & Forecasts by Application 2022-2032
- 6.1. Segment Dashboard
- 6.2. Global Electrical and Electronic Adhesive Market: {Application} Revenue Trend Analysis, 2022 & 2032 (USD Million/Billion)
- 6.2.1. Surface-Mount Devices
Chapter 7. Global Electrical and Electronic Adhesive Market Size & Forecasts by Region 2022-2032
- 7.1. North America Electrical and Electronic Adhesive Market
- 7.1.1. U.S. Electrical and Electronic Adhesive Market
- 7.1.1.1. {Product} Breakdown Size & Forecasts, 2022-2032
- 7.1.1.2. {Application} Breakdown Size & Forecasts, 2022-2032
- 7.1.2. Canada Electrical and Electronic Adhesive Market
- 7.1.1. U.S. Electrical and Electronic Adhesive Market
- 7.2. Europe Electrical and Electronic Adhesive Market
- 7.2.1. UK Electrical and Electronic Adhesive Market
- 7.2.2. Germany Electrical and Electronic Adhesive Market
- 7.2.3. France Electrical and Electronic Adhesive Market
- 7.2.4. Spain Electrical and Electronic Adhesive Market
- 7.2.5. Italy Electrical and Electronic Adhesive Market
- 7.2.6. Rest of Europe Electrical and Electronic Adhesive Market
- 7.3. Asia Pacific Electrical and Electronic Adhesive Market
- 7.3.1. China Electrical and Electronic Adhesive Market
- 7.3.2. India Electrical and Electronic Adhesive Market
- 7.3.3. Japan Electrical and Electronic Adhesive Market
- 7.3.4. Australia Electrical and Electronic Adhesive Market
- 7.3.5. South Korea Electrical and Electronic Adhesive Market
- 7.3.6. Rest of Asia Pacific Electrical and Electronic Adhesive Market
- 7.4. Latin America Electrical and Electronic Adhesive Market
- 7.4.1. Brazil Electrical and Electronic Adhesive Market
- 7.4.2. Mexico Electrical and Electronic Adhesive Market
- 7.4.3. Rest of Latin America Electrical and Electronic Adhesive Market
- 7.5. Middle East & Africa Electrical and Electronic Adhesive Market
- 7.5.1. Saudi Arabia Electrical and Electronic Adhesive Market
- 7.5.2. South Africa Electrical and Electronic Adhesive Market
- 7.5.3. Rest of Middle East & Africa Electrical and Electronic Adhesive Market
Chapter 8. Competitive Intelligence
- 8.1. Key Company SWOT Analysis
- 8.1.1. 3M Company
- 8.1.2. Henkel AG & Co. KGaA
- 8.1.3. H.B. Fuller Company
- 8.2. Top Market Strategies
- 8.3. Company Profiles
- 8.3.1. 3M Company
- 8.3.1.1. Key Information
- 8.3.1.2. Overview
- 8.3.1.3. Financial (Subject to Data Availability)
- 8.3.1.4. Product Summary
- 8.3.1.5. Market Strategies
- 8.3.2. Dow Inc.
- 8.3.3. BASF SE
- 8.3.4. Avery Dennison Corporation
- 8.3.5. Lord Corporation
- 8.3.6. Permabond Engineering Adhesives
- 8.3.7. Master Bond Inc.
- 8.3.8. Aremco Products Inc.
- 8.3.9. Panacol-Elosol GmbH
- 8.3.10. DELO Industrial Adhesives
- 8.3.11. Parker Hannifin Corporation
- 8.3.12. Shin-Etsu Chemical Co., Ltd.
- 8.3.13. Bostik SA
- 8.3.1. 3M Company
Chapter 9. Research Process
- 9.1. Research Process
- 9.1.1. Data Mining
- 9.1.2. Analysis
- 9.1.3. Market Estimation
- 9.1.4. Validation
- 9.1.5. Publishing
- 9.2. Research Attributes
