Computing and AI for Data Centers: Global Market 2027-2040

Description

List of Tables

The market for computing and AI silicon in data centers covers the processors that do the work inside AI and cloud infrastructure: discrete GPUs, custom AI ASICs, server CPUs and data center FPGAs. What has changed since 2023 is not simply scale but structure. The server CPU, which accounted for the clear majority of this market in 2021, now represents a small fraction of it, while the GPU has moved from a minority position to dominance - the fastest reversal of category leadership in semiconductor history.

Recent activity has been defined by three developments. Custom silicon has moved from experiment to volume: Google's TPU, AWS Trainium, Meta's MTIA and Microsoft's MAIA together now ship millions of accelerators annually, and OpenAI's own programme is expected in volume from 2027. Merchant vendors have responded by selling systems rather than chips, with rack-scale platforms integrating 72 to 144 accelerators behind a single coherent fabric - a shift that raises the barrier to competing from designing a chip to delivering an entire rack, along with its power delivery, liquid cooling and system software. And the binding constraint has migrated from silicon to electricity: after packaging shortages in 2023 and high-bandwidth memory shortages through 2024 and 2025, grid interconnection and electrical equipment lead times now govern how quickly capacity can be commissioned.

The outlook to 2040 is for continued growth at a materially slower rate than the 2023–2027 period. Three findings shape that trajectory. Revenue keeps growing after units stop: accelerator shipments peak around 2032 while average selling prices rise more than five-fold across the period, meaning capacity sized against the revenue curve will be overbuilt. AI ASICs overtake GPUs on unit shipments in 2028 but never on revenue, because custom silicon displaces volume at the lower-value inference end while frontier training remains merchant territory. And the cost reductions driving demand come predominantly from model efficiency and serving software rather than from process scaling - meaning much of the value created accrues above the silicon layer.

Value in this chain is determined by position more than by execution. The constrained layers - leading-edge foundry, high-bandwidth memory, advanced packaging and custom silicon co-design - combine growth with genuine defensibility, while system assembly and the merchant accelerator start-up cohort face structurally weaker economics. Risks are concentrated rather than diffuse: power availability, packaging capacity, memory supply, and whether enterprise AI adoption converts from pilot to production at the rate the buildout assumes.

Computing and AI for Data Centers: Global Market 2027–2040 is a comprehensive market intelligence report on the semiconductors powering global AI and cloud infrastructure. The report covers chip designers, foundries, memory suppliers, packaging houses, equipment vendors, hyperscalers, model developers, systems manufacturers and infrastructure suppliers across the United States, Taiwan, South Korea, Japan, China and Europe.

Report contents include:

Executive summary and market definition
Global AI infrastructure investment and hyperscaler capital expenditure
Data center power constraints and regional capacity buildout
Export controls and the US–China technology divide
Processor market revenue forecasts to 2040: GPU, AI ASIC, server CPU, FPGA
Average selling price and unit volume forecasts by vendor and programme
Wafer, die and advanced packaging demand forecasts
Server tray and rack architecture forecasts
Cost of AI inference and training, and the token cost roadmap
Demand drivers: agentic AI, physical AI, recommendation, coding, search
Capital expenditure versus operating expenditure economics
Ecosystem, supply chain and co-designer relationship maps
Market share by revenue, units and deployment volume
Financial analysis of the leading chip designers
AI semiconductor start-up funding landscape
Mainland China market, manufacturers and supply chain
CPU, GPU and AI ASIC technology and roadmap analysis
HBM, advanced packaging and rack bill of materials
Emerging architectures: photonics, neuromorphic, quantum
Bull, base and bear scenarios to 2040, risks and investment outlook
81 company profiles. Companies profiled include Advanced Micro Devices (AMD), Alchip Technologies, Alibaba (T-Head Semiconductor), Alphawave Semi, Amazon Web Services (Annapurna Labs), Amkor Technology, Ampere Computing, Analog Devices, Applied Materials, Arm Holdings, ASE Technology Holding, ASML Holding, Astera Labs, Axelera AI, Baidu (Kunlun), Biren Technology, Broadcom, Cadence Design Systems, Cambricon Technologies, Celestica, Cerebras Systems, Cisco Systems, Coherent Corp, CoreWeave, Credo Technology Group, ChangXin Memory Technologies (CXMT), d-Matrix, Delta Electronics, Dell Technologies, Eaton Corporation, Enflame Technology, Etched, Foxconn (Hon Hai Precision Industry), FuriosaAI, GlobalFoundries, Google (Alphabet), Groq, Global Unichip Corporation (GUC), Hewlett Packard Enterprise, Hygon Information Technology, Ibiden, Iluvatar CoreX, Infineon Technologies, Innolight Technology, Intel Corporation, JCET Group, KLA Corporation, Lam Research, Lightmatter, Lumentum Holdings, Marvell Technology, MediaTek, Meta Platforms, Micron Technology, Microsoft, Monolithic Power Systems, Moore Threads, Nebius Group, NVIDIA Corporation, onsemi, OpenAI, Powertech Technology, Quanta Computer, Rambus, Rebellions, Renesas Electronics, Samsung Electronics, SambaNova Systems, Schneider Electric, Shinko Electric Industries, SiPearl, SK Hynix, Semiconductor Manufacturing International Corporation (SMIC), Super Micro Computer, Synopsys, Tenstorrent, Tokyo Electron, Taiwan Semiconductor Manufacturing Company (TSMC), Unimicron Technology, Vertiv Holdings, and Wistron Corporation.

1 EXECUTIVE SUMMARY

1.1 Global AI Infrastructure and Investment Landscape
1.2 Capital formation and the venture channel
1.3 US and Chinese Hyperscaler CapEx Trends and Projections
1.4 Power as the binding constraint
1.5 AI Data Center Typology and Demand Segmentation
1.6 AI Regulatory Landscape and Export Controls
1.7 Sovereign AI and International Industrial Policy
1.8 The US–China Technology Divide

2 MARKET FORECASTS

2.1 Processor Revenue Forecast
- 2.1.1 Total Data Center Processor Market, 2021–2040
- 2.1.2 GPU Revenue Forecast, 2021–2040 (p. 64)
- 2.1.3 AI ASIC Revenue Forecast, 2021–2040 (p. 68)
- 2.1.4 Server CPU Revenue Forecast, 2021–2040 (p. 71)
- 2.1.5 FPGA Data Center Revenue Forecast, 2021–2040
2.2 Average Selling Price (ASP) Forecast
- 2.2.1 GPU ASP Trends by Product Tier, 2021–2040
- 2.2.2 AI ASIC ASP Trends by Hyperscaler, 2021–2040
- 2.2.3 CPU ASP Trends — Intel Xeon vs. AMD EPYC, 2021–2040 (p. 84)
2.3 Processor Volume Forecast
- 2.3.1 GPU Unit Shipments by Vendor, 2021–2040
- 2.3.2 AI ASIC Unit Shipments by Hyperscaler, 2021–2040
- 2.3.3 CPU Unit Shipments by Vendor, 2021–2040
2.4 Wafer Forecast
- 2.4.1 GPU & AI ASIC Wafer Starts by Technology Node, 2021–2040
- 2.4.2 Wafer Starts by Foundry
- 2.4.3 GPU & AI ASIC Compute Die Forecast, 2021–2040
- 2.4.4 HBM-Driven Revenue Separation from GPU & AI ASIC
2.5 Server Tray Volume Forecast
2.6 AI server rack architecture
2.7 CPU Focus
2.8 The Arm ramp
2.9 GPU & AI ASIC Focus

3 MARKET TRENDS

3.1 Cost of Generative AI Inference and Training
3.2 Why training costs what it does
3.3 From Agentic AI to Physical AI
3.4 Physical AI
3.5 Recommendation Models for Social Networks
3.6 Coding Assistants
3.7 Search Engine vs. LLM
3.8 OpenClaw
- 3.8.1 What it is
- 3.8.2 Why it matters to this forecast
3.9 CapEx vs. OpEx in the Era of Generative AI
3.10 Is the Future of AI Data Centers in Space?

4 MARKET SHARE & SUPPLY CHAIN

4.1 Data Center Ecosystem Map
4.2 Foundation Models Ecosystem Map
4.3 U.S. vs. China Tech War — Timeline
4.4 Financial Metrics of Data Center Chip Designers
4.5 AI semiconductor start-up fundraising
4.6 Case Study: OpenAI Revenue and Gigawatt
4.7 Market Share: CPU, GPU, AI ASIC & XPU Co-Designers
- 4.7.1 GPU Market Share by Revenue and Units (p. 247)
- 4.7.2 AI ASIC Market Share by Hyperscaler
- 4.7.3 CPU Market Share by Vendor
- 4.7.4 XPU Co-Designer Revenue Market Share
4.8 Focus on China

5 TECHNOLOGY ANALYSIS

5.1 CPU Technology Trends
- 5.1.1 x86 Architecture Evolution
- 5.1.2 Arm-Based CPU Momentum in the Data Center
- 5.1.3 RISC-V in the Data Center (p. 289)
- 5.1.4 CPU Specialization for AI Workloads
5.2 GPU Technology Trends
- 5.2.1 Chiplet and Multi-Die Architectures
- 5.2.2 Rack-Scale GPU Architectures — NVL72 and Beyond
- 5.2.3 Memory Bandwidth and HBM Integration
- 5.2.4 Networking and Interconnect Evolution
5.3 AI Data Center Traffic Patterns and Network Architecture
- 5.3.1 Four tiers, four different problems
- 5.3.2 Why the traffic looks the way it does
5.4 AI ASIC Technology Trends
- 5.4.1 Hyperscaler ASIC Product Roadmaps
- 5.4.2 AI ASIC Start-Up Landscape
- 5.4.3 AI ASIC Technology Specification Database
- 5.4.4 Compute Disaggregation for AI Inference
- 5.4.5 KV Cache and the Storage Tier
5.5 GPU vs. AI ASIC: Comparative Analysis
5.6 Advanced Packaging and HBM Memory
- 5.6.1 HBM Technology Roadmap — HBM2E to HBM4
- 5.6.2 CoWoS and Advanced Packaging Capacity
- 5.6.3 Custom HBM and Co-Design Trends
- 5.6.4 AI Rack Bill of Materials
- 5.6.5 Thermal Management and Cooling Technologies
5.7 Emerging Computing Architectures
- 5.7.1 Photonic Computing
- 5.7.2 Neuromorphic Computing
- 5.7.3 Quantum Computing Outlook

6 OUTLOOK & SCENARIOS

6.1 Market Outlook 2026–2040
6.2 Technology Outlook 2026–2040
6.3 Key Risks and Opportunities
6.4 Strategic Recommendations

7 COMPANY PROFILES (81 company profiles)

8 REPORT METHODOLOGY

8.1 Objective of the report
8.2 Scope of this report

9 GLOSSARY OF TERMS AND ABBREVIATIONS

10 REFERENCES

List of Tables

Table 1. Global AI Infrastructure Investment by Category, 2021–2040 ($B)
Table 2. US Early-Stage Venture Deployment in AI and Adjacent Technologies, 2016–2026 YTD
Table 3. Early-stage round size and investor concentration, 2026 YTD
Table 4. US vs. Chinese Hyperscaler CapEx, 2021–2040 ($B)
Table 5. Data Center Installed IT Load by Workload Type, 2024–2040 (GW)
Table 6. AI Data Center Facility Types: Characteristics and Processor Preferences
Table 7. Data Center Processor Demand by Facility Type, 2021–2040 ($B)
Table 8. Sovereign AI and Semiconductor Programs
Table 9. Sovereign and Government AI Processor Demand by Region, 2025–2040 ($B)
Table 10. Data Center Processor Market Revenue Summary, 2021–2040 ($B)
Table 11. Revenue Breakdown by Processor Type (CPU, GPU, AI ASIC, FPGA), 2021–2040
Table 12. GPU Revenue by Vendor, 2021–2040 ($B)
Table 13. Nvidia GPU Revenue by Product Generation, 2021–2028 ($B)
Table 14. AMD GPU Revenue by Product Generation, 2021–2028 ($B)
Table 15. AI ASIC Revenue by Hyperscaler, 2021–2040 ($B)
Table 16. Server CPU Revenue by Vendor, 2021–2040 ($B)
Table 17. FPGA Data Center Revenue Forecast, 2021–2040 ($M)
Table 18. GPU ASP by Product Tier, 2021–2040 ($K per unit)
Table 19. AI ASIC ASP by Hyperscaler, 2021–2040 ($K per unit)
Table 20. Server CPU ASP Trends — Intel Xeon vs. AMD EPYC, 2021–2040 ($)
Table 21. GPU Unit Shipments by Vendor, 2021–2040 (K units)
Table 22. Nvidia GPU Unit Shipments by Product Generation, 2021–2028 (K units)
Table 23. AMD GPU Unit Shipments by Product Generation, 2021–2028 (K units)
Table 24. AI ASIC Unit Shipments by Hyperscaler, 2021–2040 (K units)
Table 25. CPU Unit Shipments by Vendor, 2021–2040 (M units)
Table 26. Hyperscaler Custom CPU Unit Adoption, 2022–2040 (M units)
Table 27. GPU & AI ASIC Wafer Starts by Node and Foundry, 2021–2040 (KWPM, 300mm equivalent)
Table 28. Average Die Size Trend — GPU vs. AI ASIC, 2021–2040 (mm²)
Table 29. HBM Revenue Separated from GPU & AI ASIC Total, 2021–2040 ($B)
Table 30. AI Server vs. General-Purpose Server Tray Volume, 2021–2040 (M units)
Table 31. AI Server Rack Configuration and Architecture, 2025–2040
Table 32. CPU Market Share by Revenue: Intel vs. AMD vs. Arm-based, 2021–2040
Table 33. Hyperscaler Arm CPU Deployment Ramp, 2022–2040
Table 34. CPU Processor Roadmap Summary — Major Vendors, 2024–2030
Table 35.GPU Market Share by Revenue, 2021–2040 (%)
Table 36. AI ASIC Market Share by Deployment Volume, 2021–2040 (%)
Table 37. GPU & AI ASIC Split by Technology Node, 2021–2040
Table 38. GPU & AI ASIC Product Roadmap Summary, 2024–2030
Table 39. Cost per Token Trend: Training and Inference, 2021–2040 ($/M tokens)
Table 40. Cost per Token by Model Size and Hardware Configuration, 2024–2040 ($/M output tokens)
Table 41. Cost per Token Trend: Training and Inference, 2021–2040 ($/M tokens)
Table 42. Inference Cost Breakdown by Infrastructure Component, 2025 (%)
Table 43. AI Model Parameter Count vs. Hardware Requirements, 2020–2028
Table 44. Agentic AI Use Cases by Industry and Hardware Requirements
Table 45. AI Agent Deployment Forecast by Sector, 2025–2040 (M concurrently deployed agents)
Table 46. Physical AI Hardware Requirements vs. Generative AI, 2025–2040
Table 47. Robotics Semiconductor Market Forecast, 2024–2040 ($B)
Table 48. Recommendation Model Architecture Evolution, 2018–2028
Table 49. Recommendation Model Compute Demand by Platform, 2024–2040 ($B)
Table 50. AI-Powered Coding Assistant Market Share, 2024–2028 (%)
Table 51. Coding Assistant Market Share and Underlying Infrastructure
Table 52. Coding AI GPU Compute Demand, 2024–2040 ($B)
Table 53. LLM vs. Traditional Search: Query Volume Forecast, 2022–2040 (B queries/day)
Table 54. AI Search Compute Infrastructure Requirements, 2024–2040
Table 55. CapEx Cycle: US Hyperscalers, 2015–2040 ($B)
Table 56. CapEx-to-Revenue Ratio: Major Hyperscalers, 2020–2040 (%)
Table 57. AI Infrastructure OpEx vs. CapEx Split, 2024–2040
Table 58. Cloud AI Chip Rental vs. Ownership Economics, 2025–2040
Table 59. Low Earth Orbit Latency and Bandwidth Projections, 2025–2035
Table 60. AI Chip Supply Chain: From Silicon to Hyperscaler
Table 61. Foundation Model Training Infrastructure by Developer
Table 62. Chinese AI Chip Import Replacement Progress, 2022–2028 (%)
Table 63. Sanctioned vs. Unsanctioned Chinese AI Chip Revenues, 2022–2028 ($B)
Table 64. Financial Metrics: Top 10 Data Center Chip Designers, 2021–2025
Table 65. Gross Margin Comparison: Nvidia vs. AMD vs. Intel, 2020–2025 (%)
Table 66. R&D Spend as % of Revenue: Key Chip Designers, 2020–2025
Table 67. US and Chinese Hyperscaler CapEx Summary, 2021–2026 ($B)
Table 68. AI Semiconductor Start-Up Fundraising, 2019–Q1 2026 ($M)
Table 69. AI Semiconductor Start-Up Fundraising Database, 2019–Q1 2026
Table 70. OpenAI Revenue Forecast, 2023–2030 ($B)
Table 71. OpenAI Compute Demand (Gigawatt), 2023–2030
Table 72. OpenAI GPU Procurement Forecast by Generation, 2023–2028 (K units)
Table 73. GPU Market Share Summary by Revenue and Units, 2021–2025
Table 74. Nvidia, AMD, Google, AWS GPU/ASIC Unit Split, 2021–2028 (K units)
Table 75. AI ASIC Market Share by Hyperscaler, 2021–2025 (%)
Table 76. AI ASIC Specifications: Google, AWS, Microsoft, Meta, 2024–2026
Table 77. CPU Market Share by Revenue: Intel vs. AMD vs. Arm, 2021–2025 (%)
Table 78. Hyperscaler Custom CPU Market Share Evolution, 2022–2028
Table 79. Co-Designer Revenue Share, 2021–2026 (%)
Table 80. China Data Center Processor Market by Type, 2021–2030 ($B)
Table 81. Chinese Hyperscaler Processor Demand, 2021–2028 ($B)
Table 82. Domestic Chinese AI Chip Makers: Unit Share, 2022–2028 (%)
Table 83. Chinese AI Chip Makers: Product Specifications and Capabilities
Table 84. China Data Center Semiconductor Supply Chain Map
Table 85. CPU Architecture Comparison: x86, Arm, RISC-V for the Data Center
Table 86. CPU Specifications: Intel, AMD, AWS, Google, Microsoft, Huawei, Nvidia, 2024–2026
Table 87. Arm Server CPU Shipment Forecast, 2022–2040 (M units)
Table 88. RISC-V Data Center Adoption Forecast, 2025–2040
Table 89. CPU Specialization for AI Inference Workloads
Table 90. GPU Specifications: Nvidia Blackwell, Rubin; AMD MI350X, MI450, 2024–2026
Table 91. GPU Die Size Evolution and Chiplet Transition, 2020–2030 (mm²)
Table 92. Rack-Scale GPU Architecture: NVL72 and Next-Generation Platforms
Table 93. GPU Memory Bandwidth Trend: HBM Generations, 2020–2030 (TB/s)
Table 94. NVLink and Interconnect Bandwidth Evolution, 2020–2030
Table 95. AI Network Tiers: Bandwidth, Latency and Technology
Table 96. Parallelism Strategies and Their Network Traffic Characteristics
Table 97. AI ASIC Technology Specification Database
Table 98. Memory and Storage Tiers for KV Cache in Inference Serving
Table 99. GPU vs. AI ASIC: Performance per Watt Comparison, 2022–2026
Table 100. GPU vs. AI ASIC: Training vs. Inference Suitability Matrix
Table 101. GPU vs. AI ASIC: Total Cost of Ownership Analysis
Table 102. HBM Specification Comparison: HBM2E, HBM3, HBM3E, HBM4
Table 103. CoWoS Capacity Expansion Roadmap: TSMC, 2022–2028 (KWPM)
Table 104. Advanced Packaging Market Share: CoWoS, SoIC, Others, 2024–2028 (%)
Table 105. AI Server Rack BoM: Itemized Cost Breakdown, 2025 ($K)
Table 106. AI Rack BoM Cost Evolution, 2023–2028 ($K)
Table 107. Data Center Cooling Technologies for AI: Comparison
Table 108. Cooling Technology Share of AI Accelerator Deployments, 2023–2040 (%)
Table 109. Silicon Photonics Market Forecast in Data Centers, 2024–2040 ($B)
Table 110. Neuromorphic Computing Roadmap, 2024–2040
Table 111. Quantum Computing Timeline to Commercial Viability, 2025–2040
Table 112. Emerging Computing Technology Readiness Assessment
Table 113. Market Forecast Summary: Bull / Base / Bear Scenarios, 2026–2040 ($B)
Table 114. Bull, Base, Bear Case Revenue Scenarios by Processor Type, 2040
Table 115. Technology Roadmap Summary: CPU, GPU, AI ASIC, 2026–2040
Table 116. Key Risk Register: Probability and Impact Assessment
Table 117. Investment Opportunity Map: Data Center Semiconductor Ecosystem

List of Figures

Figure 1. Global AI Infrastructure Investment Forecast, 2021–2040 ($B)
Figure 2. US vs. Chinese Hyperscaler CapEx, 2021–2040 ($B)
Figure 3. Data Center Power Consumption Forecast, 2024–2040 (GW installed IT load)
Figure 4. AI-Related Data Center Construction Starts by Region, 2022–2028 (GW of IT capacity)
Figure 5. Data Center Processor Demand by Facility Type, 2021–2040 ($B)
Figure 6. US Export Controls on AI Chips: Key Milestones, 2019–2026
Figure 7. Sovereign and Government AI Processor Demand by Region, 2025–2040 ($B)
Figure 8. US–China Technology Decoupling Timeline, 2018–2026
Figure 9. Total Data Center Processor Market Revenue Forecast, 2021–2040 ($B)
Figure 10. Revenue Breakdown by Processor Type (CPU, GPU, AI ASIC, FPGA), 2021–2040
Figure 11. Data Center Processor CAGR by Category, 2025–2040 (%)
Figure 12. GPU Market Revenue Forecast, 2021–2040 ($B)
Figure 13. GPU Revenue Split by Vendor (Nvidia, AMD, Others), 2021–2040
Figure 14. Nvidia GPU Revenue by Product Generation, 2021–2028 ($B)
Figure 15. AMD GPU Revenue by Product Generation, 2021–2028 ($B)
Figure 16. AI ASIC Market Revenue Forecast, 2021–2040 ($B)
Figure 17. AI ASIC Revenue Split by Hyperscaler, 2021–2040
Figure 18. Server CPU Market Revenue Forecast, 2021–2040 ($B)
Figure 19. Server CPU Revenue Split by Architecture (x86 vs. Arm), 2021–2040
Figure 20. FPGA Data Center Revenue Forecast, 2021–2040 ($M)
Figure 21. GPU ASP Evolution by Product Tier, 2021–2040 ($K)
Figure 22. AI ASIC ASP Trends by Hyperscaler, 2021–2040 ($K)
Figure 23. Server CPU ASP Trends — Intel Xeon vs. AMD EPYC, 2021–2040 ($)
Figure 24. GPU Unit Shipments by Vendor, 2021–2040 (K units)
Figure 25. Nvidia GPU Unit Shipments by Product Generation, 2021–2028 (K units)
Figure 26. AMD GPU Unit Shipments by Product Generation, 2021–2028 (K units)
Figure 27. AI ASIC Unit Shipments by Hyperscaler, 2021–2040 (K units)
Figure 28. Google TPU Unit Deployment Forecast, 2021–2040 (K units)
Figure 29. AWS Trainium & Inferentia Unit Forecast, 2021–2040 (K units)
Figure 30. Microsoft MAIA Unit Forecast, 2021–2040 (K units)
Figure 31. CPU Unit Shipments — Data Center, 2021–2040 (M units)
Figure 32. Intel vs. AMD CPU Market Share in Unit Terms, 2021–2040 (%)
Figure 33. Hyperscaler Custom CPU Unit Adoption, 2022–2040 (M units)
Figure 34. GPU & AI ASIC Wafer Starts by Technology Node, 2021–2040 (KWPM)
Figure 35. Wafer Consumption Split: Advanced Nodes, 2021–2040
Figure 36. GPU & AI ASIC Wafer Starts by Foundry, 2021–2040
Figure 37. TSMC Advanced Node Capacity Forecast, 2024–2040 (KWPM)
Figure 38. GPU & AI ASIC Compute Die Forecast, 2021–2040
Figure 39. Average Die Size Trend — GPU vs. AI ASIC, 2021–2040 (mm²)
Figure 40. HBM Revenue Separated from GPU & AI ASIC Total, 2021–2040 ($B)
Figure 41. AI Server vs. General-Purpose Server Tray Volume, 2021–2040 (M units)
Figure 42. AI Server Rack Configuration and Architecture, 2025–2040
Figure 43. CPU Market Share by Revenue: Intel vs. AMD vs. Arm-based, 2021–2040
Figure 44. Hyperscaler Arm CPU Deployment Ramp, 2022–2040
Figure 45. CPU Product Roadmap: Intel, AMD, Arm, Google, AWS, Nvidia, 2024–2030
Figure 46. GPU Market Share by Revenue, 2021–2040 (%)
Figure 47. AI ASIC Market Share by Deployment Volume, 2021–2040 (%)
Figure 48. GPU & AI ASIC Split by Technology Node, 2021–2040
Figure 49. Cost per Token Trend: Training and Inference, 2021–2040 ($/M tokens)
Figure 50. Training Compute Requirements by Model Type, 2020–2028 (FLOPs)
Figure 51. Inference Cost Breakdown by Infrastructure Component, 2025 (%)
Figure 52. Token Cost Reduction Roadmap, 2025–2040
Figure 53. AI Model Parameter Count vs. Hardware Requirements, 2020–2028
Figure 54. Agentic AI Market Taxonomy and Use Cases
Figure 55. AI Agent Deployment Forecast by Sector, 2025–2040 (M concurrently deployed agents)
Figure 56. Physical AI Hardware Requirements vs. Generative AI, 2025–2040
Figure 57. Robotics Semiconductor Market Forecast, 2024–2040 ($B)
Figure 58. Recommendation Model Architecture Evolution, 2018–2028
Figure 59. Recommendation Model Compute Demand by Platform, 2024–2040 ($B)
Figure 60. AI-Powered Coding Assistant Market Share, 2024–2028 (%)
Figure 61. Coding AI GPU Compute Demand, 2024–2040 ($B)
Figure 62. LLM vs. Traditional Search: Query Volume Forecast, 2022–2040 (B queries/day)
Figure 63. AI Search Compute Infrastructure Requirements, 2024–2040
Figure 64. CapEx Cycle: US Hyperscalers, 2015–2040 ($B)
Figure 65. CapEx-to-Revenue Ratio: Major Hyperscalers, 2020–2040 (%)
Figure 66. AI Infrastructure OpEx vs. CapEx Split, 2024–2040
Figure 67. Cloud AI Chip Rental vs. Ownership Economics, 2025–2040
Figure 68. Space-Based Data Center Conceptual Architecture
Figure 69. Low Earth Orbit Latency and Bandwidth Projections, 2025–2035
Figure 70. Global Data Center Processor Ecosystem Map
Figure 71. AI Chip Supply Chain: From Silicon to Hyperscaler Source: Future Markets, Inc., 2026
Figure 72. Co-Designer and Hyperscaler Relationship Map
Figure 73. OSAT and Advanced Packaging Supply Chain Map
Figure 74. Foundation Models Ecosystem Map: Developers and Infrastructure
Figure 75. Open vs. Closed Source AI Model Landscape, 2024
Figure 76. Foundation Model Training Infrastructure by Developer
Figure 77. US Export Control Timeline: Semiconductors, 2018–2026
Figure 78. Chinese AI Chip Import Replacement Progress, 2022–2028 (%)
Figure 79. Sanctioned vs. Unsanctioned Chinese AI Chip Revenues, 2022–2028 ($B)
Figure 80. Comparative Revenue: Data Center Chip Designers, 2021–2025 ($B)
Figure 81. Gross Margin Comparison: Nvidia vs. AMD vs. Intel, 2020–2025 (%)
Figure 82. R&D Spend as % of Revenue: Key Chip Designers, 2020–2025
Figure 83. AI Semiconductor Start-Up Fundraising, 2019–Q1 2026 ($M)
Figure 84. OpenAI Revenue Forecast, 2023–2030 ($B)
Figure 85. OpenAI Compute Demand (Gigawatt), 2023–2030
Figure 86. OpenAI GPU Procurement Forecast by Generation, 2023–2028 (K units)
Figure 87. GPU Market Share by Revenue, 2021–2025 (%)
Figure 88. GPU Market Share by Units, 2021–2025 (%)
Figure 89. Nvidia, AMD, Google, AWS GPU/ASIC Unit Split, 2021–2028 (K units)
Figure 90. AI ASIC Market Share by Hyperscaler, 2021–2025 (%)
Figure 91. CPU Market Share by Revenue: Intel vs. AMD vs. Arm, 2021–2025 (%)
Figure 92. Hyperscaler Custom CPU Market Share Evolution, 2022–2028
Figure 93. XPU Co-Designer Revenue, 2023–2026 ($B)
Figure 94. XPU Co-Designer Revenue Share, 2021–2026 (%)
Figure 95. China Data Center Processor Market Size, 2021–2025 ($B)
Figure 96. Chinese Hyperscaler Processor Demand, 2021–2028 ($B)
Figure 97. Domestic Chinese AI Chip Makers: Unit Share, 2022–2028 (%)
Figure 98. HiSilicon, Cambricon, Baidu Kunlun, Hygon Roadmap, 2024–2028
Figure 99. China Data Center Semiconductor Supply Chain Map
Figure 100. CPU Architecture Comparison: x86, Arm, RISC-V for the Data Center
Figure 101. Arm Server CPU Shipment Forecast, 2022–2040 (M units)
Figure 102. RISC-V Data Center Adoption Forecast, 2025–2040
Figure 103. CPU Specialization for AI Inference Workloads
Figure 104. GPU Process Node Roadmap: Nvidia, AMD, 2020–2030
Figure 105. GPU Die Size Evolution and Chiplet Transition, 2020–2030 (mm²)
Figure 106. Rack-Scale GPU Architecture: NVL72 and Next-Generation Platforms
Figure 107. GPU Memory Bandwidth Trend: HBM Generations, 2020–2030 (TB/s)
Figure 108. NVLink and Interconnect Bandwidth Evolution, 2020–2030
Figure 109. AI Data Center Network Architecture by Tier
Figure 110. Hyperscaler ASIC Roadmap Comparison: Google, AWS, Microsoft, Meta
Figure 111. AI ASIC Start-Up Landscape by Funding Stage, 2024
Figure 112. AI ASIC Technology Specification Matrix
Figure 113. Disaggregated Inference Architecture Diagram
Figure 114. GPU vs. AI ASIC: Performance per Watt Comparison, 2022–2026
Figure 115. GPU vs. AI ASIC: Training vs. Inference Suitability Matrix
Figure 116. GPU vs. AI ASIC: Total Cost of Ownership Analysis
Figure 117. HBM Technology Roadmap: HBM2E to HBM4, 2020–2028
Figure 118. HBM Bandwidth and Capacity per Stack by Generation, 2020–2028
Figure 119. CoWoS Capacity Expansion Roadmap: TSMC, 2022–2028 (KWPM)
Figure 120. Advanced Packaging Market Share: CoWoS, SoIC, Others, 2024–2028 (%)
Figure 121. Custom HBM Co-Design Relationships Map
Figure 122. AI Server Rack Bill of Materials: Component Breakdown, 2025 ($K)
Figure 123. AI Rack BoM Cost Evolution, 2023–2028 ($K)
Figure 124. Rack Density Envelope by Cooling Technology
Figure 125. Cooling Technology Share of AI Accelerator Deployments, 2023–2040 (%)
Figure 126. Silicon Photonics Market Forecast in Data Centers, 2024–2040 ($B)
Figure 127. Neuromorphic Computing Roadmap, 2024–2040
Figure 128. Quantum Computing Timeline to Commercial Viability, 2025–2040
Figure 129. Data Center Processor Market Scenario Analysis, 2026–2040 ($B)
Figure 130. Bull, Base, Bear Case Revenue Scenarios by Processor Type, 2040
Figure 131. Technology Roadmap Summary: CPU, GPU, AI ASIC, 2026–2040
Figure 132. Competitive Landscape Risk Matrix, 2026–2040
Figure 133. Investment Opportunity Map: Data Center Semiconductor Ecosystem

Computing and AI for Data Centers: Global Market 2027-2040

Description

Table of Contents

List of Tables

Table of Contents

1 EXECUTIVE SUMMARY

2 MARKET FORECASTS

3 MARKET TRENDS

4 MARKET SHARE & SUPPLY CHAIN

5 TECHNOLOGY ANALYSIS

6 OUTLOOK & SCENARIOS

7 COMPANY PROFILES (81 company profiles)

8 REPORT METHODOLOGY

9 GLOSSARY OF TERMS AND ABBREVIATIONS

10 REFERENCES

List of Tables

List of Figures