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PUBLISHER: Fairfield Market Research | PRODUCT CODE: 1389851

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PUBLISHER: Fairfield Market Research | PRODUCT CODE: 1389851

PUR Adhesive in Electronics Market - Global PUR Adhesive in Electronics Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, & Forecast 2023-2030 - (By Product Type Coverage, By Application Coverage, By Geographic Coverage & By Company)

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The global market for Polyurethane Reactive (PUR) adhesive in electronics, which was valued at approximately $4.2 billion in 2022, is expected to experience substantial growth, reaching an estimated $6.3 billion by 2030, as per the latest report from Fairfield Market Research. The market is poised to achieve robust revenue growth at a compound annual growth rate (CAGR) of 5.9% during the forecast period from 2023 to 2030.

Key Market Trends Driving Growth

  • 1. Increased Demand from Electronics Industry: The growth of the electronics industry is a significant trend expected to fuel the demand for PUR adhesive in electronics. The industry's expansion, driven by technological advancements and consumer demand for compact and high-performance electronic devices, contributes to the profitability of the market.
  • 2. Rapidly Expanding Global Automotive Industry: The global automotive industry's growth plays a vital role in driving the market for PUR adhesive in electronics. As vehicles incorporate advanced electronic systems, there is a growing need for durable, high-performance adhesives to ensure the stability and reliability of electronic components.
  • 3. Raw Material Availability and Price Fluctuations: Challenges related to raw material availability and price fluctuations impact cost predictability and supply chain stability, affecting market growth and profitability.
  • 4. Dominance of Thermal Conductive PUR Adhesives: Thermal conductive PUR adhesives are prominent in the electronics market due to their role in efficiently dissipating heat, enhancing device performance, and ensuring reliability. With the demand for effective thermal management solutions rising as electronics become more powerful and compact, these adhesives gain popularity.
  • 5. Leadership of Surface-Mount Devices (SMDs): Surface-mount devices (SMDs) lead the PUR adhesive market in electronics due to their widespread use in modern electronics manufacturing. Miniaturization and high-density printed circuit boards (PCBs) require reliable adhesion, making SMDs the preferred choice for numerous electronic applications.
  • 6. Asia Pacific Dominance: Asia Pacific secures the dominant market share in PUR adhesive for electronics, driven by robust electronics manufacturing, technological advancements, cost-effective production, and a growing demand for high-performance adhesive solutions in the region's thriving electronics industry.
  • 7. Europe's Fastest-Growing Region: Europe is the fastest-growing region in the PUR adhesive in electronics market. Stringent environmental regulations promoting eco-friendly adhesives, a surge in electronics innovation, increased automation, and a growing emphasis on sustainability drive the adoption of PUR adhesive in the European electronics sector.

Key Growth Drivers

  • Rising Trend of Miniaturization of Electronic Devices: The increasing demand for miniaturization of electronic devices is a significant driver for the PUR adhesive market in the electronics industry. As consumers and enterprises seek smaller, lighter, and more compact electronic products, manufacturers face the challenge of assembling and bonding intricate components within limited spaces. PUR adhesives play a crucial role in addressing this challenge, providing strong, reliable bonding in tight spaces.
  • Technological Advancements: Technology advancements are propelling the PUR adhesive market in the electronics sector. As electronics continually evolve with innovations like flexible displays, advanced sensors, and complex circuitry, adhesive solutions must keep pace. PUR adhesives are adaptable to cutting-edge materials and designs, providing superior bonding for next-gen electronic components.
  • Broadening Range of Application in Automotive Industry: The expanding applications of electronics in the automotive industry are a key driver for the PUR adhesive market. With the rise of electric vehicles (EVs) and autonomous driving technology, the demand for PUR adhesives is poised to increase further, making them integral to the automotive electronics market's continued growth and innovation.

Key Trends and Opportunities

  • Smart Packaging: Smart packaging technology involves incorporating electronic components, sensors, or indicators into adhesive-sealed packaging. PUR adhesives play a critical role in sealing and bonding these smart packaging solutions, ensuring the integrity of electronic components and enhancing consumer engagement through data-driven insights.
  • IoT Technology Integration: IoT technology is increasingly leveraged for real-time monitoring of adhesive applications and curing processes in the PUR adhesive electronics market. Sensors and connectivity enable data collection, enhancing efficiency and ensuring consistent adhesive performance.
  • Smart Manufacturing: Smart manufacturing technology involves the integration of automation, data analytics, and AI to optimize adhesive application processes. It enhances quality control, reduces waste, and ensures precise adhesive application, contributing to the overall advancement of electronics manufacturing processes.

Regional Frontrunners

Asia Pacific: Asia Pacific has captured the largest market share in the PUR adhesive electronics market, driven by extensive electronics manufacturing, technological advancements, cost-effective production, and growing demand for high-performance adhesive solutions.

Europe: Europe is expected to grow at the fastest value CAGR in the PUR adhesive electronics market due to stringent environmental regulations, increased innovation in electronics manufacturing, automation, and a growing emphasis on sustainability.

Fairfield's Competitive Landscape Analysis

The global PUR adhesive in the electronics market is consolidated, with fewer major players present globally. Key players are introducing new products and enhancing their distribution channels to expand their global presence. Fairfield Market Research anticipates further consolidation in the PUR adhesive electronics market in the coming years.

Leaders in the Global PUR Adhesive in Electronics Market

  • 1. Henkel AG & Co. KGaA
  • 2. 3M
  • 3. B Fuller
  • 4. Dow Chemical Company
  • 5. Sika AG
  • 6. Avery Dennison
  • 7. Master Bond Inc.
  • 8. Lord Corporation
  • 9. Huntsman Corporation

10. Permabond

11. DELO Industries Adhesives

12. Panacol

13. ITW Polymers Adhesives

14. Dynamax Corporation

15. Electrolube

Table of Contents

1. Executive Summary

  • 1.1. Global PUR Adhesive in Electronics Market Snapshot
  • 1.2. Future Projections
  • 1.3. Key Market Trends
  • 1.4. Regional Snapshot, by Value, 2022
  • 1.5. Analyst Recommendations

2. Market Overview

  • 2.1. Market Definitions and Segmentations
  • 2.2. Market Dynamics
    • 2.2.1. Drivers
    • 2.2.2. Restraints
    • 2.2.3. Market Opportunities
  • 2.3. Value Chain Analysis
  • 2.4. Porter's Five Forces Analysis
  • 2.5. COVID-19 Impact Analysis
    • 2.5.1. Supply
    • 2.5.2. Demand
  • 2.6. Impact of Ukraine-Russia Conflict
  • 2.7. Economic Overview
    • 2.7.1. World Economic Projections
  • 2.8. PESTLE Analysis

3. Global PUR Adhesive in Electronics Market Outlook, 2018 - 2030

  • 3.1. Global PUR Adhesive in Electronics Market Outlook, by Product Type, Value (US$ Bn), 2018 - 2030
    • 3.1.1. Key Highlights
      • 3.1.1.1. Thermal Conductive
      • 3.1.1.2. Electrically Conductive
      • 3.1.1.3. UV Curing
      • 3.1.1.4. Others
  • 3.2. Global PUR Adhesive in Electronics Market Outlook, by Application, Value (US$ Bn), 2018 - 2030
    • 3.2.1. Key Highlights
      • 3.2.1.1. Surface-mount devices
      • 3.2.1.2. Potting & Encapsulation
      • 3.2.1.3. Conformal Coatings
      • 3.2.1.4. Others
      • 3.2.1.5. Industrial
  • 3.3. Global PUR Adhesive in Electronics Market Outlook, by Region, Value (US$ Bn), 2018 - 2030
    • 3.3.1. Key Highlights
      • 3.3.1.1. North America
      • 3.3.1.2. Europe
      • 3.3.1.3. Asia Pacific
      • 3.3.1.4. Latin America
      • 3.3.1.5. Middle East & Africa

4. North America PUR Adhesive in Electronics Market Outlook, 2018 - 2030

  • 4.1. North America PUR Adhesive in Electronics Market Outlook, by Product Type, Value (US$ Bn), 2018 - 2030
    • 4.1.1. Key Highlights
      • 4.1.1.1. Thermal Conductive
      • 4.1.1.2. Electrically Conductive
      • 4.1.1.3. UV Curing
      • 4.1.1.4. Others
  • 4.2. North America PUR Adhesive in Electronics Market Outlook, by Application, Value (US$ Bn), 2018 - 2030
    • 4.2.1. Key Highlights
      • 4.2.1.1. Surface-mount devices
      • 4.2.1.2. Potting & Encapsulation
      • 4.2.1.3. Conformal Coatings
      • 4.2.1.4. Others
      • 4.2.1.5. Industrial
    • 4.2.2. BPS Analysis/Market Attractiveness Analysis
  • 4.3. North America PUR Adhesive in Electronics Market Outlook, by Country, Value (US$ Bn), 2018 - 2030
    • 4.3.1. Key Highlights
      • 4.3.1.1. U.S. PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 4.3.1.2. U.S. PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 4.3.1.3. Canada PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 4.3.1.4. Canada PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
    • 4.3.2. BPS Analysis/Market Attractiveness Analysis

5. Europe PUR Adhesive in Electronics Market Outlook, 2018 - 2030

  • 5.1. Europe PUR Adhesive in Electronics Market Outlook, by Product Type, Value (US$ Bn), 2018 - 2030
    • 5.1.1. Key Highlights
      • 5.1.1.1. Thermal Conductive
      • 5.1.1.2. Electrically Conductive
      • 5.1.1.3. UV Curing
      • 5.1.1.4. Others
  • 5.2. Europe PUR Adhesive in Electronics Market Outlook, by Application, Value (US$ Bn), 2018 - 2030
    • 5.2.1. Key Highlights
      • 5.2.1.1. Surface-mount devices
      • 5.2.1.2. Potting & Encapsulation
      • 5.2.1.3. Conformal Coatings
      • 5.2.1.4. Others
      • 5.2.1.5. Industrial
    • 5.2.2. BPS Analysis/Market Attractiveness Analysis
  • 5.3. Europe PUR Adhesive in Electronics Market Outlook, by Country, Value (US$ Bn), 2018 - 2030
    • 5.3.1. Key Highlights
      • 5.3.1.1. Germany PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 5.3.1.2. Germany PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 5.3.1.3. U.K. PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 5.3.1.4. U.K. PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 5.3.1.5. France PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 5.3.1.6. France PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 5.3.1.7. Italy PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 5.3.1.8. Italy PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 5.3.1.9. Turkey PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 5.3.1.10. Turkey PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 5.3.1.11. Russia PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 5.3.1.12. Russia PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 5.3.1.13. Rest of Europe PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 5.3.1.14. Rest of Europe PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
    • 5.3.2. BPS Analysis/Market Attractiveness Analysis

6. Asia Pacific PUR Adhesive in Electronics Market Outlook, 2018 - 2030

  • 6.1. Asia Pacific PUR Adhesive in Electronics Market Outlook, by Product Type, Value (US$ Bn), 2018 - 2030
    • 6.1.1. Key Highlights
      • 6.1.1.1. Thermal Conductive
      • 6.1.1.2. Electrically Conductive
      • 6.1.1.3. UV Curing
      • 6.1.1.4. Others
  • 6.2. Asia Pacific PUR Adhesive in Electronics Market Outlook, by Application, Value (US$ Bn), 2018 - 2030
    • 6.2.1. Key Highlights
      • 6.2.1.1. Surface-mount devices
      • 6.2.1.2. Potting & Encapsulation
      • 6.2.1.3. Conformal Coatings
      • 6.2.1.4. Others
      • 6.2.1.5. Industrial
    • 6.2.2. BPS Analysis/Market Attractiveness Analysis
  • 6.3. Asia Pacific PUR Adhesive in Electronics Market Outlook, by Country, Value (US$ Bn), 2018 - 2030
    • 6.3.1. Key Highlights
      • 6.3.1.1. China PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 6.3.1.2. China PUR Adhesive in Electronics Market by Application, Value (US$ Bn), 2018 - 2030
      • 6.3.1.3. Japan PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 6.3.1.4. Japan PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 6.3.1.5. South Korea PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 6.3.1.6. South Korea PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 6.3.1.7. India PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 6.3.1.8. India PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 6.3.1.9. Southeast Asia PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 6.3.1.10. Southeast Asia PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 6.3.1.11. Rest of Asia Pacific PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 6.3.1.12. Rest of Asia Pacific PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
    • 6.3.2. BPS Analysis/Market Attractiveness Analysis

7. Latin America PUR Adhesive in Electronics Market Outlook, 2018 - 2030

  • 7.1. Latin America PUR Adhesive in Electronics Market Outlook, by Product Type, Value (US$ Bn), 2018 - 2030
    • 7.1.1. Key Highlights
      • 7.1.1.1. Thermal Conductive
      • 7.1.1.2. Electrically Conductive
      • 7.1.1.3. UV Curing
      • 7.1.1.4. Others
  • 7.2. Latin America PUR Adhesive in Electronics Market Outlook, by Application, Value (US$ Bn), 2018 - 2030
    • 7.2.1. Key Highlights
      • 7.2.1.1. Surface-mount devices
      • 7.2.1.2. Potting & Encapsulation
      • 7.2.1.3. Conformal Coatings
      • 7.2.1.4. Others
      • 7.2.1.5. Industrial
    • 7.2.2. BPS Analysis/Market Attractiveness Analysis
  • 7.3. Latin America PUR Adhesive in Electronics Market Outlook, by Country, Value (US$ Bn), 2018 - 2030
    • 7.3.1. Key Highlights
      • 7.3.1.1. Brazil PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 7.3.1.2. Brazil PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 7.3.1.3. Mexico PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 7.3.1.4. Mexico PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 7.3.1.5. Argentina PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 7.3.1.6. Argentina PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 7.3.1.7. Rest of Latin America PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 7.3.1.8. Rest of Latin America PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
    • 7.3.2. BPS Analysis/Market Attractiveness Analysis

8. Middle East & Africa PUR Adhesive in Electronics Market Outlook, 2018 - 2030

  • 8.1. Middle East & Africa PUR Adhesive in Electronics Market Outlook, by Product Type, Value (US$ Bn), 2018 - 2030
    • 8.1.1. Key Highlights
      • 8.1.1.1. Thermal Conductive
      • 8.1.1.2. Electrically Conductive
      • 8.1.1.3. UV Curing
      • 8.1.1.4. Others
  • 8.2. Middle East & Africa PUR Adhesive in Electronics Market Outlook, by Application, Value (US$ Bn), 2018 - 2030
    • 8.2.1. Key Highlights
      • 8.2.1.1. Surface-mount devices
      • 8.2.1.2. Potting & Encapsulation
      • 8.2.1.3. Conformal Coatings
      • 8.2.1.4. Others
      • 8.2.1.5. Industrial
    • 8.2.2. BPS Analysis/Market Attractiveness Analysis
  • 8.3. Middle East & Africa PUR Adhesive in Electronics Market Outlook, by Country, Value (US$ Bn), 2018 - 2030
    • 8.3.1. Key Highlights
      • 8.3.1.1. GCC PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 8.3.1.2. GCC PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 8.3.1.3. South Africa PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 8.3.1.4. South Africa PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 8.3.1.5. Egypt PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 8.3.1.6. Egypt PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 8.3.1.7. Nigeria PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 8.3.1.8. Nigeria PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
      • 8.3.1.9. Rest of Middle East & Africa PUR Adhesive in Electronics Market Product Type, Value (US$ Bn), 2018 - 2030
      • 8.3.1.10. Rest of Middle East & Africa PUR Adhesive in Electronics Market Application, Value (US$ Bn), 2018 - 2030
    • 8.3.2. BPS Analysis/Market Attractiveness Analysis

9. Competitive Landscape

  • 9.1. Application vs Application Heatmap
  • 9.2. Manufacturer vs Application Heatmap
  • 9.3. Company Market Share Analysis, 2022
  • 9.4. Competitive Dashboard
  • 9.5. Company Profiles
    • 9.5.1. Henkel AG & Co. KGaA
      • 9.5.1.1. Company Overview
      • 9.5.1.2. Product Portfolio
      • 9.5.1.3. Financial Overview
      • 9.5.1.4. Business Strategies and Development
    • 9.5.2. 3M
      • 9.5.2.1. Company Overview
      • 9.5.2.2. Product Portfolio
      • 9.5.2.3. Financial Overview
      • 9.5.2.4. Business Strategies and Development
    • 9.5.3. H.B. Fuller
      • 9.5.3.1. Company Overview
      • 9.5.3.2. Product Portfolio
      • 9.5.3.3. Financial Overview
      • 9.5.3.4. Business Strategies and Development
    • 9.5.4. Dow Chemical Company
      • 9.5.4.1. Company Overview
      • 9.5.4.2. Product Portfolio
      • 9.5.4.3. Financial Overview
      • 9.5.4.4. Business Strategies and Development
    • 9.5.5. Sika AG
      • 9.5.5.1. Company Overview
      • 9.5.5.2. Product Portfolio
      • 9.5.5.3. Financial Overview
      • 9.5.5.4. Business Strategies and Development
    • 9.5.6. Avery Dennison
      • 9.5.6.1. Company Overview
      • 9.5.6.2. Product Portfolio
      • 9.5.6.3. Financial Overview
      • 9.5.6.4. Business Strategies and Development
    • 9.5.7. Master Bond Inc.
      • 9.5.7.1. Company Overview
      • 9.5.7.2. Product Portfolio
      • 9.5.7.3. Financial Overview
      • 9.5.7.4. Business Strategies and Development
    • 9.5.8. LORD Corporation
      • 9.5.8.1. Company Overview
      • 9.5.8.2. Product Portfolio
      • 9.5.8.3. Financial Overview
      • 9.5.8.4. Business Strategies and Development
    • 9.5.9. Huntsman Corporation
      • 9.5.9.1. Company Overview
      • 9.5.9.2. Product Portfolio
      • 9.5.9.3. Financial Overview
      • 9.5.9.4. Business Strategies and Development
    • 9.5.10. Permabond
      • 9.5.10.1. Company Overview
      • 9.5.10.2. Product Portfolio
      • 9.5.10.3. Financial Overview
      • 9.5.10.4. Business Strategies and Development
    • 9.5.11. DELO Industrial Adhesives
      • 9.5.11.1. Company Overview
      • 9.5.11.2. Product Portfolio
      • 9.5.11.3. Financial Overview
      • 9.5.11.4. Business Strategies and Development
    • 9.5.12. Panacol
      • 9.5.12.1. Company Overview
      • 9.5.12.2. Product Portfolio
      • 9.5.12.3. Financial Overview
      • 9.5.12.4. Business Strategies and Development
    • 9.5.13. ITW Polymers Adhesives
      • 9.5.13.1. Company Overview
      • 9.5.13.2. Product Portfolio
      • 9.5.13.3. Financial Overview
      • 9.5.13.4. Business Strategies and Development
    • 9.5.14. Dymax Corporation
      • 9.5.14.1. Company Overview
      • 9.5.14.2. Product Portfolio
      • 9.5.14.3. Financial Overview
      • 9.5.14.4. Business Strategies and Development
    • 9.5.15. Electrolube
      • 9.5.15.1. Company Overview
      • 9.5.15.2. Product Portfolio
      • 9.5.15.3. Financial Overview
      • 9.5.15.4. Business Strategies and Development

10. Appendix

  • 10.1. Research Methodology
  • 10.2. Report Assumptions
  • 10.3. Acronyms and Abbreviations
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