Semiconductor Assembly Equipment Market - By Type (Die Bonders, Wire Bonders, Packaging Equipment), By Application (IDMs, OSAT), By End Use (Consumer Electronics, Healthcare, Industrial Automation, Automotive, A&D) Forecast 2024

Description

List of Tables

Semiconductor Assembly Equipment Market is set to record a CAGR of over 9% between 2024 and 2032, owing to the technological advancements. The relentless pursuit of innovation in semiconductor manufacturing processes is driving the development of more advanced assembly equipment. This includes equipment capable of handling smaller and more complex components, leading to enhanced efficiency and productivity in the semiconductor assembly process.

Additionally, the surging demand for consumer electronics, such as smartphones, tablets, and smart devices, is propelling the industry growth. As per the reports from GSMA Intelligence, there were around 5.60 billion smart phone users, and around 1.28 billion tablet users in 2022 across the globe.

The worldwide semiconductor assembly equipment industry is segmented on the basis of type, application, end use, and region.

Die bonder segment is slated to gain momentum and record a strong CAGR through 2032, due to advanced packaging solutions for the evolving needs. As semiconductor devices become more complex and compact, die bonder helps in precisely placing and bonding individual semiconductor components onto substrates. This level of precision is important for achieving miniaturization and for enhancing overall device performance.

Automotive segment is anticipated to observe a significant CAGR during 2024 and 2032, driven by the rising integration of advanced semiconductor technologies in modern vehicles. As the automakers shift towards electric and autonomous vehicles, there is a demand for semiconductor components to power sophisticated features such as sensors, AI-driven systems, and connectivity solutions. This surge in semiconductor adoption within the automotive sector drives the need for specialized assembly equipment capable of meeting the stringent requirements for reliability, durability, and precision.

North America semiconductor assembly equipment market will grow substantially between 2024 and 2032, attributed to the strong presence of major semiconductor manufacturers and an emphasis on R&D. The region's commitment towards the initiatives fosters a continuous cycle of advancements in semiconductor assembly processes. Moreover, the growing focus on reshoring semiconductor manufacturing activities bolsters domestic semiconductor production capabilities, accelerating the industry growth in North America.

Product Code: 7680

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Semiconductor assembly equipment market 360 degree synopsis, 2018 - 2032
2.2 Business trends
2.3 Regional trends
2.4 Type trends
2.5 Application trends
2.6 End use trends

Chapter 3 Semiconductor Assembly Equipment Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
- 3.6.1 Partnership/Collaboration
- 3.6.2 Merger/Acquisition
- 3.6.3 Investment
- 3.6.4 Product launch & innovation
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 The acceleration of cloud computing adoption
  - 3.8.1.2 Rising Demand for Smart Devices and IoT
  - 3.8.1.3 Continuous advancements in semiconductor technologies
  - 3.8.1.4 Demand for high-performance computing and AI
  - 3.8.1.5 Focus on Automotive Electronics
  - 3.8.1.6 Efficiency and Yield Improvement
- 3.8.2 Industry pitfalls & challenges
  - 3.8.2.1 Rapid technological changes and development costs
  - 3.8.2.2 Supply chain disruptions and material shortages
3.9 Growth potential analysis
3.10 Porter's analysis
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share, 2023
4.3 Competitive analysis of major market players, 2023
- 4.3.1 ASM Pacific Technology
- 4.3.2 Applied Materials
- 4.3.3 Lam Research Corporation
- 4.3.4 Nikon Corporation
- 4.3.5 ASM Pacific Technology
- 4.3.6 Lam Research Corporation
- 4.3.7 Teradyne, Inc.
4.4 Competitive positioning matrix, 2023
4.5 Strategic outlook matrix, 2023

Chapter 5 Semiconductor Assembly Equipment Market Estimates & Forecast, By Type (USD Million), 2018 - 2032

5.1 Key trends, by type
5.2 Die bonders
5.3 Wire bonders
5.4 Packaging equipment
5.5 Others

Chapter 6 Semiconductor Assembly Equipment Market Estimates & Forecast, By Application (USD Million), 2018 - 2032

6.1 Key trends, by application
6.2 IDMs
6.3 OSAT

Chapter 7 Semiconductor Assembly Equipment Market Estimates & Forecast, By End Use (USD Million), 2018 - 2032

7.1 Key trends, by end use
7.2 Consumer electronics
7.3 healthcare
7.4 Industrial automation
7.5 Automotive
7.6 Aerospace & Defense
7.7 Others

Chapter 8 Semiconductor Assembly Equipment Market Estimates & Forecast, By Region (USD Million), 2018 - 2032

8.1 Key trends, by region
8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Rest of Europe
8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 ANZ
- 8.4.5 South Korea
- 8.4.6 Rest of Asia Pacific
8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
8.6 MEA
- 8.6.1 Saudi Arabia
- 8.6.2 UAE
- 8.6.3 South Africa
- 8.6.4 Rest of MEA

Chapter 9 Company Profiles

9.1 Applied Materials
9.2 ASM Pacific Technology
9.3 Besi
9.4 Disco Corporation
9.5 Kulicke & Soffa Industries, Inc. (K&S)
9.6 Lam Research Corporation
9.7 Nikon Corporation
9.8 Plasma-Therm
9.9 Rudolph Technologies, Inc.
9.10 SCREEN Semiconductor Solutions Co., Ltd.
9.11 SUSS MicroTec SE
9.12 Teradyne, Inc.
9.13 Tokyo Electron Limited (TEL)
9.14 Ultratech, Inc.
9.15 Veeco Instruments Inc.
9.16 Xcerra Corporation