PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1757869
PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1757869
Global Standard Multilayers in PCBs Market to Reach US$31.0 Billion by 2030
The global market for Standard Multilayers in PCBs estimated at US$25.8 Billion in the year 2024, is expected to reach US$31.0 Billion by 2030, growing at a CAGR of 3.1% over the analysis period 2024-2030. Layer 3-6, one of the segments analyzed in the report, is expected to record a 2.7% CAGR and reach US$19.1 Billion by the end of the analysis period. Growth in the Layer 8-10 segment is estimated at 3.5% CAGR over the analysis period.
The U.S. Market is Estimated at US$7.0 Billion While China is Forecast to Grow at 5.7% CAGR
The Standard Multilayers in PCBs market in the U.S. is estimated at US$7.0 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$6.0 Billion by the year 2030 trailing a CAGR of 5.7% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.2% and 2.3% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 1.7% CAGR.
Global Standard Multilayers In PCBs Market - Key Trends & Drivers Summarized
Why Are Standard Multilayers Foundational to Modern Printed Circuit Board Applications?
Standard multilayers in PCBs (Printed Circuit Boards) refer to circuit boards composed of three or more conductive copper layers separated by insulating dielectric materials, laminated into a single unit. These PCBs offer enhanced routing space and signal integrity, making them ideal for complex electronic assemblies. While high-density interconnect (HDI) and flex-rigid PCBs dominate advanced niches, standard multilayer PCBs remain the backbone of industrial electronics due to their balance of performance, manufacturability, and cost.
These multilayer designs are widely used in telecommunications, automotive electronics, industrial controls, power electronics, and consumer devices where signal distribution, power integrity, and electromagnetic compatibility are key. They allow denser component integration, shorter trace lengths, and improved noise isolation across layers, making them a reliable choice for applications ranging from HVAC controllers to LED drivers and embedded computing systems. Their ubiquity in mid-complexity electronics ensures continued demand in both legacy and next-gen applications.
How Are Design Rules, Lamination Techniques, and Materials Evolving in Standard Multilayers?
Improvements in multilayer board manufacturing are being driven by tighter design rules, miniaturization of components, and the need for higher reliability. Lamination processes now utilize vacuum-assisted or sequential lamination to manage stress across layers and avoid delamination or resin voids. The adoption of low-loss dielectrics, halogen-free laminates, and advanced prepreg materials is enabling better signal integrity, especially for high-speed digital applications.
Via formation has also evolved-from through-hole vias to microvia and via-in-pad techniques-improving interlayer connectivity and layout flexibility without compromising board thickness. Sophisticated EDA (Electronic Design Automation) tools allow multilayer stack-ups to be optimized for controlled impedance, thermal dissipation, and cross-talk minimization. As power and RF coexist on the same boards, designers are utilizing thicker copper layers, ground planes, and power distribution layers for improved thermal and electrical performance within standard multilayer constructions.
Where Is Demand Expanding Across Electronics Manufacturing and Global Supply Chains?
The automotive sector represents a major consumer of standard multilayer PCBs, particularly for infotainment systems, advanced driver assistance systems (ADAS), and engine control units (ECUs). Industrial automation and control systems use multilayers for programmable logic controllers (PLCs), motor drives, and power management circuits. In consumer electronics, applications such as smart TVs, home appliances, and wearable devices increasingly rely on these boards for compact design and functionality.
The global manufacturing footprint for multilayer PCBs is heavily centered in Asia-Pacific, especially in China, Taiwan, and South Korea, where large-scale fabrication facilities and skilled labor are concentrated. However, reshoring initiatives in North America and Europe, driven by supply chain risk mitigation and local demand for strategic electronics (e.g., defense, medical), are prompting regional PCB production investments. This shift is creating opportunities for multilayer fabricators with IPC-compliant quality systems and rapid prototyping capabilities.
What’s Driving the Global Growth of the Standard Multilayers in PCBs Market?
The growth in the global standard multilayers in PCBs market is driven by increasing electronic content across traditional and emerging industries. As devices become smarter and more interconnected, standard multilayers offer a proven platform to meet routing, power, and signal integrity requirements without the added cost of high-end HDI processes. Their scalability, compatibility with lead-free assembly, and mature supply base make them the preferred solution for cost-sensitive yet functionally demanding designs.
Rising demand in electric vehicles, industrial IoT, and telecom infrastructure-particularly 5G base stations and networking gear-is reinforcing the relevance of multilayer PCBs. Design standardization, cost optimization, and advancements in multilayer material technologies are contributing to improved board reliability and lifespan. With steady investments in PCB fabrication automation and enhanced layer-count capabilities, standard multilayers are set to remain central to the global electronics value chain.
SCOPE OF STUDY:
The report analyzes the Standard Multilayers in PCBs market in terms of units by the following Segments, and Geographic Regions/Countries:
Segments:
Product Type (Layer 3-6, Layer 8-10, Layer 10+); End-Use (Computers / Peripherals, Communications, Consumer Electronics, Industrial Electronics, Automotive, Military / Aerospace, Other End-Uses)
Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.
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