PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1784794
PUBLISHER: Global Industry Analysts, Inc. | PRODUCT CODE: 1784794
Global Through-hole Passive Components Market to Reach US$64.0 Billion by 2030
The global market for Through-hole Passive Components estimated at US$44.5 Billion in the year 2024, is expected to reach US$64.0 Billion by 2030, growing at a CAGR of 6.2% over the analysis period 2024-2030. Resistors, one of the segments analyzed in the report, is expected to record a 5.0% CAGR and reach US$15.6 Billion by the end of the analysis period. Growth in the Capacitors segment is estimated at 5.0% CAGR over the analysis period.
The U.S. Market is Estimated at US$11.7 Billion While China is Forecast to Grow at 6.2% CAGR
The Through-hole Passive Components market in the U.S. is estimated at US$11.7 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$10.3 Billion by the year 2030 trailing a CAGR of 6.2% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.6% and 5.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.2% CAGR.
Through-hole Passive Components Market Trends & Drivers Summarized
How Are Through-hole Passive Components Remaining Relevant in the Age of Surface-mount Technology?
Through-hole passive components, including resistors, capacitors, inductors, and diodes, remain crucial in applications requiring high durability, mechanical stability, and superior heat dissipation. Despite the dominance of surface-mount technology (SMT) in modern electronics, through-hole components continue to be widely used in industries such as aerospace, automotive, power electronics, and military applications. These components provide stronger connections, making them suitable for high-reliability circuits exposed to extreme environmental conditions. The demand for through-hole technology (THT) is particularly evident in power supply systems, industrial automation, and energy applications, where component robustness is essential. However, challenges such as manual assembly requirements, larger footprint compared to SMT, and limited design flexibility have slowed market expansion. As the electronics industry continues to evolve, how will through-hole passive components maintain their relevance and integrate with modern manufacturing trends?
What Technological Innovations Are Advancing Through-hole Passive Components?
Recent innovations in through-hole passive components focus on improving miniaturization, thermal management, and material efficiency. The development of high-power resistors with improved heat dissipation capabilities is enhancing performance in power electronics and industrial automation. Hybrid integration techniques, where through-hole components are combined with SMT for optimized performance, are gaining traction in high-reliability circuit designs. AI-driven component placement optimization in automated through-hole assembly processes is improving efficiency and reducing production costs. Additionally, advances in ceramic and polymer dielectric materials are enhancing the performance of through-hole capacitors, making them more resistant to voltage fluctuations and temperature variations.
Why Is the Demand for Through-hole Passive Components Increasing?
The demand for through-hole passive components remains strong due to their reliability in high-stress environments, particularly in aerospace, defense, and industrial applications. The increasing deployment of power electronics in renewable energy systems, electric vehicles (EVs), and grid infrastructure is also driving demand for robust and long-lasting passive components. Additionally, the expansion of IoT and smart infrastructure projects is requiring hybrid designs that integrate both SMT and through-hole components for optimized functionality.
What Factors Are Driving the Growth of the Through-hole Passive Components Market?
The market is growing due to advancements in power electronics, increased adoption in mission-critical applications, rising demand for hybrid integration in circuit designs, and technological improvements in component materials. As industries prioritize durability and long-term performance, through-hole passive components are expected to remain essential in high-reliability electronic systems.
SCOPE OF STUDY:
The report analyzes the Through-hole Passive Components market in terms of units by the following Segments, and Geographic Regions/Countries:
Segments:
Component (Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, Others); Leads Model (Axial Leads, Radial Leads); Application (Consumer Electronics, IT & Telecommunications, Automotive, Industrial, Aerospace & Defense, Healthcare, Others)
Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
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