High Density Interconnect Global Market Report 2026

High-density interconnect (HDI) refers to a printed circuit board (PCB) designed to accommodate a greater number of components within the same board space, effectively minimizing the PCB's size while enhancing its functionality and incorporating additional features.

The primary types of high-density interconnect include single panels, double panels, and other variations. Single panels represent a PCB construction where all electronic components and circuitry are situated on a single layer of the board. This configuration is utilized when individual board sizes are substantial, commonly seen in assemblies of low-volume boards. Single panels can be crafted from rigid, flexible, and rigid-flex substrates, catering to diverse applications across industries such as automotive, consumer electronics, telecommunications, medical, and others.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Tariffs have influenced the HDI market by raising costs for imported copper foils, laminates, specialty chemicals, and fabrication equipment essential for multilayer PCB production. Electronics, automotive, telecommunications, and medical device sectors across Asia-Pacific, North America, and Europe face increased production expenses and extended lead times. Nonetheless, tariffs are encouraging domestic PCB manufacturing capacity, promoting localized sourcing of advanced substrates, and supporting innovation in cost-optimized HDI board designs that enhance long-term industry resilience.

The high-density interconnect research report is one of a series of new reports from The Business Research Company that provides high-density interconnect market statistics, including the high-density interconnect industry's global market size, regional shares, competitors with high-density interconnect market share, detailed high-density interconnect market segments, market trends and opportunities, and any further data you may need to thrive in the high-density interconnect industry. This high-density interconnect market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The high density interconnect market size has grown strongly in recent years. It will grow from $17.78 billion in 2025 to $19.47 billion in 2026 at a compound annual growth rate (CAGR) of 9.5%. The growth in the historic period can be attributed to growth in consumer electronics miniaturization, early adoption of multilayer pcb structures, expansion in telecommunications hardware, increasing use of compact boards in medical devices, reliance on hd pcbs in automotive electronics.

The high density interconnect market size is expected to see rapid growth in the next few years. It will grow to $28.82 billion in 2030 at a compound annual growth rate (CAGR) of 10.3%. The growth in the forecast period can be attributed to increasing demand for high-density circuit designs, expansion of 5g and advanced telecom networks, growth in electric vehicle electronics, development of compact high-speed pcbs, rising adoption of rigid-flex and multi-layer interconnects. Major trends in the forecast period include adoption of intelligent hdi manufacturing processes, expansion of IoT-integrated pcb platforms, development of high-density digital interconnect solutions, advancement of electrification-ready miniaturized boards, integration of robotics-driven pcb assembly.

The increasing application of the automotive industry is expected to drive the growth of the high-density interconnect (HDI) market in the coming years. The automotive industry encompasses a wide range of organizations involved in the design, development, manufacturing, marketing, sale, and maintenance of motor vehicles. HDI technology offers numerous advantages for the automotive sector, including enhanced performance, improved reliability, better signal transfer, miniaturized components, and cost efficiencies. For instance, in March 2025, the European Commission, the executive body of the European Union, reported growth in new passenger vehicle registrations, with battery electric vehicle (BEV) sales increasing by 27.7% and accounting for over 13% of total sales for the year. The Commission plans to strengthen autonomous vehicle regulations and, in collaboration with private partners, invest approximately USD 1.16 billion (€1 billion) by 2027. Therefore, the expanding automotive sector is driving the HDI market.

Major companies in the HDI market are expanding manufacturing capacities and introducing advanced HDI technologies to meet the growing demand for compact, high-performance electronic systems. HDI printed circuit boards are specialized PCBs that feature finer lines, microvias, and high layer densities, enabling faster signal transmission, improved reliability, and miniaturized electronic designs. For example, in February 2025, TTM Technologies Inc., a US-based leading PCB manufacturer, announced the expansion of its Ultra-HDI PCB production facility in Syracuse, New York. The facility enhances TTM's capability to produce next-generation Ultra-HDI boards for applications such as 5G infrastructure, artificial intelligence hardware, and advanced automotive electronics. The expansion incorporates state-of-the-art laser drilling, sequential lamination, and imaging technologies, allowing production of circuit boards with extremely fine feature sizes and improved electrical performance. This development strengthens TTM's market position and supports the growing global demand for smaller, faster, and more efficient electronic devices.

In October 2024, DuPont, a US-based provider of advanced HDI and thermal management solutions, partnered with Zhen Ding Technology Group for an undisclosed amount. The partnership aims to jointly advance high-end PCB technology, enhance end-user applications, and improve material performance. Zhen Ding Technology Group is a China-based company specializing in the design, development, and manufacturing of printed circuit boards (PCBs).

Major companies operating in the high density interconnect market are Unimicron Technology Corporation, TTM Technologies Inc., Austria Technologie & Systemtechnik AG, Zhen Ding Tech. Group, Meiko Electronics Co. Ltd., Fujitsu Limited, Multek Corporation, NCAB Group, Sierra Circuits Inc., Ibiden Co. Ltd., Samsung Electro-Mechanics, Unitech Printed Circuit Board Corp., CMK Corporation, Nan Ya Printed Circuit Board Corporation, RayMing Technology Co.Ltd, Advanced Circuits Inc., Calumet Electronics Corporation, ChinaPCBOne Technology Limited, Epec Engineered Technologies, Flex PCB Inc., Hemeixin Electronics Co. Limited, King Sun PCB Technology Co. Ltd., Moko Technology Limited, RUSH PCB Inc, XPCB Limited, Sunstone Circuits LLC, 3CEMS Group.

Asia-Pacific was the largest region in the high-density interconnect market in 2025 and is expected to be the fastest-growing region in the high-density interconnect market report during the forecast period. The regions covered in the high density interconnect market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the high density interconnect market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The high-density interconnect market consists of sales of dielectric or impedance, rogers PCB, rogers PCB with heavy copper, ENEPIG (electroless nickel electroless palladium immersion gold), and RoHS (restriction of hazardous substances) compliance. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

High Density Interconnect Market Global Report 2026 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses high density interconnect market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for high density interconnect ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The high density interconnect market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
• The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
• The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
• The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
• The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
• The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
• Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.

Scope

• Markets Covered:1) By Type: Single Panel; Double Panel; Other Types
• 2) By Substrate: Rigid; Flexible; Rigid-Flex
• 3) By End User: Automotive; Consumer Electronics; Telecommunications; Medical; Other End-Users
• Subsegments:
• 1) By Single Panel: Standard Single-Sided HDI; Advanced Single-Sided HDI
• 2) By Double Panel: Standard Double-Sided HDI; Advanced Double-Sided HDI
• 3) By Other Types: Multi-layer HDI Boards; Flex And Rigid-Flex HDI Boards; Blind And Buried Via HDI Boards
• Companies Mentioned: Unimicron Technology Corporation; TTM Technologies Inc.; Austria Technologie & Systemtechnik AG; Zhen Ding Tech. Group; Meiko Electronics Co. Ltd.; Fujitsu Limited; Multek Corporation; NCAB Group; Sierra Circuits Inc.; Ibiden Co. Ltd.; Samsung Electro-Mechanics; Unitech Printed Circuit Board Corp.; CMK Corporation; Nan Ya Printed Circuit Board Corporation; RayMing Technology Co.Ltd; Advanced Circuits Inc.; Calumet Electronics Corporation; ChinaPCBOne Technology Limited; Epec Engineered Technologies; Flex PCB Inc.; Hemeixin Electronics Co. Limited; King Sun PCB Technology Co. Ltd.; Moko Technology Limited; RUSH PCB Inc; XPCB Limited; Sunstone Circuits LLC; 3CEMS Group.
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
• Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time Series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
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