PUBLISHER: Grand View Research | PRODUCT CODE: 1728024
PUBLISHER: Grand View Research | PRODUCT CODE: 1728024
The global die bonder equipment market size was estimated at USD 1.88 billion in 2024 and is projected to grow at a CAGR of 3.6% from 2025 to 2030. The market is currently experiencing robust growth, attributed largely to the increasing demand for semiconductor devices across various industries, including automotive, consumer electronics, and IT & telecommunications. This surge in demand is fueled by ongoing technological advancements and the growing need for high-performance and miniaturized electronic components. As devices become more integrated and complex, the precision and efficiency offered by die bonder equipment become crucial, driving manufacturers to invest in the latest technologies to stay competitive.
Advancements in die bonding technologies, such as the development of automated and semi-automated systems, are significantly contributing to the market's growth. These technologies not only improve the throughput and accuracy of the die bonding process but also reduce the likelihood of human error, ensuring higher product reliability. Furthermore, the push for electric vehicles and the expansion of 5G networks globally are creating substantial opportunities for die bonder equipment manufacturers, as these sectors require sophisticated semiconductors produced with high-precision equipment.
Die bonder equipment varies significantly in terms of precision, speed, and bonding techniques to meet the diverse needs of different semiconductor devices and applications. It is a sophisticated piece of machinery designed to handle the delicate process of placing and securing dies, requiring precision alignment and bonding capabilities to ensure high yields and reliability of the final electronic component.
The exponential growth of the market is fueled by the escalating demand for semiconductor devices across diverse sectors, including automotive, consumer electronics, and healthcare. This surge is significantly attributed to technological advancements, such as the fabrication of intricate microelectronic devices, the ongoing trend of component miniaturization, and the introduction of 5G technology, all of which necessitate refined die bonding techniques. Moreover, the shift towards automation and the incorporation of artificial intelligence in manufacturing processes underscore the need for more sophisticated, efficient, and precise die bonder equipment, bolstering the market's expansion.
With the rapid expansion of the Internet of Things (IoT), wearable technology, and smart devices, there is a significant opportunity for the market to expand its reach. The automotive industry, with its increasing focus on electric vehicles (EVs) and autonomous vehicles, presents another lucrative segment for growth. These sectors require high reliability and quality in semiconductor devices, which can only be achieved with advanced packaging technologies, thereby creating opportunities for innovations and advancements in die-bonding equipment. In addition, the push towards renewable energy and power electronics offers new avenues for the application of die-bonding technology.
Global Die Bonder Equipment Market Report Segmentation
This report forecasts revenue growth at global, regional, and country levels and analyzes the latest industry trends in each sub-segment from 2018 to 2030. For this study, Grand View Research has segmented the global die bonder equipment market report based on type, bonding technique, application, and region: