PUBLISHER: TechNavio | PRODUCT CODE: 1719447
PUBLISHER: TechNavio | PRODUCT CODE: 1719447
The die bonder equipment market is forecasted to grow by USD 202.4 mn during 2024-2029, accelerating at a CAGR of 4.2% during the forecast period. The report on the die bonder equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by rising demand for high-quality semiconductor ics for wireless devices and iot applications, rising electronics production globally, and increasing complexity of semiconductor ic designs.
Market Scope | |
---|---|
Base Year | 2025 |
End Year | 2029 |
Series Year | 2025-2029 |
Growth Momentum | Accelerate |
YOY 2025 | 4% |
CAGR | 4.2% |
Incremental Value | $202.4 mn |
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.
Technavio's die bonder equipment market is segmented as below:
By End-user
By Type
By Technique
By Application
By Geographical Landscape
This study identifies the integration of ai and ml on die bonder equipment as one of the prime reasons driving the die bonder equipment market growth during the next few years. Also, emergence of fowlp technology and growing popularity of laser-assisted bonding technology will lead to sizable demand in the market.
The report on the die bonder equipment market covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading die bonder equipment market vendors that include ASMPT Ltd., BE Semiconductor Industries NV, Dr. Tresky AG, FASFORD TECHNOLOGY Co. Ltd., ficonTEC Service GmbH, Finetech GmbH and Co. KG, HYBOND Inc., Kulicke and Soffa Industries Inc., Mycronic AB, Palomar Technologies Inc., Panasonic Holdings Corp., Paroteq GmbH, SET Corp SA, Shibaura Mechatronics Corp., SHIBUYA Corp., Shinkawa Ltd., TORAY ENGINEERING Co. Ltd., and WestBond Inc.. Also, the die bonder equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
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