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PUBLISHER: IDC | PRODUCT CODE: 1354201

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PUBLISHER: IDC | PRODUCT CODE: 1354201

Worldwide Outsourced Semiconductor Assembly and Test Manufacturing Market Share, 2022 - Vendor Ranking and Insight

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PAGES: 22 Pages
DELIVERY TIME: 1-2 business days
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USD 7500

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This IDC study explores the revenue performance, technological evolution, and business development of worldwide OSAT vendors in 2022, and explore future development trends."OSAT is at the core of the downstreamportion of the semiconductor industry chain and is critical to the final quality and performance of chips. With the development of HPC, AI, and ML, advanced packaging will tend to experience heterogeneous integration from 2D to 2.5D/3D. It is expected that manufacturers will increase their investment to meet the huge market demand," says Galen Zeng, senior research manager at IDC.

Product Code: US50502223

IDC Market Share Figure

Executive Summary

Advice for Technology Suppliers

Market Share

Who Shaped the Year

  • ASE
  • Amkor
  • JCET
  • TFME
  • PTI
  • Tianshui Huatian
  • KYEC
  • Chipbond and ChipMOS
  • Sigurd

Market Context

  • Packaging Technology Development
  • Capex
  • Significant Market Developments
    • Regional Revenue Share
  • Heterogeneous Integration - Taking ASE, an ASM Leader, as an Example
  • Review of 2022 and Outlook for 2023

Methodology

Market Definition

Related Research

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