Outsourced Semiconductor Assembly & Test Services Market by Service Type, Packaging Type, End-User

Description

List of Tables

[189 Pages Report] The Outsourced Semiconductor Assembly & Test Services Market size was estimated at USD 33.34 billion in 2023 and expected to reach USD 35.62 billion in 2024, at a CAGR 7.62% to reach USD 55.75 billion by 2030.

Outsourcing to third-party vendors allows semiconductor companies to leverage the vendor's equipment and knowledge base rather than investing in costly infrastructure themselves. The trend of outsourcing began with offshoring assembly, testing, and packaging facilities, which expanded to global partnerships with vendors and has facilitated the Outsourced Semiconductor Assembly & Test Services (OSAT) market to grow over the forecasted period. Increasing demand for electronics products, rising complexity of semiconductor designs and technological advancements leading to cost-effective production solutions, and a shift from traditional to more specialized service delivery models further drive the market growth. However, the market for OSAT has been impacted by several trends, including increased demand for advanced packaging techniques and the push toward more automation to reduce costs and elevate quality. Moreover, the ongoing semiconductor shortage has driven many chipmakers toward outsourcing to bolster production capacity. However, high costs associated with new product development and innovation and the presence of counterfeit components are some major challenges the industry faces. OSAT service providers should focus on providing services that are tailored to their individual customer's needs and develop a competitive edge by investing in personnel training and development programs to ensure they have qualified professionals performing specialized tasks such as wafer fabrication and packaging.

KEY MARKET STATISTICS
Base Year [2023]	USD 33.34 billion
Estimated Year [2024]	USD 35.62 billion
Forecast Year [2030]	USD 55.75 billion
CAGR (%)	7.62%

Service Type: Emerging need for assembly & packaging services for improving product durability and performance

Assembly and packaging services are critical in the semiconductor manufacturing process, transforming bare semiconductors into functional, market-ready products. This service includes die preparation, substrate attachment, wire bonding, encapsulation, and final inspection. Companies may opt for advanced assembly and packaging services to enhance product durability, performance, and miniaturization. The choice largely depends on the application field, whether it be consumer electronics, automotive, or high-performance computing. Testing services encompass a series of checks performed on semiconductor devices before they are shipped out, ensuring they meet the required specifications and performance standards. This includes wafer probing, final tests, and inspections. Preference for testing services varies, depending on the reliability requirements of the end application. High-reliability sectors such as automotive and medical devices often require more rigorous and comprehensive testing.

End-User: Expanding ownership of consumer electronics such as smartphones and wearable devices

The computer and networking sector includes manufacturers and service providers catering to the computing and networking industry, focusing on personal computers, servers, and networking equipment. The need-based preference here leans towards high performance, reliability, and integration capabilities. Innovations and collaborations often revolve around enhancing computational power and energy efficiency. Consumer electronics cover a wide range of products, from smartphones to home appliances. The primary needs in this sector include compactness, energy efficiency, and high-volume manufacturing capabilities. Players in this realm are constantly introducing new semiconductor packaging technologies intended to significantly reduce the size and power consumption of chips for mobile devices and other consumer electronics. Industrial electronics comprises devices and systems used in manufacturing, energy, and other industrial sectors. Durability, robustness, and long-term reliability are the critical needs for semiconductors in this sector. The telecommunication sector focuses on infrastructure and devices for communication networks, including 5G technologies. The demand here is for high-speed, high-frequency, and high-reliability semiconductors.

Regional Insights

The global outsourced semiconductor assembly & test services (OSAT) market is expected to expand significantly in the coming years with the increasing demand for advanced semiconductor components and rising adoption of connected technologies. Asia-Pacific has emerged as the dominant market for OSAT services, with China leading the way due to its extensive technological investments and government initiatives aimed at propelling innovation and growth in the semiconductor industry. The region's low cost of labor and raw materials, coupled with the availability of a skilled workforce, has made it an attractive destination for companies looking to outsource their semiconductor manufacturing activities. North America is another significant market for OSAT services, with major players, including Intel Corporation contributing to the region's growth. The region's focus on research and development activities and recent technological advancements are expected to drive growth in the coming years. Europe is catching up with other regions as its governments are investing in encouraging innovation within the semiconductor manufacturing sectors. Countries such as Germany, the UK, and France are heading these initiatives, providing a favorable environment for businesses expecting to expand their regional operations. South America offers immense potential for OSAT services, with several countries with existing infrastructure for creating advanced chipsets and other components used in semiconductor assemblies and testing processes. The region's growing importance of digitalization is expected to drive demand for these services, making it an attractive market for companies trying to expand their operations.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Outsourced Semiconductor Assembly & Test Services Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Outsourced Semiconductor Assembly & Test Services Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Outsourced Semiconductor Assembly & Test Services Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Technology Holding Co, Ltd., AT Semicon Co., Ltd., Bluetest Testservice GmbH, Carsem (M) Sdn Bhd, Chipbond Technology Corporation, Chipmos Technologies Inc., Doosan Corporation, EV Group, Formosa Advanced Technologies Co., Ltd., GEM Electronics (Shanghai) Co., Ltd., Greatek Electronics Inc., HANA Micron Inc., Inari Amertron Berhad, Integra Technologies, Integrated Micro-electronics Inc., Jiangsu Changdian Technology Co., Ltd., King Yuan ELECTRONICS CO., LTD., LB Semicon, Lingsen Precision Industries , LTD., LIPAC Co., Ltd., Natronix Semiconductor Technology Pte Ltd., Nepes Corporation, ORIENT SEMICONDUCTOR ELECTRONICS LIMITED, Powertech Technology Inc., Samsung Electronics Co., Ltd., Sanmina Corporation, Tongfu Microelectronics Co., Ltd., Unisem Group, UTAC Holdings Ltd., Walton Advanced Engineering, Inc., and yieldwerx.

Market Segmentation & Coverage

This research report categorizes the Outsourced Semiconductor Assembly & Test Services Market to forecast the revenues and analyze trends in each of the following sub-markets:

Service Type
- Assembly & Packaging
- Testing

Packaging Type
- Flip Chip
- Wafer Level
- Wire Bond

End-User
- Computer & Networking
- Consumer Electronics
- Industrial Electronics
- Telecommunication

Region
- Americas
  - Argentina
  - Brazil
  - Canada
  - Mexico
  - United States
    - California
    - Florida
    - Illinois
    - New York
    - Ohio
    - Pennsylvania
    - Texas
- Asia-Pacific
  - Australia
  - China
  - India
  - Indonesia
  - Japan
  - Malaysia
  - Philippines
  - Singapore
  - South Korea
  - Taiwan
  - Thailand
  - Vietnam

Europe, Middle East & Africa
- Denmark
- Egypt
- Finland
- France
- Germany
- Israel
- Italy
- Netherlands
- Nigeria
- Norway
- Poland
- Qatar
- Russia
- Saudi Arabia
- South Africa
- Spain
- Sweden
- Switzerland
- Turkey
- United Arab Emirates
- United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Outsourced Semiconductor Assembly & Test Services Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Outsourced Semiconductor Assembly & Test Services Market?

3. What are the technology trends and regulatory frameworks in the Outsourced Semiconductor Assembly & Test Services Market?

4. What is the market share of the leading vendors in the Outsourced Semiconductor Assembly & Test Services Market?

5. Which modes and strategic moves are suitable for entering the Outsourced Semiconductor Assembly & Test Services Market?

Product Code: MRR-742BD5182FC0

1. Preface

1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders

2. Research Methodology

2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

5.1. Market Dynamics
- 5.1.1. Drivers
  - 5.1.1.1. Public-private initiatives and incentives for semiconductor manufacturing
  - 5.1.1.2. Growth in production of industrial electronics and medical devices
  - 5.1.1.3. Significant inclination toward cost effective outsourced services
- 5.1.2. Restraints
  - 5.1.2.1. Hidden unforeseen cost and limited flexibility in operations
- 5.1.3. Opportunities
  - 5.1.3.1. Deployment of intelligent system in OSAT services
  - 5.1.3.2. Rising investments and technologies for advanced packaging and testing
- 5.1.4. Challenges
  - 5.1.4.1. Limited control over operations and data security concerns
5.2. Market Segmentation Analysis
- 5.2.1. Service Type: Emerging need for assembly & packaging services for improving product durability and performance
- 5.2.2. End-User: Expanding ownership of consumer electronics such as smartphones and wearable devices
5.3. Market Trend Analysis
- 5.3.1. Strategic government investments support the expansion of the semiconductor industry and related services in the Americas
- 5.3.2. Powerful competitors and ongoing technological advancements broadens the OSAT market's potential in the APAC region.
- 5.3.3. Expanding end-user demand for semiconductor chips and potential localization of IC production in EMEA
5.4. Cumulative Impact of Russia-Ukraine Conflict
5.5. Cumulative Impact of High Inflation
5.6. Porter's Five Forces Analysis
- 5.6.1. Threat of New Entrants
- 5.6.2. Threat of Substitutes
- 5.6.3. Bargaining Power of Customers
- 5.6.4. Bargaining Power of Suppliers
- 5.6.5. Industry Rivalry
5.7. Value Chain & Critical Path Analysis
5.8. Regulatory Framework Analysis
5.9. Client Customization

6. Outsourced Semiconductor Assembly & Test Services Market, by Service Type

6.1. Introduction
6.2. Assembly & Packaging
6.3. Testing

7. Outsourced Semiconductor Assembly & Test Services Market, by Packaging Type

7.1. Introduction
7.2. Flip Chip
7.3. Wafer Level
7.4. Wire Bond

8. Outsourced Semiconductor Assembly & Test Services Market, by End-User

8.1. Introduction
8.2. Computer & Networking
8.3. Consumer Electronics
8.4. Industrial Electronics
8.5. Telecommunication

9. Americas Outsourced Semiconductor Assembly & Test Services Market

9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States

10. Asia-Pacific Outsourced Semiconductor Assembly & Test Services Market

10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam

11. Europe, Middle East & Africa Outsourced Semiconductor Assembly & Test Services Market

11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom

12. Competitive Landscape

12.1. Market Share Analysis, 2023
12.2. FPNV Positioning Matrix, 2023
12.3. Competitive Scenario Analysis
- 12.3.1. Siemens Collaborates with SPIL to Deliver a 3D Verification Workflow for Fan-out Wafer-level Packaging
- 12.3.2. Tata Group's Expansion in Electronics and Semiconductor Business
- 12.3.3. Alchip Technologies Announces 3DFabric Alliance Support Plans
- 12.3.4. India Close to Getting a USD 1 Billion Micron Technology Semiconductor Plant
- 12.3.5. Amkor Expands Power Solutions for Automotive Electrification
- 12.3.6. Amkor Expands Power Solutions for Automotive Electrification
- 12.3.7. Amkor and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
- 12.3.8. Tuv Nord Group Acquires Majority Stake in HTV
- 12.3.9. Integra Technologies Selects Kansas for Largest OSAT Semiconductor Project
- 12.3.10. TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
- 12.3.11. Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
- 12.3.12. Worldwide Semiconductor Assembly And Test Facility Database Now Tracks Integrated Device Manufacturers, 475 Facilities

13. Competitive Portfolio

13.1. Key Company Profiles
13.2. Key Product Portfolio