Worldwide Semiconductor Advanced Packaging Forecast and Analysis, 2025-2030

This IDC Market Forecast provides an analysis and forecast for the advanced packaging market from 2025 to 2030, covering revenue, technology developments, and the competitive landscape."Advanced packaging are advancing towards greater integration, with technologies such as CoWoS-S/R/L, SoIC, and System-on-Wafer playing pivotal roles in the AI era. In response to the demand for AI GPUs and AI ASICs, leading foundry TSMC is expanding its CoWoS capacity to 1.08 million wafers per year in 2026, a substantial 64.0% increase, with further expansion to 1.47 million wafers projected for 2027. Additionally, companies like ASE, KYEC, Amkor, and Intel are actively engaging in the supply chain to take on spillover orders. Looking ahead, with the increasing requirements of end-user applications for computing performance and power consumption efficiency, advanced packaging will play a more critical role in continuing to promote technological innovation and value creation in the semiconductors industry." - Senior Research Manager Galen Zeng, IDC