Picture
SEARCH
What are you looking for?
Need help finding what you are looking for? Contact Us
Compare

PUBLISHER: MIC - Market Intelligence & Consulting Institute | PRODUCT CODE: 1394565

Cover Image

PUBLISHER: MIC - Market Intelligence & Consulting Institute | PRODUCT CODE: 1394565

2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry

PUBLISHED:
PAGES: 17 Pages
DELIVERY TIME: 1-2 business days
SELECT AN OPTION
PDF (Single User License)
USD 1600

Add to Cart

Executive Summary

In 2022, the semiconductor industry continued to grapple with weak consumption momentum in major economies, primarily due to adverse factors such as high inflation rates and the Russia-Ukraine war. Since the first half of 2022, global chip supply has surpassed demand, marking the end of the price and shipment volume surge that witnessed in the IC packaging and testing industry in 2021. Shipment value of the global IC packaging and testing industry, also known as the OSAT (Outsourced Semiconductor Assembly and Testing) industry, reached nearly US$40 billion in 2022, representing modest year-on-year growth of 1.3% compared to 2021. This report examines the developments of the global IC packaging and testing industry and key industry players throughout 2022; it also explores the development of the global IC packaging and testing industry amid declining consumer electronics demand and the volatile global economy.

Product Code: SCRPT23113001

Table of Contents

Table of Contents

1. Recap of the Global IC Packaging and Testing Industry in 2022

  • 1.1 Market Size and Top Ten OSAT Rankings in the Global IC Packaging and Testing Industry in 2022
  • 1.2 Overall Performance of the Global IC Packaging and Testing Industry in 2022

2.Operational Performance of Major OSAT Companies in 2022

  • 2.1 ASE Holdings, PTI, KYEC
  • 2.2 Amkor, JCET

3. Outlook for the Global IC Packaging and Testing Industry

  • 3.1 OSATs Shifting Focus to Automotive Chips While Consumer Electronics Demand Weakening
  • 3.2 Leading Players Accelerate Advanced Packaging Technology Development to Meet Emerging HPC and AI Application Trends

Appendix

  • List of Companies

List of Tables

  • Table 1 Global Top Ten OSAT Rankings in 2022

List of Figures

  • Figure 1: Revenue Changes of Major OSAT Companies, 1Q22 - 2Q23
  • Figure 2: Gross Margin Changes of Major OSAT Companies, 1Q22 - 2Q23
  • Figure 3: ASE ATM’s Revenue Changes by Product Application, 2020 - 2022
  • Figure 4: ASE ATM’s Revenue Changes by Packaging & Testing Product Portfolio, 2020 - 2022
  • Figure 5: PTI's Revenue Changes by Services, 2020 - 2022
  • Figure 6: PTI's Revenue Changes by Products, 2020 - 2022
  • Figure 7: KYEC's Revenue Changes by Process Nodes, 2020 - 2022
  • Figure 8: KYEC's Revenue Changes by Product Applications, 2020 - 2022
  • Figure 9: Amkor's Revenue Changes by Packaging & Testing Types, 2020 - 2022
  • Figure 10: Amkor's Revenue Changes by End Product Applications, 2020 - 2022
  • Figure 11: JCET's Revenue Changes by End-Product Applications, 2021 - 2022
  • Figure 12: Revenue Changes in Major OSAT Companies' Computing Business in 2022
Product Code: SCRPT23113001

List of Topics

/

Companies covered

AMD
Amkor
Analog Devices
ASE
Chipbond
Chrysler
Ford
General Motors
GlobalFoundries
Greatek Electronics
Hana Micron
Huatian Technology
Intel
JCET
Longsys
MediaTek
Micron Technology
Nanya
Nvidia
OpenAI
Powertech Technology
PTI
Samsung
Sigurd Microelectronics
SK Hynix
SPIL
STATS ChipPAC
Tera Probe
TeraPower Technology
TFME
TSMC
Xilinx

Have a question?
Picture

Jeroen Van Heghe

Manager - EMEA

+32-2-535-7543

Picture

Christine Sirois

Manager - Americas

+1-860-674-8796

Questions? Please give us a call or visit the contact form.
Hi, how can we help?
Contact us!