Radiation-Hardened Electronics for Space Application Market by Manufacturing Technique, Component

Description

List of Tables

[195 Pages Report] The Radiation-Hardened Electronics for Space Application Market size was estimated at USD 934.89 million in 2023 and expected to reach USD 962.92 million in 2024, at a CAGR 6.03% to reach USD 1,409.23 million by 2030.

Global Radiation-Hardened Electronics for Space Application Market

KEY MARKET STATISTICS
Base Year [2023]	USD 934.89 million
Estimated Year [2024]	USD 962.92 million
Forecast Year [2030]	USD 1,409.23 million
CAGR (%)	6.03%

Radiation-Hardened Electronics for Space Application Market - IMG1

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Radiation-Hardened Electronics for Space Application Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Radiation-Hardened Electronics for Space Application Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Radiation-Hardened Electronics for Space Application Market, highlighting leading vendors and their innovative profiles. These include Advanced Micro Devices, Inc., Analog Devices, Inc., Arquimea Group, SA, BAE Systems PLC, City Labs Inc., Cobham Advanced Electronic Solutions, Data Device Corporation by Transdigm Group, Inc., Everspin Technologies Inc., Honeywell International Inc., Infineon Technologies AG, Mercury Systems, Inc., Microchip Technology Inc., PCB Piezotronics, Inc., Presto Engineering, Inc., pSemi Corporation by Murata Manufacturing Co., Ltd., Renesas Electronics Corporation, Saphyrion Sagl, Semiconductor Components Industries, LLC, STMicroelectronics International N.V., Synopsys, Inc., Teledyne Technologies Incorporated, Texas Instruments Incorporated, TT Electronics PLC, TTM Technologies, Inc., and VORAGO Technologies.

Market Segmentation & Coverage

This research report categorizes the Radiation-Hardened Electronics for Space Application Market to forecast the revenues and analyze trends in each of the following sub-markets:

Manufacturing Technique
- Radiation Hardening by Design (RHBD)
- Radiation Hardening by Process (RHBP)
Component
- Memory
- Power Management
- Processors & Controllers
Region
- Americas
  - Argentina
  - Brazil
  - Canada
  - Mexico
  - United States
    - California
    - Florida
    - Illinois
    - New York
    - Ohio
    - Pennsylvania
    - Texas
- Asia-Pacific
  - Australia
  - China
  - India
  - Indonesia
  - Japan
  - Malaysia
  - Philippines
  - Singapore
  - South Korea
  - Taiwan
  - Thailand
  - Vietnam
- Europe, Middle East & Africa
  - Denmark
  - Egypt
  - Finland
  - France
  - Germany
  - Israel
  - Italy
  - Netherlands
  - Nigeria
  - Norway
  - Poland
  - Qatar
  - Russia
  - Saudi Arabia
  - South Africa
  - Spain
  - Sweden
  - Switzerland
  - Turkey
  - United Arab Emirates
  - United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Radiation-Hardened Electronics for Space Application Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Radiation-Hardened Electronics for Space Application Market?

3. What are the technology trends and regulatory frameworks in the Radiation-Hardened Electronics for Space Application Market?

4. What is the market share of the leading vendors in the Radiation-Hardened Electronics for Space Application Market?

5. Which modes and strategic moves are suitable for entering the Radiation-Hardened Electronics for Space Application Market?

Product Code: MRR-5C6F41F5B01A

1. Preface

1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology

2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

4.1. Introduction
4.2. Radiation-Hardened Electronics for Space Application Market, by Region

5. Market Insights

5.1. Market Dynamics
- 5.1.1. Drivers
  - 5.1.1.1. Increasing surveillance, intelligence, and reconnaissance (ISR) operations globally
  - 5.1.1.2. Growing satellite launches and deep space activities
- 5.1.2. Restraints
  - 5.1.2.1. High cost development and designing associated with radiation-hardened electronic components
- 5.1.3. Opportunities
  - 5.1.3.1. Robust research on advancing radiation-hardened electronics
  - 5.1.3.2. Rising investments and funding activities for space activities
- 5.1.4. Challenges
  - 5.1.4.1. Difficulties in testing of radiation-hardened electronics
5.2. Market Segmentation Analysis
5.3. Market Trend Analysis
5.4. Cumulative Impact of High Inflation
5.5. Porter's Five Forces Analysis
- 5.5.1. Threat of New Entrants
- 5.5.2. Threat of Substitutes
- 5.5.3. Bargaining Power of Customers
- 5.5.4. Bargaining Power of Suppliers
- 5.5.5. Industry Rivalry
5.6. Value Chain & Critical Path Analysis
5.7. Regulatory Framework

6. Radiation-Hardened Electronics for Space Application Market, by Manufacturing Technique

6.1. Introduction
6.2. Radiation Hardening by Design (RHBD)
6.3. Radiation Hardening by Process (RHBP)

7. Radiation-Hardened Electronics for Space Application Market, by Component

7.1. Introduction
7.2. Memory
7.3. Power Management
7.4. Processors & Controllers

8. Americas Radiation-Hardened Electronics for Space Application Market

8.1. Introduction
8.2. Argentina
8.3. Brazil
8.4. Canada
8.5. Mexico
8.6. United States

9. Asia-Pacific Radiation-Hardened Electronics for Space Application Market

9.1. Introduction
9.2. Australia
9.3. China
9.4. India
9.5. Indonesia
9.6. Japan
9.7. Malaysia
9.8. Philippines
9.9. Singapore
9.10. South Korea
9.11. Taiwan
9.12. Thailand
9.13. Vietnam

10. Europe, Middle East & Africa Radiation-Hardened Electronics for Space Application Market

10.1. Introduction
10.2. Denmark
10.3. Egypt
10.4. Finland
10.5. France
10.6. Germany
10.7. Israel
10.8. Italy
10.9. Netherlands
10.10. Nigeria
10.11. Norway
10.12. Poland
10.13. Qatar
10.14. Russia
10.15. Saudi Arabia
10.16. South Africa
10.17. Spain
10.18. Sweden
10.19. Switzerland
10.20. Turkey
10.21. United Arab Emirates
10.22. United Kingdom

11. Competitive Landscape

11.1. FPNV Positioning Matrix
11.2. Market Share Analysis, By Key Player
11.3. Competitive Scenario Analysis, By Key Player

12. Competitive Portfolio

12.1. Key Company Profiles
- 12.1.1. Advanced Micro Devices, Inc.
- 12.1.2. Analog Devices, Inc.
- 12.1.3. Arquimea Group, SA
- 12.1.4. BAE Systems PLC
- 12.1.5. City Labs Inc.
- 12.1.6. Cobham Advanced Electronic Solutions
- 12.1.7. Data Device Corporation by Transdigm Group, Inc.
- 12.1.8. Everspin Technologies Inc.
- 12.1.9. Honeywell International Inc.
- 12.1.10. Infineon Technologies AG
- 12.1.11. Mercury Systems, Inc.
- 12.1.12. Microchip Technology Inc.
- 12.1.13. PCB Piezotronics, Inc.
- 12.1.14. Presto Engineering, Inc.
- 12.1.15. pSemi Corporation by Murata Manufacturing Co., Ltd.
- 12.1.16. Renesas Electronics Corporation
- 12.1.17. Saphyrion Sagl
- 12.1.18. Semiconductor Components Industries, LLC
- 12.1.19. STMicroelectronics International N.V.
- 12.1.20. Synopsys, Inc.
- 12.1.21. Teledyne Technologies Incorporated
- 12.1.22. Texas Instruments Incorporated
- 12.1.23. TT Electronics PLC
- 12.1.24. TTM Technologies, Inc.
- 12.1.25. VORAGO Technologies
12.2. Key Product Portfolio

13. Appendix

13.1. Discussion Guide
13.2. License & Pricing