Europe Wafer Level Packaging Market Size, Share & Industry Trends Analysis Report By End User (Consumer Electronics, Automotive, Healthcare, IT & Telecommunication), By Type, By Country and Growth Forecast, 2022

List of Tables

The Europe Wafer Level Packaging Market would witness market growth of 16.9% CAGR during the forecast period (2022-2028).

Manufacturers will continue to invest in this technology due to market trends, such as lower circuit packaging costs, better design increased flexibility and physical performance, and higher investment in research and development operations. STATS ChipPAC, an advanced packaging and semiconductor testing service provider, stated in 2020 that their integrated Wafer-Level Ball Grid Array technology would be expanded to rebuild 300mm wafers. As they added capabilities through 300mm wafer manufacturing, STATS ChipPAC's customers did benefit from the productivity and cost advantages of eWLB technology on the bigger 300mm reconstructed wafer format, which offers higher efficiency and economies of scale than the existing 200mm eWLB wafer format.

The European Semiconductor Industry Association, or ESIA, is the European Semiconductor Industry's representative. Its aim is to advocate and promote the common interests of Europe's semiconductor sector to European Institutions as well as stakeholders in order to ensure a stable business climate and boost global competitiveness. The industry offers novel solutions for the development of regional industries, boosting the economic progress and reacting to critical societal concerns as a provider of key supporting technologies. The European Semiconductor Ecosystem supports around 200.000 direct jobs and up to 1.000.000 affected jobs in systems, applications, and services in Europe, according to the European Commission, making it the most R&D-intensive sector. Overall, micro and nanoelectronics enable Europe along with the rest of the world to generate at least 10% of GDP.

The Germany market dominated the Europe Wafer Level Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $806.1 million by 2028. The UK market is anticipated to grow at a CAGR of 15.9% during (2022 - 2028). Additionally, The France market would showcase a CAGR of 17.7% during (2022 - 2028).

Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.

Scope of the Study

Market Segments covered in the Report:

By End User

Consumer Electronics
Automotive
Healthcare
IT & Telecommunication
Others

By Type

WLCSP
2.5D TSV WLP
3D TSV WLP
Nano WLP
Others

By Technology

Fan IN
Fan OUT

By Country

Germany
UK
France
Russia
Spain
Italy
Rest of Europe

Companies Profiled

ASML Holding N.V.
Fujitsu Limited
Toshiba Corporation
Qualcomm, Inc.
Amkor Technology, Inc.
Deca Technologies, Inc.
Jiangsu Changjing Electronics Technology Co., Ltd.
Tokyo Electron Ltd.
Applied Materials, Inc.
Lam Research Corporation

Unique Offerings from KBV Research

Exhaustive coverage
Highest number of market tables and figures
Subscription based model available
Guaranteed best price
Assured post sales research support with 10% customization free

Chapter 1. Market Scope & Methodology

1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
- 1.4.1 Europe Wafer Level Packaging Market, by End User
- 1.4.2 Europe Wafer Level Packaging Market, by Type
- 1.4.3 Europe Wafer Level Packaging Market, by Technology
- 1.4.4 Europe Wafer Level Packaging Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview

2.1 Introduction
- 2.1.1 Overview
  - 2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
- 2.2.1 Market Drivers
- 2.2.2 Market Restraints

Chapter 3. Europe Wafer Level Packaging Market by End User

3.1 Europe Consumer Electronics Market by Country
3.2 Europe Automotive Market by Country
3.3 Europe Healthcare Market by Country
3.4 Europe IT & Telecommunication Market by Country
3.5 Europe Others Market by Country

Chapter 4. Europe Wafer Level Packaging Market by Type

4.1 Europe WLCSP Market by Country
4.2 Europe 2.5D TSV WLP Market by Country
4.3 Europe 3D TSV WLP Market by Country
4.4 Europe Nano WLP Market by Country
4.5 Europe Others Market by Country

Chapter 5. Europe Wafer Level Packaging Market by Technology

5.1 Europe Fan IN Market by Country
5.2 Europe Fan OUT Market by Country

Chapter 6. Europe Wafer Level Packaging Market by Country

6.1 Germany Wafer Level Packaging Market
- 6.1.1 Germany Wafer Level Packaging Market by End User
- 6.1.2 Germany Wafer Level Packaging Market by Type
- 6.1.3 Germany Wafer Level Packaging Market by Technology
6.2 UK Wafer Level Packaging Market
- 6.2.1 UK Wafer Level Packaging Market by End User
- 6.2.2 UK Wafer Level Packaging Market by Type
- 6.2.3 UK Wafer Level Packaging Market by Technology
6.3 France Wafer Level Packaging Market
- 6.3.1 France Wafer Level Packaging Market by End User
- 6.3.2 France Wafer Level Packaging Market by Type
- 6.3.3 France Wafer Level Packaging Market by Technology
6.4 Russia Wafer Level Packaging Market
- 6.4.1 Russia Wafer Level Packaging Market by End User
- 6.4.2 Russia Wafer Level Packaging Market by Type
- 6.4.3 Russia Wafer Level Packaging Market by Technology
6.5 Spain Wafer Level Packaging Market
- 6.5.1 Spain Wafer Level Packaging Market by End User
- 6.5.2 Spain Wafer Level Packaging Market by Type
- 6.5.3 Spain Wafer Level Packaging Market by Technology
6.6 Italy Wafer Level Packaging Market
- 6.6.1 Italy Wafer Level Packaging Market by End User
- 6.6.2 Italy Wafer Level Packaging Market by Type
- 6.6.3 Italy Wafer Level Packaging Market by Technology
6.7 Rest of Europe Wafer Level Packaging Market
- 6.7.1 Rest of Europe Wafer Level Packaging Market by End User
- 6.7.2 Rest of Europe Wafer Level Packaging Market by Type
- 6.7.3 Rest of Europe Wafer Level Packaging Market by Technology

Chapter 7. Company Profiles

7.1 ASML Holding N.V.
- 7.1.1 Company Overview
- 7.1.2 Financial Analysis
- 7.1.3 Regional Analysis
- 7.1.4 Research & Development Expenses
7.2 Fujitsu Limited
- 7.2.1 Company Overview
- 7.2.2 Financial Analysis
- 7.2.3 Segmental Analysis
- 7.2.4 SWOT Analysis
7.3 Toshiba Corporation
- 7.3.1 Company Overview
- 7.3.2 Financial Analysis
- 7.3.3 Segmental and Regional Analysis
- 7.3.4 Research and Development Expense
7.4 Qualcomm, Inc.
- 7.4.1 Company Overview
- 7.4.2 Financial Analysis
- 7.4.3 Segmental and Regional Analysis
- 7.4.4 Research & Development Expense
7.5 Amkor Technology, Inc.
- 7.5.1 Company Overview
- 7.5.2 Financial Analysis
- 7.5.3 Regional Analysis
- 7.5.4 Research & Development Expense
7.6 Deca Technologies, Inc.
- 7.6.1 Company Overview
- 7.6.2 Recent strategies and developments:
  - 7.6.2.1 Partnerships, Collaborations, and Agreements:
  - 7.6.2.2 Product Launches and Product Expansions:
7.7 Jiangsu Changjing Electronics Technology Co., Ltd.
- 7.7.1 Company Overview
7.8 Tokyo Electron Ltd.
- 7.8.1 Company Overview
- 7.8.2 Financial Analysis
- 7.8.3 Segmental and Regional Analysis
- 7.8.4 Research & Development Expenses
7.9 Applied Materials, Inc.
- 7.9.1 Company Overview
- 7.9.2 Financial Analysis
- 7.9.3 Segmental and Regional Analysis
- 7.9.4 Research & Development Expenses
7.10. Lam Research Corporation
- 7.10.1 Company Overview
- 7.10.2 Financial Analysis
- 7.10.3 Regional Analysis
- 7.10.4 Research & Development Expenses

LIST OF TABLES

TABLE 1 Europe Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 2 Europe Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 3 Europe Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 4 Europe Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 5 Europe Consumer Electronics Market by Country, 2018 - 2021, USD Million
TABLE 6 Europe Consumer Electronics Market by Country, 2022 - 2028, USD Million
TABLE 7 Europe Automotive Market by Country, 2018 - 2021, USD Million
TABLE 8 Europe Automotive Market by Country, 2022 - 2028, USD Million
TABLE 9 Europe Healthcare Market by Country, 2018 - 2021, USD Million
TABLE 10 Europe Healthcare Market by Country, 2022 - 2028, USD Million
TABLE 11 Europe IT & Telecommunication Market by Country, 2018 - 2021, USD Million
TABLE 12 Europe IT & Telecommunication Market by Country, 2022 - 2028, USD Million
TABLE 13 Europe Others Market by Country, 2018 - 2021, USD Million
TABLE 14 Europe Others Market by Country, 2022 - 2028, USD Million
TABLE 15 Europe Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 16 Europe Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 17 Europe WLCSP Market by Country, 2018 - 2021, USD Million
TABLE 18 Europe WLCSP Market by Country, 2022 - 2028, USD Million
TABLE 19 Europe 2.5D TSV WLP Market by Country, 2018 - 2021, USD Million
TABLE 20 Europe 2.5D TSV WLP Market by Country, 2022 - 2028, USD Million
TABLE 21 Europe 3D TSV WLP Market by Country, 2018 - 2021, USD Million
TABLE 22 Europe 3D TSV WLP Market by Country, 2022 - 2028, USD Million
TABLE 23 Europe Nano WLP Market by Country, 2018 - 2021, USD Million
TABLE 24 Europe Nano WLP Market by Country, 2022 - 2028, USD Million
TABLE 25 Europe Others Market by Country, 2018 - 2021, USD Million
TABLE 26 Europe Others Market by Country, 2022 - 2028, USD Million
TABLE 27 Europe Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 28 Europe Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 29 Europe Fan IN Market by Country, 2018 - 2021, USD Million
TABLE 30 Europe Fan IN Market by Country, 2022 - 2028, USD Million
TABLE 31 Europe Fan OUT Market by Country, 2018 - 2021, USD Million
TABLE 32 Europe Fan OUT Market by Country, 2022 - 2028, USD Million
TABLE 33 Europe Wafer Level Packaging Market by Country, 2018 - 2021, USD Million
TABLE 34 Europe Wafer Level Packaging Market by Country, 2022 - 2028, USD Million
TABLE 35 Germany Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 36 Germany Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 37 Germany Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 38 Germany Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 39 Germany Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 40 Germany Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 41 Germany Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 42 Germany Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 43 UK Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 44 UK Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 45 UK Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 46 UK Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 47 UK Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 48 UK Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 49 UK Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 50 UK Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 51 France Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 52 France Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 53 France Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 54 France Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 55 France Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 56 France Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 57 France Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 58 France Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 59 Russia Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 60 Russia Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 61 Russia Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 62 Russia Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 63 Russia Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 64 Russia Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 65 Russia Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 66 Russia Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 67 Spain Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 68 Spain Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 69 Spain Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 70 Spain Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 71 Spain Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 72 Spain Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 73 Spain Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 74 Spain Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 75 Italy Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 76 Italy Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 77 Italy Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 78 Italy Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 79 Italy Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 80 Italy Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 81 Italy Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 82 Italy Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 83 Rest of Europe Wafer Level Packaging Market, 2018 - 2021, USD Million
TABLE 84 Rest of Europe Wafer Level Packaging Market, 2022 - 2028, USD Million
TABLE 85 Rest of Europe Wafer Level Packaging Market by End User, 2018 - 2021, USD Million
TABLE 86 Rest of Europe Wafer Level Packaging Market by End User, 2022 - 2028, USD Million
TABLE 87 Rest of Europe Wafer Level Packaging Market by Type, 2018 - 2021, USD Million
TABLE 88 Rest of Europe Wafer Level Packaging Market by Type, 2022 - 2028, USD Million
TABLE 89 Rest of Europe Wafer Level Packaging Market by Technology, 2018 - 2021, USD Million
TABLE 90 Rest of Europe Wafer Level Packaging Market by Technology, 2022 - 2028, USD Million
TABLE 91 Key information - ASML Holding N.V.
TABLE 92 Key Information - Fujitsu Limited
TABLE 93 Key Information - Toshiba Corporation
TABLE 94 Key Information - Qualcomm, Inc.
TABLE 95 Key Information - Amkor Technology, Inc.
TABLE 96 Key Information - Deca Technologies, Inc.
TABLE 97 Key Information - Jiangsu Changjing Electronics Technology Co., Ltd.
TABLE 98 Key Information - Tokyo Electron Ltd.
TABLE 99 Key Information - Applied Materials, Inc.
TABLE 100 Key Information - Lam Research Corporation

List of Figures

FIG 1 Methodology for the research
FIG 2 SWOT Analysis: Fujitsu Limited

Europe Wafer Level Packaging Market Size, Share & Industry Trends Analysis Report By End User (Consumer Electronics, Automotive, Healthcare, IT & Telecommunication), By Type, By Country and Growth Forecast, 2022 - 2028

Description

Table of Contents