Europe 3D Stacking Market Size, Share & Industry Trends Analysis Report By Interconnecting Technology, By Method, By Device Type, By End User, By Country and Growth Forecast, 2023

List of Tables

The Europe 3D stacking Market would witness market growth of 19.5% CAGR during the forecast period (2023-2030).

Devices such as smartphones, tablets, and wearables constantly evolve to offer more features and improved performance in a constrained space. 3D stacking addresses this demand by facilitating the integration of diverse functionalities and components in a compact three-dimensional structure. This integration produces more efficient devices with optimized power consumption, increased processing speed, and enhanced thermal management. The memory device structure is optimized using this technology, increasing storage capacity, processing speed, and data handling effectiveness.

3D stacking is gaining traction in memory devices like NAND flash DRAM and logic devices. This allows for higher memory density and faster processing speeds. It uses heterogeneous integration, enabling the combination of different types of chips (e.g., CPUs, GPUs, memory, and sensors) in a single package. Companies are developing advanced packaging technologies, such as through-silicon vias (TSVs) and interposers, to facilitate the stacking of chips. These technologies allow for better connectivity and reduced power consumption.

Germany has been a leader in developing and manufacturing IoT devices and sensors. This technology can enhance the performance and miniaturization of sensors in various applications, including industrial automation, smart cities, and environmental monitoring. The German concept of Industry 4.0 emphasizes the integration of digital technologies into manufacturing processes. It can create compact and efficient electronic components for advanced manufacturing equipment. Germany is a hub for the automotive industry, and connected vehicles are a significant focus. The factors mentioned above will drive the regional market growth.

The Germany market dominated the Europe 3D Stacking Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $194.1 million by 2030. The UK market is exhibiting a CAGR of 18.5% during (2023 - 2030). Additionally, The France market would experience a CAGR of 20.4% during (2023 - 2030).

Based on Interconnecting Technology, the market is segmented into 3D TSV (Through-Silicon Via), Monolithic 3D Integration, and 3D Hybrid Bonding. Based on Method, the market is segmented into Chip-to-Chip, Chip-to-Wafer, Die-to-Die, Wafer-to-Wafer, and Die-to-Wafer. Based on Device Type, the market is segmented into Memory Devices, MEMS/Sensors, LEDs, Logic ICs, Imaging & Optoelectronics, and Others. Based on End User, the market is segmented into Consumer Electronics, Medical Devices/Healthcare, Manufacturing, Communications, Automotive, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Taiwan Semiconductor Manufacturing Company Limited, GLOBALFOUNDRIES Inc., Advanced Micro Devices, Inc., Qualcomm, Inc., Intel Corporation, Samsung Electronics Co., Ltd. (Samsung Group), ASE Group (ASE Technology Holding Co., Ltd.), IBM Corporation, Toshiba Corporation, and STMicroelectronics N.V.

Scope of the Study

Market Segments covered in the Report:

By Interconnecting Technology

3D TSV (Through-Silicon Via)
Monolithic 3D Integration
3D Hybrid Bonding

By Method

Chip-to-Chip
Chip-to-Wafer
Die-to-Die
Wafer-to-Wafer
Die-to-Wafer

By Device Type

Memory Devices
MEMS/Sensors
LEDs
Logic ICs
Imaging & Optoelectronics
Others

By End User

Consumer Electronics
Medical Devices/Healthcare
Manufacturing
Communications
Automotive
Others

By Country

Germany
UK
France
Russia
Spain
Italy
Rest of Europe

Companies Profiled

Taiwan Semiconductor Manufacturing Company Limited
GLOBALFOUNDRIES Inc.
Advanced Micro Devices, Inc.
Qualcomm, Inc.
Intel Corporation
Samsung Electronics Co., Ltd. (Samsung Group)
ASE Group (ASE Technology Holding Co., Ltd.)
IBM Corporation
Toshiba Corporation
STMicroelectronics N.V.

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Chapter 1. Market Scope & Methodology

1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
- 1.4.1 Europe 3D Stacking Market, by Interconnecting Technology
- 1.4.2 Europe 3D Stacking Market, by Method
- 1.4.3 Europe 3D Stacking Market, by Device Type
- 1.4.4 Europe 3D Stacking Market, by End User
- 1.4.5 Europe 3D Stacking Market, by Country
1.5 Methodology for the research

Chapter 2. Market at a Glance

2.1 Key Highlights

Chapter 3. Market Overview

3.1 Introduction
- 3.1.1 Overview
  - 3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
- 3.2.1 Market Drivers
- 3.2.2 Market Restraints

Chapter 4. Competition Analysis - Global

4.1 Market Share Analysis, 2022
4.2 Porter's Five Forces Analysis

Chapter 5. Europe 3D Stacking Market by Interconnecting Technology

5.1 Europe 3D TSV (Through-Silicon Via) Market by Country
5.2 Europe Monolithic 3D Integration Market by Country
5.3 Europe 3D Hybrid Bonding Market by Country

Chapter 6. Europe 3D Stacking Market by Method

6.1 Europe Chip-to-Chip Market by Country
6.2 Europe Chip-to-Wafer Market by Country
6.3 Europe Die-to-Die Market by Country
6.4 Europe Wafer-to-Wafer Market by Country
6.5 Europe Die-to-Wafer Market by Country

Chapter 7. Europe 3D Stacking Market by Device Type

7.1 Europe Memory Devices Market by Country
7.2 Europe MEMS/Sensors Market by Country
7.3 Europe LEDs Market by Country
7.4 Europe Logic ICs Market by Country
7.5 Europe Imaging & Optoelectronics Market by Country
7.6 Europe Others Market by Country

Chapter 8. Europe 3D Stacking Market by End User

8.1 Europe Consumer Electronics Market by Country
8.2 Europe Medical Devices/Healthcare Market by Country
8.3 Europe Manufacturing Market by Country
8.4 Europe Communications Market by Country
8.5 Europe Automotive Market by Country
8.6 Europe Others Market by Country

Chapter 9. Europe 3D Stacking Market by Country

9.1 Germany 3D Stacking Market
- 9.1.1 Germany 3D Stacking Market by Interconnecting Technology
- 9.1.2 Germany 3D Stacking Market by Method
- 9.1.3 Germany 3D Stacking Market by Device Type
- 9.1.4 Germany 3D Stacking Market by End User
9.2 UK 3D Stacking Market
- 9.2.1 UK 3D Stacking Market by Interconnecting Technology
- 9.2.2 UK 3D Stacking Market by Method
- 9.2.3 UK 3D Stacking Market by Device Type
- 9.2.4 UK 3D Stacking Market by End User
9.3 France 3D Stacking Market
- 9.3.1 France 3D Stacking Market by Interconnecting Technology
- 9.3.2 France 3D Stacking Market by Method
- 9.3.3 France 3D Stacking Market by Device Type
- 9.3.4 France 3D Stacking Market by End User
9.4 Russia 3D Stacking Market
- 9.4.1 Russia 3D Stacking Market by Interconnecting Technology
- 9.4.2 Russia 3D Stacking Market by Method
- 9.4.3 Russia 3D Stacking Market by Device Type
- 9.4.4 Russia 3D Stacking Market by End User
9.5 Spain 3D Stacking Market
- 9.5.1 Spain 3D Stacking Market by Interconnecting Technology
- 9.5.2 Spain 3D Stacking Market by Method
- 9.5.3 Spain 3D Stacking Market by Device Type
- 9.5.4 Spain 3D Stacking Market by End User
9.6 Italy 3D Stacking Market
- 9.6.1 Italy 3D Stacking Market by Interconnecting Technology
- 9.6.2 Italy 3D Stacking Market by Method
- 9.6.3 Italy 3D Stacking Market by Device Type
- 9.6.4 Italy 3D Stacking Market by End User
9.7 Rest of Europe 3D Stacking Market
- 9.7.1 Rest of Europe 3D Stacking Market by Interconnecting Technology
- 9.7.2 Rest of Europe 3D Stacking Market by Method
- 9.7.3 Rest of Europe 3D Stacking Market by Device Type
- 9.7.4 Rest of Europe 3D Stacking Market by End User

Chapter 10. Company Profiles

10.1 Taiwan Semiconductor Manufacturing Company Limited
- 10.1.1 Company overview
- 10.1.2 Financial Analysis
- 10.1.3 Regional Analysis
- 10.1.4 Research & Development Expenses
- 10.1.5 Recent strategies and developments:
  - 10.1.5.1 Product Launches and Product Expansions:
- 10.1.6 SWOT Analysis
10.2 GLOBALFOUNDRIES Inc.
- 10.2.1 Company Overview
- 10.2.2 Financial Analysis
- 10.2.3 Regional Analysis
- 10.2.4 Research & Development Expenses
- 10.2.5 SWOT Analysis
10.3 Advanced Micro Devices, Inc.
- 10.3.1 Company Overview
- 10.3.2 Financial Analysis
- 10.3.3 Segmental and Regional Analysis
- 10.3.4 Research & Development Expenses
- 10.3.5 SWOT Analysis
10.4 Qualcomm, Inc.
- 10.4.1 Company Overview
- 10.4.2 Financial Analysis
- 10.4.3 Segmental and Regional Analysis
- 10.4.4 Research & Development Expense
- 10.4.5 SWOT Analysis
10.5 Intel Corporation
- 10.5.1 Company Overview
- 10.5.2 Financial Analysis
- 10.5.3 Segmental and Regional Analysis
- 10.5.4 Research & Development Expenses
- 10.5.5 SWOT Analysis
10.6 Samsung Electronics Co., Ltd. (Samsung Group)
- 10.6.1 Company Overview
- 10.6.2 Financial Analysis
- 10.6.3 Segmental and Regional Analysis
- 10.6.4 Recent strategies and developments:
  - 10.6.4.1 Partnerships, Collaborations, and Agreements:
  - 10.6.4.2 Product Launches and Product Expansions:
- 10.6.5 SWOT Analysis
10.7 ASE Group (ASE Technology Holding Co., Ltd.)
- 10.7.1 Company Overview
- 10.7.2 Financial Analysis
- 10.7.3 Segmental and Regional Analysis
- 10.7.4 Research & Development Expenses
- 10.7.5 SWOT Analysis
10.8 IBM Corporation
- 10.8.1 Company Overview
- 10.8.2 Financial Analysis
- 10.8.3 Regional & Segmental Analysis
- 10.8.4 Research & Development Expenses
- 10.8.5 Recent strategies and developments:
  - 10.8.5.1 Acquisition and Mergers:
10.9 Toshiba Corporation
- 10.9.1 Company Overview
- 10.9.2 Financial Analysis
- 10.9.3 Segmental and Regional Analysis
- 10.9.4 Research and Development Expense
- 10.9.5 SWOT Analysis
10.10. STMicroelectronics N.V.
- 10.10.1 Company Overview
- 10.10.2 Financial Analysis
- 10.10.3 Segmental and Regional Analysis
- 10.10.4 Research & Development Expense
- 10.10.5 SWOT Analysis

LIST OF TABLES

TABLE 1 Europe 3D Stacking Market, 2019 - 2022, USD Million
TABLE 2 Europe 3D Stacking Market, 2023 - 2030, USD Million
TABLE 3 Europe 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
TABLE 4 Europe 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
TABLE 5 Europe 3D TSV (Through-Silicon Via) Market by Country, 2019 - 2022, USD Million
TABLE 6 Europe 3D TSV (Through-Silicon Via) Market by Country, 2023 - 2030, USD Million
TABLE 7 Europe Monolithic 3D Integration Market by Country, 2019 - 2022, USD Million
TABLE 8 Europe Monolithic 3D Integration Market by Country, 2023 - 2030, USD Million
TABLE 9 Europe 3D Hybrid Bonding Market by Country, 2019 - 2022, USD Million
TABLE 10 Europe 3D Hybrid Bonding Market by Country, 2023 - 2030, USD Million
TABLE 11 Europe 3D Stacking Market by Method, 2019 - 2022, USD Million
TABLE 12 Europe 3D Stacking Market by Method, 2023 - 2030, USD Million
TABLE 13 Europe Chip-to-Chip Market by Country, 2019 - 2022, USD Million
TABLE 14 Europe Chip-to-Chip Market by Country, 2023 - 2030, USD Million
TABLE 15 Europe Chip-to-Wafer Market by Country, 2019 - 2022, USD Million
TABLE 16 Europe Chip-to-Wafer Market by Country, 2023 - 2030, USD Million
TABLE 17 Europe Die-to-Die Market by Country, 2019 - 2022, USD Million
TABLE 18 Europe Die-to-Die Market by Country, 2023 - 2030, USD Million
TABLE 19 Europe Wafer-to-Wafer Market by Country, 2019 - 2022, USD Million
TABLE 20 Europe Wafer-to-Wafer Market by Country, 2023 - 2030, USD Million
TABLE 21 Europe Die-to-Wafer Market by Country, 2019 - 2022, USD Million
TABLE 22 Europe Die-to-Wafer Market by Country, 2023 - 2030, USD Million
TABLE 23 Europe 3D Stacking Market by Device Type, 2019 - 2022, USD Million
TABLE 24 Europe 3D Stacking Market by Device Type, 2023 - 2030, USD Million
TABLE 25 Europe Memory Devices Market by Country, 2019 - 2022, USD Million
TABLE 26 Europe Memory Devices Market by Country, 2023 - 2030, USD Million
TABLE 27 Europe MEMS/Sensors Market by Country, 2019 - 2022, USD Million
TABLE 28 Europe MEMS/Sensors Market by Country, 2023 - 2030, USD Million
TABLE 29 Europe LEDs Market by Country, 2019 - 2022, USD Million
TABLE 30 Europe LEDs Market by Country, 2023 - 2030, USD Million
TABLE 31 Europe Logic ICs Market by Country, 2019 - 2022, USD Million
TABLE 32 Europe Logic ICs Market by Country, 2023 - 2030, USD Million
TABLE 33 Europe Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
TABLE 34 Europe Imaging & Optoelectronics Market by Country, 2023 - 2030, USD Million
TABLE 35 Europe Others Market by Country, 2019 - 2022, USD Million
TABLE 36 Europe Others Market by Country, 2023 - 2030, USD Million
TABLE 37 Europe 3D Stacking Market by End User, 2019 - 2022, USD Million
TABLE 38 Europe 3D Stacking Market by End User, 2023 - 2030, USD Million
TABLE 39 Europe Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 40 Europe Consumer Electronics Market by Country, 2023 - 2030, USD Million
TABLE 41 Europe Medical Devices/Healthcare Market by Country, 2019 - 2022, USD Million
TABLE 42 Europe Medical Devices/Healthcare Market by Country, 2023 - 2030, USD Million
TABLE 43 Europe Manufacturing Market by Country, 2019 - 2022, USD Million
TABLE 44 Europe Manufacturing Market by Country, 2023 - 2030, USD Million
TABLE 45 Europe Communications Market by Country, 2019 - 2022, USD Million
TABLE 46 Europe Communications Market by Country, 2023 - 2030, USD Million
TABLE 47 Europe Automotive Market by Country, 2019 - 2022, USD Million
TABLE 48 Europe Automotive Market by Country, 2023 - 2030, USD Million
TABLE 49 Europe Others Market by Country, 2019 - 2022, USD Million
TABLE 50 Europe Others Market by Country, 2023 - 2030, USD Million
TABLE 51 Europe 3D Stacking Market by Country, 2019 - 2022, USD Million
TABLE 52 Europe 3D Stacking Market by Country, 2023 - 2030, USD Million
TABLE 53 Germany 3D Stacking Market, 2019 - 2022, USD Million
TABLE 54 Germany 3D Stacking Market, 2023 - 2030, USD Million
TABLE 55 Germany 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
TABLE 56 Germany 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
TABLE 57 Germany 3D Stacking Market by Method, 2019 - 2022, USD Million
TABLE 58 Germany 3D Stacking Market by Method, 2023 - 2030, USD Million
TABLE 59 Germany 3D Stacking Market by Device Type, 2019 - 2022, USD Million
TABLE 60 Germany 3D Stacking Market by Device Type, 2023 - 2030, USD Million
TABLE 61 Germany 3D Stacking Market by End User, 2019 - 2022, USD Million
TABLE 62 Germany 3D Stacking Market by End User, 2023 - 2030, USD Million
TABLE 63 UK 3D Stacking Market, 2019 - 2022, USD Million
TABLE 64 UK 3D Stacking Market, 2023 - 2030, USD Million
TABLE 65 UK 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
TABLE 66 UK 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
TABLE 67 UK 3D Stacking Market by Method, 2019 - 2022, USD Million
TABLE 68 UK 3D Stacking Market by Method, 2023 - 2030, USD Million
TABLE 69 UK 3D Stacking Market by Device Type, 2019 - 2022, USD Million
TABLE 70 UK 3D Stacking Market by Device Type, 2023 - 2030, USD Million
TABLE 71 UK 3D Stacking Market by End User, 2019 - 2022, USD Million
TABLE 72 UK 3D Stacking Market by End User, 2023 - 2030, USD Million
TABLE 73 France 3D Stacking Market, 2019 - 2022, USD Million
TABLE 74 France 3D Stacking Market, 2023 - 2030, USD Million
TABLE 75 France 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
TABLE 76 France 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
TABLE 77 France 3D Stacking Market by Method, 2019 - 2022, USD Million
TABLE 78 France 3D Stacking Market by Method, 2023 - 2030, USD Million
TABLE 79 France 3D Stacking Market by Device Type, 2019 - 2022, USD Million
TABLE 80 France 3D Stacking Market by Device Type, 2023 - 2030, USD Million
TABLE 81 France 3D Stacking Market by End User, 2019 - 2022, USD Million
TABLE 82 France 3D Stacking Market by End User, 2023 - 2030, USD Million
TABLE 83 Russia 3D Stacking Market, 2019 - 2022, USD Million
TABLE 84 Russia 3D Stacking Market, 2023 - 2030, USD Million
TABLE 85 Russia 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
TABLE 86 Russia 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
TABLE 87 Russia 3D Stacking Market by Method, 2019 - 2022, USD Million
TABLE 88 Russia 3D Stacking Market by Method, 2023 - 2030, USD Million
TABLE 89 Russia 3D Stacking Market by Device Type, 2019 - 2022, USD Million
TABLE 90 Russia 3D Stacking Market by Device Type, 2023 - 2030, USD Million
TABLE 91 Russia 3D Stacking Market by End User, 2019 - 2022, USD Million
TABLE 92 Russia 3D Stacking Market by End User, 2023 - 2030, USD Million
TABLE 93 Spain 3D Stacking Market, 2019 - 2022, USD Million
TABLE 94 Spain 3D Stacking Market, 2023 - 2030, USD Million
TABLE 95 Spain 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
TABLE 96 Spain 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
TABLE 97 Spain 3D Stacking Market by Method, 2019 - 2022, USD Million
TABLE 98 Spain 3D Stacking Market by Method, 2023 - 2030, USD Million
TABLE 99 Spain 3D Stacking Market by Device Type, 2019 - 2022, USD Million
TABLE 100 Spain 3D Stacking Market by Device Type, 2023 - 2030, USD Million
TABLE 101 Spain 3D Stacking Market by End User, 2019 - 2022, USD Million
TABLE 102 Spain 3D Stacking Market by End User, 2023 - 2030, USD Million
TABLE 103 Italy 3D Stacking Market, 2019 - 2022, USD Million
TABLE 104 Italy 3D Stacking Market, 2023 - 2030, USD Million
TABLE 105 Italy 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
TABLE 106 Italy 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
TABLE 107 Italy 3D Stacking Market by Method, 2019 - 2022, USD Million
TABLE 108 Italy 3D Stacking Market by Method, 2023 - 2030, USD Million
TABLE 109 Italy 3D Stacking Market by Device Type, 2019 - 2022, USD Million
TABLE 110 Italy 3D Stacking Market by Device Type, 2023 - 2030, USD Million
TABLE 111 Italy 3D Stacking Market by End User, 2019 - 2022, USD Million
TABLE 112 Italy 3D Stacking Market by End User, 2023 - 2030, USD Million
TABLE 113 Rest of Europe 3D Stacking Market, 2019 - 2022, USD Million
TABLE 114 Rest of Europe 3D Stacking Market, 2023 - 2030, USD Million
TABLE 115 Rest of Europe 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
TABLE 116 Rest of Europe 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
TABLE 117 Rest of Europe 3D Stacking Market by Method, 2019 - 2022, USD Million
TABLE 118 Rest of Europe 3D Stacking Market by Method, 2023 - 2030, USD Million
TABLE 119 Rest of Europe 3D Stacking Market by Device Type, 2019 - 2022, USD Million
TABLE 120 Rest of Europe 3D Stacking Market by Device Type, 2023 - 2030, USD Million
TABLE 121 Rest of Europe 3D Stacking Market by End User, 2019 - 2022, USD Million
TABLE 122 Rest of Europe 3D Stacking Market by End User, 2023 - 2030, USD Million
TABLE 123 Key Information- Taiwan Semiconductor Manufacturing Company Limited
TABLE 124 Key Information - GLOBALFOUNDRIES Inc.
TABLE 125 Key Information - Advanced Micro Devices, Inc.
TABLE 126 Key Information - Qualcomm, Inc.
TABLE 127 Key Information - Intel Corporation
TABLE 128 Key Information - Samsung Electronics Co., Ltd.
TABLE 129 Key Information - ASE Group
TABLE 130 Key Information - IBM Corporation
TABLE 131 Key Information - Toshiba Corporation
TABLE 132 Key Information - STMicroelectronics N.V.

Europe 3D Stacking Market Size, Share & Industry Trends Analysis Report By Interconnecting Technology, By Method, By Device Type, By End User, By Country and Growth Forecast, 2023 - 2030

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