Asia Pacific 3D Stacking Market Forecast to 2031 - Regional Analysis by Interconnecting Technology, Device Type, and End User

List of Tables

The Asia Pacific 3D stacking market was valued at US$ 699.32 million in 2023 and is expected to reach US$ 2,352.45 million by 2031; it is expected to record a CAGR of 16.4% from 2023 to 2031.

Surge in Demand for High-Bandwidth Memory Fuels Asia Pacific 3D Stacking Market

High-bandwidth memory (HBM), which reaches extremely high density by stacking numerous dynamic random-access memory (DRAMs) vertically, is distinguished by rapid data processing and low power consumption. It is essential in high-performance computing (HPC), such as generative AI, which requires processing enormous amounts of data at significantly fast speeds. Samsung Electronics 12-layer stacked HBM uses next-generation 3D stacking packaging technique to boost performance and yield. With a processing speed of 6.4Gbps and a bandwidth of 819 GB/s, HBM3 is 1.8 times faster than the previous-generation DRAM while using 10% less power. The demand for HBM in high-performance computing applications encourages market players to increase their production. For instance, in March 2024, SK HYNIX INC started volume production of HBM3E1, the newest AI memory product with ultra-high performance. HBM3E is designed for an AI system that processes a huge amount of data quickly. The high-bandwidth memory is used by various industries, including telecommunication, automotive, healthcare, and manufacturing, for high-speed data processing.

HBM utilizes 3D stacking technology, allowing the stacking of multiple layers of chips using vertical channels known as through-silicon vias (TSVs). This enables a greater number of memory chips to be packed into a smaller space, minimizing the distance data must travel between the memory and processor. HBM can help lengthen battery life and reduce energy consumption by offering sustainable benefits to users. This supports users in decreasing the amount of power required to transmit data between memory and processor. Therefore, the surge in demand for high-speed data processing and low-power consumption memories is expected to create lucrative opportunities for the 3D stacking market growth during the forecast period.

Asia Pacific 3D Stacking Market Overview

In Asia Pacific, China is the largest manufacturer of consumer electronic devices. According to Nikkei Inc., the Government of China expanded the country's domestic electronic market by investing US$ 327 billion till 2023. The Government of India also aims to expand the electronics market in the country. Furthermore, the electronics sector in Asia Pacific accounts for 20-50% of Asia Pacific's total value of exports. Smart speakers, home assistants, and smart cameras utilize 3D stacked memory and processors to enhance performance and features while maintaining a small footprint. As Asia Pacific is the largest electronic manufacturer, the demand for 3D stacking is expected to rise during the forecast period.

Asia Pacific 3D Stacking Market Revenue and Forecast to 2031 (US$ Million)

Asia Pacific 3D Stacking Market Segmentation

The Asia Pacific 3D stacking market is categorized into interconnecting technology, device type, end user, and country.

Based on interconnecting technology, the Asia Pacific 3D stacking market is segmented into through-silicon via, monolithic 3d integration, and 3d hybrid bonding. The through-silicon via segment held the largest market share in 2023.

By device type, the Asia Pacific 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held the largest market share in 2023.

In the terms of end user, the Asia Pacific 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held the largest market share in 2023.

By country, the Asia Pacific 3D stacking market is segmented into India, China, Japan, South Korea, Taiwan, Australia, and the Rest of Asia Pacific. Taiwan dominated the Asia Pacific 3D stacking market share in 2023.

Taiwan Semiconductor Manufacturing Co Ltd; Samsung Electronics Co Ltd; Intel Corp; MediaTek Inc.; Texas Instruments Inc; Amkor Technology Inc; ASE Technology Holding Co Ltd; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc are some of the leading companies operating in the Asia Pacific 3D stacking market.

Product Code: BMIRE00031569

1. Introduction

1.1 The Insight Partners Research Report Guidance
1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights
2.2 Market Attractiveness

3. Research Methodology

3.1 Secondary Research
3.2 Primary Research
- 3.2.1 Hypothesis formulation:
- 3.2.2 Macro-economic factor analysis:
- 3.2.3 Developing base number:
- 3.2.4 Data Triangulation:
- 3.2.5 Country level data:

4. Asia Pacific 3D Stacking Market Landscape

4.1 Overview
4.2 PEST Analysis
4.3 Ecosystem Analysis
- 4.3.1 List of Vendors in the Value Chain

5. Asia Pacific 3D Stacking Market - Key Market Dynamics

5.1 3D Stacking Market - Key Market Dynamics
5.2 Market Drivers
- 5.2.1 Rising Demand for Consumer Electronics
- 5.2.2 Increasing Use of Heterogeneous Integration and Component Optimization
5.3 Market Restraints
- 5.3.1 Complexity Associated with 3D Stacking Technology
5.4 Market Opportunities
- 5.4.1 Surge in Demand for High-Bandwidth Memory
5.5 Future Trends
- 5.5.1 Fast Processors for Gaming Purposes
5.6 Impact of Drivers and Restraints:

6. 3D Stacking Market - Asia Pacific Market Analysis

6.1 Asia Pacific 3D Stacking Market Overview-
6.2 Asia Pacific 3D Stacking Market Revenue (US$ Million), 2021-2031
6.3 Asia Pacific 3D Stacking Market Forecast Analysis

7. Asia Pacific 3D Stacking Market Analysis - by Interconnecting Technology

7.1 Through-Silicon Via
- 7.1.1 Overview
- 7.1.2 Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
7.2 Monolithic 3D Integration
- 7.2.1 Overview
- 7.2.2 Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
7.3 3D Hybrid Bonding
- 7.3.1 Overview
- 7.3.2 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

8. Asia Pacific 3D Stacking Market Analysis - by Device Type

8.1 Memory Devices
- 8.1.1 Overview
- 8.1.2 Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
8.2 MEMS/Sensors
- 8.2.1 Overview
- 8.2.2 MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
8.3 LEDs
- 8.3.1 Overview
- 8.3.2 LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
8.4 Imaging and Optoelectronics
- 8.4.1 Overview
- 8.4.2 Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
8.5 Others
- 8.5.1 Overview
- 8.5.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

9. Asia Pacific 3D Stacking Market Analysis - by End User

9.1 Consumer Electronics
- 9.1.1 Overview
- 9.1.2 Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.2 Telecommunication
- 9.2.1 Overview
- 9.2.2 Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.3 Automotive
- 9.3.1 Overview
- 9.3.2 Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.4 Manufacturing
- 9.4.1 Overview
- 9.4.2 Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.5 Healthcare
- 9.5.1 Overview
- 9.5.2 Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.6 Others
- 9.6.1 Overview
- 9.6.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

10. Asia Pacific 3D Stacking Market -Country Analysis

10.1 Asia Pacific
- 10.1.1 Asia Pacific 3D Stacking Market, by Key Countries - Revenue (2023) (US$ Million)
- 10.1.2 Asia Pacific 3D Stacking Market - Revenue and Forecast Analysis - by Country
  - 10.1.2.1 Asia Pacific: 3D Stacking Market - Revenue and Forecast Analysis - by Country
  - 10.1.2.2 India: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.2.1 India: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.2.2 India: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.2.3 India: 3D Stacking Market Breakdown, by End User
  - 10.1.2.3 China: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.3.1 China: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.3.2 China: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.3.3 China: 3D Stacking Market Breakdown, by End User
  - 10.1.2.4 Japan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.4.1 Japan: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.4.2 Japan: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.4.3 Japan: 3D Stacking Market Breakdown, by End User
  - 10.1.2.5 South Korea: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.5.1 South Korea: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.5.2 South Korea: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.5.3 South Korea: 3D Stacking Market Breakdown, by End User
  - 10.1.2.6 Taiwan: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.6.1 Taiwan: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.6.2 Taiwan: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.6.3 Taiwan: 3D Stacking Market Breakdown, by End User
  - 10.1.2.7 Australia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.7.1 Australia: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.7.2 Australia: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.7.3 Australia: 3D Stacking Market Breakdown, by End User
  - 10.1.2.8 Rest of Asia Pacific: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.8.1 Rest of Asia Pacific: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.8.2 Rest of Asia Pacific: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.8.3 Rest of Asia Pacific: 3D Stacking Market Breakdown, by End User

11. Competitive Landscape

11.1 Heat Map Analysis by Key Players
11.2 Company Positioning & Concentration

12. Industry Landscape

12.1 Overview
12.2 Market Initiative
12.3 Product Development

13. Company Profiles

13.1 Taiwan Semiconductor Manufacturing Co Ltd
- 13.1.1 Key Facts
- 13.1.2 Business Description
- 13.1.3 Products and Services
- 13.1.4 Financial Overview
- 13.1.5 SWOT Analysis
- 13.1.6 Key Developments
13.2 Samsung Electronics Co Ltd
- 13.2.1 Key Facts
- 13.2.2 Business Description
- 13.2.3 Products and Services
- 13.2.4 Financial Overview
- 13.2.5 SWOT Analysis
- 13.2.6 Key Developments
13.3 Intel Corp
- 13.3.1 Key Facts
- 13.3.2 Business Description
- 13.3.3 Products and Services
- 13.3.4 Financial Overview
- 13.3.5 SWOT Analysis
- 13.3.6 Key Developments
13.4 MediaTek Inc
- 13.4.1 Key Facts
- 13.4.2 Business Description
- 13.4.3 Products and Services
- 13.4.4 Financial Overview
- 13.4.5 SWOT Analysis
- 13.4.6 Key Developments
13.5 Texas Instruments Inc
- 13.5.1 Key Facts
- 13.5.2 Business Description
- 13.5.3 Products and Services
- 13.5.4 Financial Overview
- 13.5.5 SWOT Analysis
- 13.5.6 Key Developments
13.6 Amkor Technology Inc
- 13.6.1 Key Facts
- 13.6.2 Business Description
- 13.6.3 Products and Services
- 13.6.4 Financial Overview
- 13.6.5 SWOT Analysis
- 13.6.6 Key Developments
13.7 ASE Technology Holding Co Ltd
- 13.7.1 Key Facts
- 13.7.2 Business Description
- 13.7.3 Products and Services
- 13.7.4 Financial Overview
- 13.7.5 SWOT Analysis
- 13.7.6 Key Developments
13.8 Advanced Micro Devices Inc
- 13.8.1 Key Facts
- 13.8.2 Business Description
- 13.8.3 Products and Services
- 13.8.4 Financial Overview
- 13.8.5 SWOT Analysis
- 13.8.6 Key Developments
13.9 3M Co
- 13.9.1 Key Facts
- 13.9.2 Business Description
- 13.9.3 Products and Services
- 13.9.4 Financial Overview
- 13.9.5 SWOT Analysis
- 13.9.6 Key Developments
13.10 Globalfoundries Inc
- 13.10.1 Key Facts
- 13.10.2 Business Description
- 13.10.3 Products and Services
- 13.10.4 Financial Overview
- 13.10.5 SWOT Analysis
- 13.10.6 Key Developments

14. Appendix

14.1 About The Insight Partners
14.2 Word Index