PUBLISHER: Lucintel | PRODUCT CODE: 1416753
PUBLISHER: Lucintel | PRODUCT CODE: 1416753
The future of the global molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets. The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.
A more than 150-page report is developed to help in your business decisions.
The study includes a forecast for the global molded interconnect device (MID) by product type, process, end use industry, and region.
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies molded interconnect device (MID) companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the molded interconnect device (MID) companies profiled in this report include-
Lucintel forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.
Within this market, automotive is expected to witness the highest growth over the forecast period.
APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.
Market Size Estimates: Molded interconnect device (MID) market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Molded interconnect device (MID) market size by product type, process, end use industry, and region in terms of value ($B).
Regional Analysis: Molded interconnect device (MID) market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different product types, processes, end use industries, and regions for the molded interconnect device (MID) market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the molded interconnect device (MID) market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
Q1. What is the molded interconnect device (MID) market size?
Answer: The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030.
Q2. What is the growth forecast for molded interconnect device (MID) market?
Answer: The global molded interconnect device (MID) market is expected to grow with a CAGR of 10.8% from 2024 to 2030.
Q3. What are the major drivers influencing the growth of the molded interconnect device (MID) market?
Answer: The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.
Q4. What are the major segments for molded interconnect device (MID) market?
Answer: The future of the molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets.
Q5. Who are the key molded interconnect device (MID) market companies?
Answer: Some of the key molded interconnect device (MID) companies are as follows:
Q6. Which molded interconnect device (MID) market segment will be the largest in future?
Answer: Lucintel forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.
Q7. In molded interconnect device (MID) market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.
Q.8 Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.