Global New Packages and Materials for Power Devices Market Research Report by Product Type, by Application, and by Region Forecast till 2032

Description

List of Tables

Global New Packages and Materials for Power Devices Market Research Report by Product Type [Chip-On-Board (COB), Wire Bonding Packaging, Silicon Carbide (SIC), Gallium Nitride (GaN), Gallium Arsenide (GaAs), Others], by Application (Automotive, Consumer Electronics, IT & Telecommunications, Military & Aerospace, Industrial, Others), and by Region (North America, Europe, Asia Pacific, Latin America, Middle East & Africa) Forecast till 2032

Industry Overview

The global new packages and materials for power devices market is expected to achieve a value of USD 5,928.7 million, expanding at a 9.44% by the end of 2032. The term highlights the adoption of modern packaging solutions and advanced materials designed to support next-generation power devices. By enabling better heat dissipation, higher switching speeds, and improved durability, these innovations are reshaping applications from electric vehicles to smart grids.

The global New Packages and Materials for Power Devices Market is primarily driven by the rising emphasis on efficiency and speed in power electronics. The increasing use of GaN and SiC-based devices is changing the automotive, consumer electronics, and renewable energy sectors by allowing faster charging, lower energy losses, and better thermal performance. Besides that, 3D packaging, the use of advanced thermal interface materials, and compact integration are the main factors that are driving the industry-wide transitions. These transitions are more visible in electric vehicles (EVs), where higher efficiency and rapid charging are the most important.

Major Company Development

Between 2023 and 2024, Microchip Technology accelerated its expansion strategy with the help of an extension and two partnership agreements. To meet the demand for semiconductors in the United States, it invested $800 million to triple production in Oregon. In December 2023, it was decided to open a design center in Cambridge to facilitate innovation and gain access to engineering talent. By April 2024, Microchip was able to improve its supply chain through a strategic alliance with TSMC in Japan, allowing for additional capacity, geographical diversity, and semiconductor manufacturing that is more resilient.

Key Players

Major players in the global new packages and materials for power devices market are Infineon Technologies AG, STMicroelectronics, ROHM Semiconductor, Texas Instruments, Mitsubishi Electric Corporation, NXP Semiconductors, Analog Devices, ON Semiconductor, Microchip Technology Inc., and Wolfspeed.

Report Attribute Details

Market Size 2023: USD 2,500 Million
Market Size 2032: USD 5,928.7 Million
CAGR (2024-2032): 9.44%
Base Year: 2023
Market Forecast Period: 2024-2032

Industry Segmentations

By Product Type: Chip-On-Board (COB) - 9.66%, Wire Bonding Packaging - 8.56%.
By Application: Automotive - 8.49%, Consumer Electronics - 10.18%.

Regional Analysis

The North American market is growing gradually, and this movement is led by the demand of the automotive, consumer electronics, and industrial sectors, along with the investments in R&D and advanced packaging technologies. The North American market was valued at USD 469.17 million in the U.S. and USD 32.08 million in Canada in 2023, driven by innovation in automotive and electronics.

The European region is seeing a market mainly based on sustainability and energy efficiency targets, which are the focus of demand, particularly in the areas of automotive and industrial automation. The industry leaders in this sector, namely STMicroelectronics, Infineon Technologies, and NXP Semiconductors, are providing custom-made solutions to match the changing requirements in this area. Germany (USD 125.73 million), France (USD 88.40 million), and the UK (USD 92.94 million) anchored Europe's market, reflecting its strong industrial and sustainability focus.

The Asia-Pacific region has a robust semiconductor ecosystem that has allowed the region to become a global leader in the manufacture and use of EVs (Electric Vehicles), and the region has also invested very heavily in telecom and the renewable energy sector. With China at USD 738.29 million, Japan at USD 104.37 million, and India at USD 29.20 million, Asia-Pacific stood out as the fastest-expanding hub for new materials and packaging.

The Middle East & Africa is the fastest-growing regional market, expanding from USD 126.00 million in 2023 to USD 314.81 million by 2032, at a CAGR of 10.08%. Infineon Technologies and ON Semiconductor are among the leading companies strengthening their presence, addressing requirements across the oil & gas, telecom, and defense sectors. This positions the region as a high-potential frontier for advanced power solutions.

South America's market is focusing on infrastructure development, renewable energy adoption, and telecom expansion, which are creating consistent demand for efficient power devices. ON Semiconductor and STMicroelectronics are leading efforts to expand through strategic partnerships and localized solutions. With steady investments, the region is expected to play a greater role in the global market.

Product Code: MRFR/SEM/6025-CR

1 EXECUTIVE SUMMARY

2 MARKET INTRODUCTION

2.1 DEFINITION
2.2 SCOPE OF THE STUDY
2.3 RESEARCH OBJECTIVE
2.4 MARKET STRUCTURE

3 RESEARCH METHODOLOGY

3.1 OVERVIEW
3.2 DATA FLOW
- 3.2.1 DATA MINING PROCESS
3.3 PURCHASED DATABASE:
3.4 SECONDARY SOURCES:
- 3.4.1 SECONDARY RESEARCH DATA FLOW:
3.5 PRIMARY RESEARCH:
- 3.5.1 PRIMARY RESEARCH DATA FLOW:
- 3.5.2 PRIMARY RESEARCH: NUMBER OF INTERVIEWS CONDUCTED
- 3.5.3 PRIMARY RESEARCH: REGIONAL COVERAGE
3.6 APPROACHES FOR MARKET SIZE ESTIMATION:
- 3.6.1 REVENUE ANALYSIS APPROACH
3.7 DATA FORECASTING
- 3.7.1 DATA FORECASTING TECHNIQUE
3.8 DATA MODELING
- 3.8.1 MICROECONOMIC FACTOR ANALYSIS:
- 3.8.2 DATA MODELING:
3.9 TEAMS AND ANALYST CONTRIBUTION

4 MARKET DYNAMICS

4.1 INTRODUCTION
4.2 DRIVERS
- 4.2.1 DEMAND OF BETTER EFFICIENCY AND SPEED
- 4.2.2 COLLABORATION AND PARTNERSHIPS AMONG PLAYERS
4.3 RESTRAINTS
- 4.3.1 INTEGRATION OF NEW MATERIAL AND PACKAGES INTO POWER DEVICES
4.4 OPPORTUNITIES
- 4.4.1 RISING DEMAND OF SUSTAINABLE AND SCALABLE POWER PRODUCTS

5 MARKET FACTOR ANALYSIS

5.1 SUPPLY CHAIN ANALYSIS
- 5.1.1 RAW MATERIAL SOURCING
- 5.1.2 MANUFACTURING
- 5.1.3 ASSEMBLY AND TESTING
- 5.1.4 PACKAGING AND DISTRIBUTION
5.2 PORTER FIVE FORCES
- 5.2.1 BARGAINING POWER OF SUPPLIERS
- 5.2.2 BARGAINING POWER OF BUYERS
- 5.2.3 THREAT OF NEW ENTRANTS
- 5.2.4 THREAT OF SUBSTITUTES
- 5.2.5 INTENSITY OF RIVALRY
5.3 IMPACT OF CORONAVIRUS OUTBREAK ON THE GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET
5.4 PRICING ANALYSIS OF THE GLOBAL NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET

6 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY PRODUCT TYPE

6.1 INTRODUCTION
6.2 CHIP-ON-BOARD (COB)
6.3 WIRE BONDING PACKAGING
6.4 GALLIUM ARSENIDE (GAAS)
6.5 GALLIUM NITRIDE (GAN)
6.6 SILICON CARBIDE (SIC)
6.7 OTHER PACKAGES/ MATERIALS

7 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY APPLICATION

7.1 INTRODUCTION
7.2 AUTOMOTIVE
7.3 CONSUMER ELECTRONICS
7.4 INDUSTRIAL
7.5 IT AND TELECOMMUNICATIONS
7.6 MILITARY & AEROSPACE
7.7 OTHER APPLICATIONS

8 NEW PACKAGES AND MATERIALS FOR POWER DEVICES MARKET, BY REGION

8.1 OVERVIEW
8.2 NORTH AMERICA
- 8.2.1 U.S
- 8.2.2 CANADA
8.3 EUROPE
- 8.3.1 GERMANY
- 8.3.2 U.K.
- 8.3.3 FRANCE
- 8.3.4 RUSSIA
- 8.3.5 SPAIN
- 8.3.6 NETHERLANDS
- 8.3.7 REST OF EUROPE
8.4 ASIA-PACIFIC
- 8.4.1 CHINA
- 8.4.2 JAPAN
- 8.4.3 INDIA
- 8.4.4 SOUTH KOREA
- 8.4.5 SINGAPORE
- 8.4.6 AUSTRALIA AND NEW ZEALAND
- 8.4.7 REST OF ASIA-PACIFIC
8.5 MIDDLE EAST AND AFRICA
- 8.5.1 SOUTH AFRICA
- 8.5.2 GCC COUNTRIES
- 8.5.3 TURKEY
- 8.5.4 ISRAEL
- 8.5.5 REST OF MIDDLE EAST & AFRICA
8.6 LATIN AMERICA
- 8.6.1 BRAZIL
- 8.6.2 MEXICO
- 8.6.3 ARGENTINA
- 8.6.4 REST OF LATIN AMERICA

9 COMPETITIVE LANDSCAPE

9.1 MARKET SHARE ANALYSIS
9.2 COMPARATIVE ANALYSIS: KEY PLAYERS FINANCIAL
9.3 COMPETITOR DASHBOARD
9.4 KEY DEVELOPMENTS

10 COMPANY PROFILES

10.1 INFINEON TECHNOLOGIES
- 10.1.1 COMPANY OVERVIEW
- 10.1.2 FINANCIAL OVERVIEW
- 10.1.3 PRODUCTS OFFERED
- 10.1.4 KEY DEVELOPMENTS
- 10.1.5 SWOT ANALYSIS
- 10.1.6 KEY STRATEGY
10.2 STMICROELECTRONICS
- 10.2.1 COMPANY OVERVIEW
- 10.2.2 FINANCIAL OVERVIEW
- 10.2.3 PRODUCTS OFFERED
- 10.2.4 KEY DEVELOPMENTS
- 10.2.5 SWOT ANALYSIS
- 10.2.6 KEY STRATEGY
10.3 TEXAS INSTRUMENTS
- 10.3.1 COMPANY OVERVIEW
- 10.3.2 FINANCIAL OVERVIEW
- 10.3.3 PRODUCTS OFFERED
- 10.3.4 KEY DEVELOPMENTS
- 10.3.5 SWOT ANALYSIS
- 10.3.6 KEY STRATEGY
10.4 MITSUBISHI ELECTRIC CORPORATION
- 10.4.1 COMPANY OVERVIEW
- 10.4.2 FINANCIAL OVERVIEW
- 10.4.3 PRODUCTS OFFERED
- 10.4.4 KEY DEVELOPMENTS
- 10.4.5 SWOT ANALYSIS
- 10.4.6 KEY STRATEGY
10.5 ROHM SEMICONDUCTOR
- 10.5.1 COMPANY OVERVIEW
- 10.5.2 FINANCIAL OVERVIEW
- 10.5.3 PRODUCTS OFFERED
- 10.5.4 KEY DEVELOPMENTS
- 10.5.5 SWOT ANALYSIS
- 10.5.6 KEY STRATEGY
10.6 NXP SEMICONDUCTORS N.V.
- 10.6.1 COMPANY OVERVIEW
- 10.6.2 FINANCIAL OVERVIEW
- 10.6.3 PRODUCTS OFFERED
- 10.6.4 KEY DEVELOPMENTS
- 10.6.5 SWOT ANALYSIS
- 10.6.6 KEY STRATEGY
10.7 ANALOG DEVICES
- 10.7.1 COMPANY OVERVIEW
- 10.7.2 FINANCIAL OVERVIEW
- 10.7.3 PRODUCTS OFFERED
- 10.7.4 KEY DEVELOPMENTS
- 10.7.5 SWOT ANALYSIS
- 10.7.6 KEY STRATEGY
10.8 ON SEMICONDUCTORS
- 10.8.1 COMPANY OVERVIEW
- 10.8.2 FINANCIAL OVERVIEW
- 10.8.3 PRODUCTS OFFERED
- 10.8.4 KEY DEVELOPMENTS
- 10.8.5 SWOT ANALYSIS
- 10.8.6 KEY STRATEGY
10.9 MICROCHIP TECHNOLOGY
- 10.9.1 COMPANY OVERVIEW
- 10.9.2 FINANCIAL OVERVIEW
- 10.9.3 PRODUCTS OFFERED
- 10.9.4 KEY DEVELOPMENTS
- 10.9.5 SWOT ANALYSIS
- 10.9.6 KEY STRATEGY
10.10 WOLFSPEED, INC.
- 10.10.1 COMPANY OVERVIEW
- 10.10.2 FINANCIAL OVERVIEW
- 10.10.3 PRODUCTS OFFERED
- 10.10.4 KEY DEVELOPMENTS
- 10.10.5 SWOT ANALYSIS
- 10.10.6 KEY STRATEGY
10.11 DATA CITATIONS