Global Semiconductor Equipment Market - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts 2023 - 2030

Market Size and Growth:

The global semiconductor equipment market size was valued at USD 100b in 2023 and is expected to reach USD 211.8b by 2030 with CAGR of 11.3%. In 2023, the market has shrunk by 6% from the USD 107b in 2022. The market has a cyclical nature, thus 2024 is expected to be a transition year. In 2025, a strong rebound is expected driven by capacity expansion, new fab projects, and high demand for advanced technologies and solutions across the front-end and back-end segments

Types of Equipment: The semiconductor equipment market is segmented based on equipment type, application, and geography. Major segments include front-end equipment (for wafer processing such as lithography, etching, deposition, and cleaning tools), back-end equipment (for assembly and testing), and equipment for specialized processes such as advanced packaging and MEMS (Micro-Electro-Mechanical Systems).

Application of Equipment: The semiconductor equipment market includes semiconductors for foundry and logic applications, memory semiconductors such as NAND and DRAM, and semiconductors for other purposes. The NAND type is used in memory cards, USB flash drives, solid-state drives, feature phones, smartphones, and similar products, for general storage and transfer of data. DRAM is a type of semiconductor memory that is typically used for the data or program code needed by a computer processor to function.

Key Players: The market is dominated by several major players, including Applied Materials, ASML Holding NV, Lam Research Corporation, Tokyo Electron Limited (TEL), KLA Corporation, Advantest Corporation, etc. These companies are involved in developing, manufacturing, and selling semiconductor equipment and compete based on technology innovation, product performance, and customer support.

Technological Trends: Technological advancements drive innovation in semiconductor equipment, enabling the production of smaller, faster, and more power-efficient semiconductor devices. Key technological trends include extreme ultraviolet lithography for advanced semiconductor manufacturing nodes, 3D packaging, and heterogeneous integration, and process control and optimization using machine learning and AI algorithms.

Geographical Distribution: The semiconductor equipment market is globally distributed, with significant manufacturing and R&D facilities located in regions such as the United States, Japan, South Korea, Taiwan, China, and Europe. Asia-Pacific, particularly Taiwan and South Korea, holds a prominent position in semiconductor equipment manufacturing due to its strong semiconductor manufacturing ecosystem.

Market Dynamics: Market dynamics are influenced by factors such as semiconductor industry cyclicality, capital expenditure (CapEx) trends among semiconductor manufacturers, technological obsolescence, and geopolitical factors affecting trade and supply chains. Demand for semiconductor equipment is closely tied to semiconductor market cycles and investment in new manufacturing capacity.

Challenges and Opportunities: The semiconductor equipment market faces challenges such as technology complexity, high development costs, and the need for continuous innovation to meet the evolving requirements of semiconductor manufacturers. However, opportunities exist in emerging markets such as automotive electronics, industrial IoT, and AI-driven applications, driving demand for advanced semiconductor manufacturing technologies.

Overall, the semiconductor equipment global market plays a crucial role in enabling the production of semiconductor devices that power a wide range of electronic products. Continual advancements in technology and strong demand for semiconductor devices drive growth and innovation within the semiconductor equipment industry. However, market dynamics and competition require companies to remain agile and responsive to changing market conditions and technological trends.

Market Players

Intel Corporation,

Samsung Electronics Co. Ltd,

Qualcomm Incorporated,

Micron Technology Inc. and

SK Hynix Inc.

Tokyo Electron Limited

Lam Research Corporation

ASML

Screen Holdings Co. Ltd.

Teradyne

Applied Materials Inc.

KLA Corporation

Advantest

Hitachi High-Tech Corporation

EV Group

Onto Innovation

Plasma-Therm

Veeco Instruments

Nordson