PUR Adhesives in Electronics Market by Product Type, End-Users, and Geography (North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa): Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2023-2030

Description

Persistence Market Research has recently released a comprehensive report on the worldwide market for pur adhesives in electronics. The report offers a thorough assessment of crucial market dynamics, including drivers, trends, opportunities, and challenges, providing detailed insights into the market structure. This research publication presents exclusive data and statistics outlining the anticipated growth trajectory of the global pur adhesives in electronics market from 2023 to 2033.

The Global PUR Adhesives in Electronics market is forecast to expand at a CAGR of 5.8% and thereby increase from a value of US$ 3,895.6 million in 2023 to US$ 5,780.6 million by the end of 2030.

Key Insights

PUR Adhesives in Electronics Market Size (2023E): US$ 3,895.6 Million

Projected Market Value (2030F): US$ 5,780.6 Million

Global Market Growth Rate (CAGR 2023 to 2030): 5.8%

Historical Market Growth Rate (CAGR 2018 to 2022): 4.7%

PUR Adhesives in Electronics Market - Report Scope:

The PUR Adhesives in Electronics Market encompasses a wide range of solutions designed for electronic assembly and bonding applications. These adhesives offer superior bonding strength, durability, and resistance to harsh environmental conditions, making them ideal for electronic components and devices. The market caters to electronics manufacturers, suppliers, and assembly units, providing solutions for various electronic applications, including circuit board assembly, component bonding, and device encapsulation. Market growth is driven by the increasing demand for miniaturized electronics, advancements in electronic manufacturing technologies, and the need for reliable and high-performance adhesive solutions.

Market Growth Drivers:

The global PUR Adhesives in Electronics Market benefits from several key growth drivers. The trend towards miniaturization of electronic devices and components requires adhesives with exceptional bonding properties in confined spaces. PUR adhesives offer the versatility to bond different materials used in electronic assemblies, including metals, plastics, and ceramics. Moreover, the increasing complexity of electronic devices and the demand for lightweight, high-strength materials contribute to the market expansion. The ability of PUR adhesives to provide strong, flexible bonds in diverse electronic applications drives their adoption in the electronics manufacturing sector.

Market Restraints:

Despite its rapid growth, the PUR Adhesives in Electronics Market faces certain challenges and constraints. Regulatory compliance, especially concerning the use of adhesives in electronic devices, poses challenges for market players. Additionally, the high initial cost of PUR adhesives compared to conventional alternatives may impact adoption, particularly in cost-sensitive electronic manufacturing environments. Addressing these challenges requires collaboration between adhesive manufacturers, electronic industry stakeholders, and regulatory bodies to ensure the development of compliant, cost-effective, and high-performance adhesive solutions.

Market Opportunities:

The PUR Adhesives in Electronics Market presents significant opportunities for innovation and market expansion. Emerging trends such as the development of low-VOC (volatile organic compounds) formulations, fast-curing adhesives, and environmentally friendly solutions offer new avenues for adhesive manufacturers. Integrating advanced features such as thermal conductivity, flame resistance, and enhanced flexibility can meet the evolving needs of electronic applications. Furthermore, strategic partnerships, collaborations with electronic component manufacturers, and investment in research and development enable companies to broaden their product portfolios, cater to specific industry requirements, and capitalize on emerging market trends.

Key Questions Answered in the Report:

What is the Forecast CAGR of the PUR Adhesives in Electronics Market?
What is the Market Size of the Market in the Year 2023?
Which Country Held the Largest Market Share in 2023?
What are the Key Players in the PUR Adhesives in Electronics Market?
Which is the Fastest-Growing Segment in the Application Segment?

Competitive Landscape and Business Strategies:

Leading players in the global PUR Adhesives in Electronics Market, including [Insert Key Companies], focus on product innovation, research and development, and customer-centric initiatives to maintain their market position and drive growth. These companies invest in formulating adhesives with enhanced properties, such as faster curing times, improved thermal conductivity, and reduced environmental impact. Collaborations with electronics manufacturers, suppliers, and research institutions facilitate market access and promote the adoption of PUR adhesives. Moreover, emphasis on customer education, technical support, and quality assurance fosters market growth and builds trust in the dynamic and evolving landscape of electronics adhesives.

Key Companies Profiled:

Henkel AG & Co. KGaA
3M
H.B Fuller
Dow Chemical Company
Sika AG
Avery Dennison
Master Bond Inc.
Lord Corporation
Huntsman Corporation
Permabond
DELO Industries Adhesives
Panacol

PUR Adhesives in Electronics Market Research Segmentation:

The dominance of thermal conductive polyurethane reactive (PUR) adhesives in the electronics market is driven by the increasing demand for efficient heat management solutions as electronic devices become more compact and powerful. Electrically conductive PUR adhesives are experiencing the fastest growth, especially in sectors like automotive and telecommunications, fueled by the need for enhanced connectivity.

In terms of applications, potting & encapsulation leads due to the rising demand for reliable protection and insulation of electronic components. Conformal coatings are rapidly growing, driven by the complexity of electronic devices in consumer electronics, automotive, and aerospace sectors.

The Asia Pacific region is the dominant market for PUR adhesives, with robust manufacturing activities in countries like China, Japan, and South Korea. The region's substantial investments in research and development, coupled with continuous technological advancements, contribute to its leading position.

North America is the fastest-growing region for PUR adhesives, benefiting from a robust technological landscape and high demand in industries such as electronics, aerospace, and automotive. The focus on sustainable and eco-friendly adhesives aligns with growing environmental awareness, making North America a rapidly expanding market for PUR adhesives.

By Component Type:

Thermal Conductive
Electrically Conductive
UV Curing
Others

By Application:

Surface-mount devices
Potting & Encapsulation
Conformal Coatings
Others

By Region:

North America
Europe
East Asia
South Asia & Oceania
Latin America
Middle East & Africa

Product Code: PMRREP33796

1. Executive Summary

1.1. Global PUR Adhesives in Electronics Market Snapshot, 2023 and 2030
1.2. Market Opportunity Assessment, 2023 - 2030, US$ Mn
1.3. Key Market Trends
1.4. Future Market Projections
1.5. Premium Market Insights
1.6. Industry Developments and Key Market Events
1.7. PMR Analysis and Recommendations

2. Market Overview

2.1. Market Scope and Definition
2.2. Market Dynamics
- 2.2.1. Drivers
- 2.2.2. Restraints
- 2.2.3. Opportunity
- 2.2.4. Challenges
- 2.2.5. Key Trends
2.3. Component Type Lifecycle Analysis
2.4. PUR Adhesives in Electronics Market: Value Chain
- 2.4.1. List of Raw Material Supplier
- 2.4.2. List of Manufacturers
- 2.4.3. List of Distributors
- 2.4.4. List of Applications
- 2.4.5. Profitability Analysis
2.5. Porter Five Force's Analysis
2.6. Geopolitical Tensions: Market Impact
2.7. Macro-Economic Factors
- 2.7.1. Global Sectorial Outlook
- 2.7.2. Global GDP Growth Outlook
- 2.7.3. Global Parent Market Overview
2.8. Forecast Factors - Relevance and Impact
2.9. Regulatory and Technology Landscape

3. Global PUR Adhesives in Electronics Market Outlook: Historical (2018 - 2022) and Forecast (2023 - 2030)

3.1. Key Highlights
- 3.1.1. Market Volume (Units) Projections
- 3.1.2. Market Size and Y-o-Y Growth
- 3.1.3. Absolute $ Opportunity
3.2. Market Size (US$ Mn) Analysis and Forecast
- 3.2.1. Historical Market Size Analysis, 2013-2016
- 3.2.2. Current Market Size Forecast, 2018-2026
3.3. Global PUR Adhesives in Electronics Market Outlook: Component Type
- 3.3.1. Introduction / Key Findings
- 3.3.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Component Type, 2018 - 2022
- 3.3.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2023 - 2030
  - 3.3.3.1. Thermal Conductive
  - 3.3.3.2. Electrically Conductive
  - 3.3.3.3. UV Curing
  - 3.3.3.4. Others
3.4. Market Attractiveness Analysis: Component Type
3.5. Global PUR Adhesives in Electronics Market Outlook: Application
- 3.5.1. Introduction / Key Findings
- 3.5.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Application, 2018 - 2022
- 3.5.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2023 - 2030
  - 3.5.3.1. Surface-mount devices
  - 3.5.3.2. Potting & Encapsulation
  - 3.5.3.3. Conformal Coatings
  - 3.5.3.4. Others
3.6. Market Attractiveness Analysis: Application

4. Global PUR Adhesives in Electronics Market Outlook: Region

4.1. Key Highlights
4.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Region, 2018 - 2022
4.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Region, 2023 - 2030
- 4.3.1. North America
- 4.3.2. Europe
- 4.3.3. East Asia
- 4.3.4. South Asia and Oceania
- 4.3.5. Latin America
- 4.3.6. Middle East & Africa (MEA)
4.4. Market Attractiveness Analysis: Region

5. North America PUR Adhesives in Electronics Market Outlook: Historical (2018 - 2022) and Forecast (2023 - 2030)

5.1. Key Highlights
5.2. Pricing Analysis
5.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2018 - 2022
- 5.3.1. By Country
- 5.3.2. By Component Type
- 5.3.3. By Application
5.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2023 - 2030
- 5.4.1. U.S.
- 5.4.2. Canada
5.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2023 - 2030
- 5.5.1. Thermal Conductive
- 5.5.2. Electrically Conductive
- 5.5.3. UV Curing
- 5.5.4. Others
5.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2023 - 2030
- 5.6.1. Surface-mount devices
- 5.6.2. Potting & Encapsulation
- 5.6.3. Conformal Coatings
- 5.6.4. Others
5.7. Market Attractiveness Analysis

6. Europe PUR Adhesives in Electronics Market Outlook: Historical (2018 - 2022) and Forecast (2023 - 2030)

6.1. Key Highlights
6.2. Pricing Analysis
6.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2018 - 2022
- 6.3.1. By Country
- 6.3.2. By Component Type
- 6.3.3. By Application
6.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2023 - 2030
- 6.4.1. Germany
- 6.4.2. France
- 6.4.3. U.K.
- 6.4.4. Italy
- 6.4.5. Spain
- 6.4.6. Russia
- 6.4.7. Turkiye
- 6.4.8. Rest of Europe
6.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2023 - 2030
- 6.5.1. Thermal Conductive
- 6.5.2. Electrically Conductive
- 6.5.3. UV Curing
- 6.5.4. Others
6.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2023 - 2030
- 6.6.1. Surface-mount devices
- 6.6.2. Potting & Encapsulation
- 6.6.3. Conformal Coatings
- 6.6.4. Others
6.7. Market Attractiveness Analysis

7. East Asia PUR Adhesives in Electronics Market Outlook: Historical (2018 - 2022) and Forecast (2023 - 2030)

7.1. Key Highlights
7.2. Pricing Analysis
7.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2018 - 2022
- 7.3.1. By Country
- 7.3.2. By Component Type
- 7.3.3. By Application
7.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2023 - 2030
- 7.4.1. China
- 7.4.2. Japan
- 7.4.3. South Korea
7.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2023 - 2030
- 7.5.1. Thermal Conductive
- 7.5.2. Electrically Conductive
- 7.5.3. UV Curing
- 7.5.4. Others
7.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2023 - 2030
- 7.6.1. Surface-mount devices
- 7.6.2. Potting & Encapsulation
- 7.6.3. Conformal Coatings
- 7.6.4. Others
7.7. Market Attractiveness Analysis

8. South Asia & Oceania PUR Adhesives in Electronics Market Outlook: Historical (2018 - 2022) and Forecast (2023 - 2030)

8.1. Key Highlights
8.2. Pricing Analysis
8.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2018 - 2022
- 8.3.1. By Country
- 8.3.2. By Component Type
- 8.3.3. By Application
8.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2023 - 2030
- 8.4.1. India
- 8.4.2. Southeast Asia
- 8.4.3. ANZ
- 8.4.4. Rest of South Asia & Oceania
8.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2023 - 2030
- 8.5.1. Thermal Conductive
- 8.5.2. Electrically Conductive
- 8.5.3. UV Curing
- 8.5.4. Others
8.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2023 - 2030
- 8.6.1. Surface-mount devices
- 8.6.2. Potting & Encapsulation
- 8.6.3. Conformal Coatings
- 8.6.4. Others
8.7. Market Attractiveness Analysis

9. Latin America PUR Adhesives in Electronics Market Outlook: Historical (2018 - 2022) and Forecast (2023 - 2030)

9.1. Key Highlights
9.2. Pricing Analysis
9.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2018 - 2022
- 9.3.1. By Country
- 9.3.2. By Component Type
- 9.3.3. By Application
9.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2023 - 2030
- 9.4.1. Brazil
- 9.4.2. Mexico
- 9.4.3. Rest of Latin America
9.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2023 - 2030
- 9.5.1. Thermal Conductive
- 9.5.2. Electrically Conductive
- 9.5.3. UV Curing
- 9.5.4. Others
9.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2023 - 2030
- 9.6.1. Surface-mount devices
- 9.6.2. Potting & Encapsulation
- 9.6.3. Conformal Coatings
- 9.6.4. Others
9.7. Market Attractiveness Analysis

10. Middle East & Africa PUR Adhesives in Electronics Market Outlook: Historical (2018 - 2022) and Forecast (2023 - 2030)

10.1. Key Highlights
10.2. Pricing Analysis
10.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2018 - 2022
- 10.3.1. By Country
- 10.3.2. By Component Type
- 10.3.3. By Application
10.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2023 - 2030
- 10.4.1. GCC
- 10.4.2. Egypt
- 10.4.3. South Africa
- 10.4.4. Northern Africa
- 10.4.5. Rest of Middle East & Africa
10.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2023 - 2030
- 10.5.1. Thermal Conductive
- 10.5.2. Electrically Conductive
- 10.5.3. UV Curing
- 10.5.4. Others
10.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2023 - 2030
- 10.6.1. Surface-mount devices
- 10.6.2. Potting & Encapsulation
- 10.6.3. Conformal Coatings
- 10.6.4. Others
10.7. Market Attractiveness Analysis

11. Competition Landscape

11.1. Market Share Analysis, 2022
11.2. Market Structure
- 11.2.1. Competition Intensity Mapping By Market
- 11.2.2. Competition Dashboard
- 11.2.3. Apparent Product Capacity
11.3. Company Profiles (Details - Overview, Financials, Strategy, Recent Developments)
- 11.3.1. Henkel AG & Co. KGaA
  - 11.3.1.1. Overview
  - 11.3.1.2. Segments and Product
  - 11.3.1.3. Key Financials
  - 11.3.1.4. Market Developments
  - 11.3.1.5. Market Strategy
- 11.3.2. 3M
  - 11.3.2.1. Overview
  - 11.3.2.2. Segments and Product
  - 11.3.2.3. Key Financials
  - 11.3.2.4. Market Developments
  - 11.3.2.5. Market Strategy
- 11.3.3. H.B Fuller
  - 11.3.3.1. Overview
  - 11.3.3.2. Segments and Product
  - 11.3.3.3. Key Financials
  - 11.3.3.4. Market Developments
  - 11.3.3.5. Market Strategy
- 11.3.4. Dow Chemical Company
  - 11.3.4.1. Overview
  - 11.3.4.2. Segments and Product
  - 11.3.4.3. Key Financials
  - 11.3.4.4. Market Developments
  - 11.3.4.5. Market Strategy
- 11.3.5. Sika AG
  - 11.3.5.1. Overview
  - 11.3.5.2. Segments and Product
  - 11.3.5.3. Key Financials
  - 11.3.5.4. Market Developments
  - 11.3.5.5. Market Strategy
- 11.3.6. Avery Dennison
  - 11.3.6.1. Overview
  - 11.3.6.2. Segments and Product
  - 11.3.6.3. Key Financials
  - 11.3.6.4. Market Developments
  - 11.3.6.5. Market Strategy
- 11.3.7. Master Bond Inc.
  - 11.3.7.1. Overview
  - 11.3.7.2. Segments and Product
  - 11.3.7.3. Key Financials
  - 11.3.7.4. Market Developments
  - 11.3.7.5. Market Strategy
- 11.3.8. Lord Corporation
  - 11.3.8.1. Overview
  - 11.3.8.2. Segments and Product
  - 11.3.8.3. Key Financials
  - 11.3.8.4. Market Developments
  - 11.3.8.5. Market Strategy
- 11.3.9. Huntsman Corporation
  - 11.3.9.1. Overview
  - 11.3.9.2. Segments and Product
  - 11.3.9.3. Key Financials
  - 11.3.9.4. Market Developments
  - 11.3.9.5. Market Strategy
- 11.3.10. Permabond
  - 11.3.10.1. Overview
  - 11.3.10.2. Segments and Product
  - 11.3.10.3. Key Financials
  - 11.3.10.4. Market Developments
  - 11.3.10.5. Market Strategy
- 11.3.11. DELO Industries Adhesives
  - 11.3.11.1. Overview
  - 11.3.11.2. Segments and Product
  - 11.3.11.3. Key Financials
  - 11.3.11.4. Market Developments
  - 11.3.11.5. Market Strategy
- 11.3.12. Panacol
  - 11.3.12.1. Overview
  - 11.3.12.2. Segments and Product
  - 11.3.12.3. Key Financials
  - 11.3.12.4. Market Developments
  - 11.3.12.5. Market Strategy
- 11.3.13. ITW Polymers Adhesives
  - 11.3.13.1. Overview
  - 11.3.13.2. Segments and Product
  - 11.3.13.3. Key Financials
  - 11.3.13.4. Market Developments
  - 11.3.13.5. Market Strategy

12. Appendix

H12.1. Research Methodology

H12.2. Research Assumptions

H12.3. Acronyms and Abbreviations