PUBLISHER: Prescient & Strategic Intelligence | PRODUCT CODE: 2144032
PUBLISHER: Prescient & Strategic Intelligence | PRODUCT CODE: 2144032
The Direct-to-Chip Cooling Components Market was valued at USD 2.30 billion in 2025 and is estimated at USD 2.75 billion in 2026. It is projected to reach USD 8.11 billion by 2032, expanding at a CAGR of 19.72% during 2026-2032.
Cloud operators and AI-chip designers now order cold plates, coolant distribution units, and quick-disconnect couplings as standard line items on server orders, because fans and chilled air can no longer pull enough heat off a modern GPU rack. Cooling hardware has become a recurring procurement category rather than a one-off facility upgrade.
Demand tracks the rapid expansion of hyperscale and AI-focused data center capacity. Lawrence Berkeley National Laboratory found that US data centers used 4.4% of total US electricity in 2023, up from 1.9% in 2018, a jump concentrated in AI training and inference facilities. Each new cluster needs its own cold plates, manifolds, and coolant distribution units before racks can power on, so market growth follows data center construction schedules more than broader IT budgets.
Key Insights
Cold plates led the component category with a 41% share in 2025. Every accelerator package needs its own plate, so a rack with eight accelerators needs eight plates but only one coolant distribution unit. CDUs, though, are set to grow fastest through 2026-2032 as operators move to smaller row-level and rack-level units.
Single-phase systems accounted for 68% of the market in 2025 because they are simpler to design, install, and service. Two-phase systems are on track to grow fastest through 2026-2032, with server makers qualifying them first for their highest-density platforms.
Water-based and water-glycol coolants held 53% of the market in 2025, since facilities teams already maintain that chemistry for chillers. Dielectric fluids are set to grow fastest through 2026-2032. They can safely contact a powered chip package if a fitting weeps.
Data center applications took 51% of the market in 2025. High-performance computing is on track to grow fastest through 2026-2032, as national laboratories standardize exascale-class systems on direct-to-chip cooling.
Telecommunications accounted for 48% of the market by end-use industry in 2025. Oil & gas is set to grow fastest through 2026-2032 as energy majors add GPU acceleration to seismic imaging and reservoir simulation.
North America generated 38% of revenue in 2025, the largest share of any region. US private data center construction reached a USD 50.7 billion annualized rate by April 2026, up from USD 39.8 billion a year earlier.
Asia-Pacific is the fastest-growing region, with a 20.4% CAGR projected for 2026-2032 as governments fund national AI-compute programs and operators build new capacity instead of retrofitting older halls. China is its largest market, and India is emerging as the fastest-growing one.
AI server power density rose roughly elevenfold between 2020 and 2025, according to the International Energy Agency, with newer racks drawing 30 to 110 kilowatts against 5 to 15 kilowatts for a conventional server rack.
The Open Compute Project's Universal Quick Disconnect specification, now in its second revision, lets hardware from different suppliers share one loop, opening sockets that once went to incumbents. ASHRAE has also published liquid-cooling classes H1 through H3, which should let vendors build standard models instead of custom ones.
Rising copper costs weigh on pricing. A US Section 232 proclamation set a 50% tariff on imports of semi-finished copper products and copper-intensive derivatives, effective August 1, 2025.
The market is moderately fragmented, with roughly 18 companies and no dominant supplier. Diversified players such as Vertiv Holdings Co., Schneider Electric SE, nVent Electric plc, and Rittal GmbH & Co. KG compete on bundling a full thermal order. Specialists including CoolIT Systems Inc., Asetek A/S, LiquidStack B.V., ZutaCore Ltd., and Iceotope Technologies Limited compete on engineering depth and speed to qualify.
Eaton Corporation plc completed its USD 9.55 billion acquisition of the Boyd Thermal business in March 2026, and Ecolab Inc. closed its purchase of CoolIT Systems for approximately USD 4.75 billion in July 2026.