PUBLISHER: QYResearch | PRODUCT CODE: 1857072
 
				PUBLISHER: QYResearch | PRODUCT CODE: 1857072
The global market for TCB Bonder was estimated to be worth US$ 119 million in 2024 and is forecast to a readjusted size of US$ 317 million by 2031 with a CAGR of 14.5% during the forecast period 2025-2031.
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
The market size continues to expand, with the Asia-Pacific region leading the growth.
Drivers: The surge in demand for advanced packaging (such as 3D IC and Chiplet) in fields like 5G communication, high-performance computing (HPC), and automotive electronics is driving the growth in demand for bonding machines.
Technological Upgrades: Automation and high precision are becoming mainstream.
High-precision alignment: The accuracy of optical alignment systems has improved to +-1μm, meeting the requirements for tiny solder joints in advanced packaging.
Low-temperature bonding technology: Reduces thermal stress damage, suitable for sensitive devices like flexible electronics and MEMS.
Multi-material compatibility: Supports bonding of heterogeneous materials such as metals, ceramics, and polymers, expanding application scenarios.
Market Competition Landscape: High concentration, with accelerated domestic substitution.
Increased localization rate: Policy support combined with the expansion of local semiconductor production capacity (e.g., demand from SMIC and Tongfu Microelectronics) is driving the substitution of domestic equipment for imports.
Expansion of application areas: Advanced packaging and emerging demands.
Semiconductor packaging: Flip Chip, Wafer Level Packaging (WLP), and 3D IC integration have the highest demand for thermal compression bonding machines.
MEMS and sensors: The need for hermetic packaging is driving the application of bonding machines in automotive electronics and the Internet of Things.
Flexible electronics: The demand for low-temperature bonding technology is growing in the manufacturing of wearable devices and flexible screens.
Power devices: The packaging of silicon carbide (SiC) and gallium nitride (GaN) devices relies on high-reliability bonding processes.
The thermal compression bonding machine industry will exhibit characteristics of "technological refinement, market regionalization, and competitive differentiation." As the autonomy of China's semiconductor industry chain accelerates, domestic equipment is expected to achieve overtaking in niche areas (such as thermosonic bonding and flexible electronic packaging), while remaining vigilant about risks from international trade friction and supply chain fluctuations.
This report aims to provide a comprehensive presentation of the global market for TCB Bonder, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of TCB Bonder by region & country, by Type, and by Application.
The TCB Bonder market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding TCB Bonder.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of TCB Bonder manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of TCB Bonder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of TCB Bonder in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
 
                 
                 
                