PUBLISHER: QYResearch | PRODUCT CODE: 1876069
PUBLISHER: QYResearch | PRODUCT CODE: 1876069
The global market for Underfill was estimated to be worth US$ 737 million in 2024 and is forecast to a readjusted size of US$ 1344 million by 2031 with a CAGR of 8.5% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Underfill cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Underfill materials are a type of specialized material used in the field of electronic packaging, primarily designed to fill the gaps between integrated circuits (ICs) and printed circuit boards (PCBs) to enhance the reliability and durability of electronic components. Underfill materials are typically made from high-performance substances such as epoxy resins, cyanate esters, and silicone resins, which possess excellent fluidity, thermal stability, mechanical shock resistance, and low coefficient of expansion. These materials effectively reduce thermal stress caused by thermal cycling, ensuring that the packaged structure remains stable and durable during use. They are mainly used in semiconductor packaging, especially in packaging types such as Ball Grid Array (BGA) and Chip-on-Substrate (CSP).
The variety of underfill materials is broad, with different formulations tailored to specific application requirements. For example, fast-curing underfill materials are suitable for high-efficiency production environments, while materials with low expansion coefficients are ideal for applications requiring high thermal stability. In addition, as electronic products continue to demand higher performance, new types of underfill materials have emerged, including those with better thermal conductivity, moisture resistance, and enhanced adhesion properties. The application range of these materials is not limited to traditional consumer electronics but is gradually expanding to fields such as automotive electronics, medical electronics, and aerospace. Driven by emerging technologies like 5G and the Internet of Things (IoT), the demand for underfill materials is increasing, further boosting market growth.
The underfill material market has experienced steady growth over the past few years, driven by several factors. First, the performance requirements of electronic products have been increasingly demanding, particularly with the growing density of integrated circuit packaging, which has raised the standards for underfill materials. Additionally, the widespread adoption of 5G, the Internet of Things (IoT), and smart devices has positively impacted market demand. These emerging technologies require smaller, more efficient, and reliable electronic components, leading to the broader application of underfill materials in new scenarios.
The main risks facing the market include fluctuations in raw material prices, instability in the supply chain, and increasingly stringent environmental regulations. The production process of some underfill materials can have certain environmental impacts, and changes in environmental regulations may exert pressure on the market. Furthermore, the technology barriers for underfill materials are high, requiring continuous innovation to meet more complex and diversified needs. This means that leading companies in the market, with their technological advantages and innovation capabilities, have captured a significant market share, resulting in a relatively concentrated market structure.
In terms of downstream demand, the demand from consumer electronics, automotive electronics, and industrial electronics continues to grow, particularly in the fields of smartphones, automotive electronics, and medical devices, where the demand for underfill materials is on the rise. As intelligent and high-performance electronic products become more widespread, the demand for high-performance and highly reliable underfill materials has become stronger.
In terms of the latest technologies, thermally conductive underfill materials, low expansion coefficient materials, and environmentally friendly materials are becoming mainstream trends in the market. Thermally conductive materials can significantly improve the heat dissipation performance of packaging, especially in high-power electronic components. Low expansion coefficient materials are suitable for applications in environments with high temperature variations. Environmentally friendly underfill materials, with their low environmental impact and compliance with stringent environmental standards, are increasingly favored by customers.
This report aims to provide a comprehensive presentation of the global market for Underfill, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Underfill by region & country, by Type, and by Application.
The Underfill market size, estimations, and forecasts are provided in terms of sales volume (MT) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Underfill.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Underfill manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Underfill in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Underfill in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.