Next-generation Central and Zonal Communication Network Topology and Chip Industry Research Report, 2025

Description

The automotive E/E architecture is evolving towards a "central computing + zonal control" architecture, where the central computing platform is responsible for high-computing-power tasks, and zonal controllers are responsible for executing specific control functions.

"Domain-centralized" architecture communication framework:

Various domains form a backbone network through gateways, and data intercommunication and operations are realized through communication protocols such as SOME/IP and DDS, and communication middleware.

A backbone network such as CAN-FD and 100M/1G Ethernet has been formed.

"Central + Zonal" architecture communication framework::

Communication bandwidth improvement: Transitioning from domain controllers to central computing units, which physically concentrate various important computing units, including intelligent gateways, cockpit domain controllers, ADAS domain controllers, and the central computing part of some zonal controllers. This physical concentration directly shortens communication distances and optimizes communication bandwidth by an order of magnitude.

Communication interface upgrade: From CAN-FD and 1G Ethernet to various advanced interfaces such as D2D, 10G Ethernet, fiber optic communication, PCIe5.0, CXL, NVLink, and UCIe.

Integration of high-speed communication and MCU control capabilities: With the rise of advanced functions such as ADAS and autonomous driving, even the most powerful MCU cannot quickly acquire and share data without a high-speed network; conversely, without a powerful real-time MCU, mere communication channels cannot precisely control vehicle behavior.

According to the connection range, automotive communication networks can be divided into in-vehicle networks and out-of-vehicle networks. The in-car network architecture is mainly evolving towards a central ring network architecture, and the application of fiber optic Ethernet in vehicles is advancing; the out-of-car network is divided into short-range and long-range networks, with diverse application scenarios that cannot be supported by a single technology, requiring the collaborative development of multiple technologies such as V2X and satellite Internet.

Application scenarios and trends of next-generation high-speed communication links

Next-generation Central + Zonal architecture passenger cars exchange massive amounts of data in real-time between sensors such as cameras, radars, and LiDARs, high-definition display units, and high-performance central computing units. They also support full-vehicle OTA software updates, remote diagnostics, and functional safety requirements, placing unprecedented composite demands on in-vehicle networks for high bandwidth, low latency, and security.

Such huge data volumes pose unprecedented challenges to data transmission speed and stability. Traditional communication transmission architectures struggle to meet the real-time and smooth data transmission requirements of new-generation automotive intelligence, creating an urgent need for faster and more reliable communication technologies.

(1) Surge in data volume due to improved camera resolution

As the level of autonomous driving increases, the precision requirements for environmental perception become more stringent. In-vehicle cameras, as important visual sensors, are inevitably upgrading in resolution.

1-5MP cameras: Mainly used in surround-view and side-view scenarios, transitioning from 1.3MP to 3MP/5MP.

8MP cameras: Core growth driver in the next 5 years, promoted by upgrades from L2 front-view integrated systems to 8MP, highway (L2.5)/urban NOA (L2.9), and camera mirror system (CMS); 8MP will account for over 35% of total shipments by 2030.

New technologies such as 10+ MP front-view cameras, 4D imaging radar fusion, and light field lenses (commercialization in 2027) will reshape the perception architecture to provide better image quality and more detailed information for advanced ADAS/AD algorithms. Sony has launched a 17MP product with a detection range of 250 meters. High-resolution cameras capture richer environmental details, crucial for autonomous vehicles to accurately identify traffic signs, pedestrians, and other vehicles.

With the increasing proportion of high-level autonomous vehicles and high hardware redundancy among automakers, the average number of cameras per vehicle will grow from 4 in 2024 to 8.3 in 2030, according to ResearchInChina. ADAS camera transmission requires 1 serializer chip per camera, while deserializer chips typically support multiple channels (e.g., 4-in-1), with an average of 4 cameras sharing 1 deserializer.

VelinkTech's self-developed high-speed in-vehicle SerDes chip was successfully mass-produced and installed in the 2026 Lynk & Co 06, marking the world's first large-scale mass production of automotive-grade SerDes chips based on the MIPI A-PHY protocol.

(2) Massive data transmission pressure from improved display resolution

Increased communication transmission requirements in intelligent cockpits stem primarily from improved display resolution, advancing from 720P and 1080P to 2K, 4K, and even 8K. 4K single-screen resolution reaches 3840X2160; 8K is even higher, with exponentially growing data volumes. 4K screens require tens of Gbps transmission rates, with multi-screen setups exacerbating demands. High-resolution content transmission between screens in multi-screen interactions must maintain quality while synchronizing additional data, with dynamic switching increasing load. High-resolution multimedia processing and cloud interactions, such as 4K/8K video, AR functions, and AI features, all consume significant bandwidth.

Rsemi launched a 32Gbps high-performance SerDes chip for in-vehicle displays at the 2025 Qualcomm Automotive Technology and Cooperation Summit. This chip adopts an advanced technical architecture, supports full-rate lossless DP interface solutions, is compatible with speeds from 32Gbps to 3.2Gbps, supports 2 to 4 R-LinC outputs, can directly drive 4X4K displays with DSC (Display Stream Compression) technology, and up to 8 displays with daisy-chain technology, providing rich and detailed display effects and flexible, efficient display system solutions for smart cars. Additionally, the deserializer chip integrates Bridge and OSD functions to further enhance system integration.

Norelsys is gradually building a product matrix covering full-scenario in-vehicle transmission needs through step-by-step iterations: "2G -> 3.2G -> 6.4G -> 12.8G -> 25.6G". Norelsys has currently mass-produced over 20 HSMT standard in-vehicle SerDes chips, with product lines covering transmission rates from 2Gbps to 12.8Gbps. These chips can adapt to diverse needs such as different specifications of in-vehicle cameras (supporting up to 17MP), 4D radars, LiDARs, and 4K displays.

(3) "Central computing radar" is an important evolution direction for in-vehicle millimeter-wave radars, with raw ADC data transmitted to central computers via high-speed SerDes

With the evolution of vehicle central computing architectures, central computing radar represents an important development direction for in-vehicle millimeter-wave radars. A "central computing radar" refers to a "simplified radar" in which only RF front-end and minimal preprocessing are implemented. The radar transmits raw data to domain controllers via high-speed buses (e.g., high-speed Ethernet or SerDes) for subsequent post-processing. Its advantages include:

Satellite radars adopt centralized processing and power supply: Centralized processing transmits radar data to a central processing unit, reducing processing requirements around sensors; centralized power supply simplifies system power management, improving energy efficiency, reducing energy consumption, and enhancing radar system reliability and performance.

RF front-end technology will gradually mature: Triggering standardization of communication interfaces for "central computing radars," evolving radars into standard perception sensor components (similar to "cameras," where sensors are no longer coupled with domain control software). This will enable more flexible adaptation and replacement of "central computing radars" in vehicles.

Transmission of raw ADC data: Under end-to-end algorithm architectures, using more raw radar signals (with less information loss) may yield better overall perception performance.

MMICs for central computing radars require higher RF front-end performance but lower processor performance. Currently, TI and NXP have launched chip solutions for central computing radars.

XretinAl Technology launched a 4D radar central computing system based on Black Sesame Technologies' Huashan-2 A1000 chip, which uniformly processes raw radar data in domain controllers via high-speed Ethernet or SerDes.

Application trends of fiber optic Ethernet high-speed communication

In the automotive sector, the rapid increase in sensor number and higher real-time requirements have gradually strained traditional electrical communication methods. From sensors to ECUs and from central computing platforms to display systems, numerous devices require high-speed, stable interconnection. The complex electromagnetic environment inside vehicles further subjects electrical communication to signal interference and reduced reliability.

In 2023, the IEEE Standards Association released the in-vehicle fiber optic Ethernet technical standard IEEE 802.3cz-2023, adding physical layer specifications and management parameters for 2.5 Gb/s, 5 Gb/s, 10 Gb/s, 25 Gb/s, and 50 Gb/s operations over glass fiber in automotive environments.

Currently, fiber optic Ethernet has moved from experimental verification to commercial implementation, building high-bandwidth, low-latency, secure, and controllable in-vehicle communication backbones through CSI packaging, path replication, and multi-interface integration. However, there remain unresolved controversies in in-vehicle fiber optic communication solutions, primarily regarding fiber optic and optical communication components, especially laser selection.

A complete in-vehicle optical communication system consists of fiber optic harnesses, optical modules, and connectors:

Fiber optic harnesses represent the most technically mature component with the highest industry participation, being one of the first key components to evolve from purely electrical to fiber optic.

In-vehicle optical modules operate in harsher environments, requiring stricter specifications including wide temperature range adaptation (-40°C to over 105°C), ultra-long service life (over 15 years), high reliability, and adaptation to various extreme environments.

In-vehicle fiber optic connectors must not only meet conventional performance metrics such as insertion loss and return loss but also maintain stability under high-frequency vibration.

Compared to relatively backward traditional 100M/1G/10G copper automotive Ethernet, China's supply chain has developed competitiveness in fiber optic Ethernet, with automotive-grade solutions available across all links, creating opportunities for leapfrog development. As intelligent vehicles transition to advanced autonomous driving and central centralized architectures, "fiber advancement and copper retreat" has become a viable option.

HingeTech has introduced a communication architecture for automobiles using an all-optical network. Its self-developed high-speed fiber optic TSN centralized gateway architecture enables high-bandwidth, ultra-low latency, low-cost, and highly deterministic transmission of massive in-vehicle network communication data via fiber optics, supporting a maximum transmission rate of 10Gbps with excellent EMC performance. This architecture is primarily applied in systems including ADAS, autonomous driving, 360° surround-view, in-vehicle infotainment, BMS, and centralized computing architectures, with a maximum transmission bandwidth of 25Gbps.

EEA optical communication architectures built on optical modules connect multiple optical modules with multiple zonal gateways, which can be replaced with other controllers such as T-Boxes and domain controllers as needed.

In hardware design, BTB connectors link optical modules and zonal gateways, with data and control signals transmitted via interfaces such as MIPI-CSI, SGMII, I2C/SPI, and GPIO.

Optical modules and zonal gateways are placed in different vehicle zones, with nearby ECUs connected to adjacent optical modules or zonal gateways. If zonal gateways receive traditional CAN or LIN signals, they transmit them to optical modules for conversion to optical signals for processing by the central computing platform. Different zonal gateways can exchange data via optical modules.

Optical modules are primarily responsible for fiber optic signal transceiving, receiving GMSL2 camera signals and fiber optic Ethernet camera signals, receiving fiber optic LiDAR signals, and forwarding fiber optic signals. EEA optical communication architectures built on optical modules enable high-speed, low-latency transmission of large data flows with beneficial EMC performance while remaining compatible with traditional networks.

Li Auto is collaborating with HingeTech to develop an in-vehicle optical communication test bench, which has completed A-sample delivery. This test bench incorporates jointly developed in-vehicle optical communication Ethernet technology, with core components including in-vehicle optical modules, in-vehicle fiber optic connectors, and in-vehicle optical fibers.

In 2024, Dongfeng collaborated with Yangtze Optical Fiber and Cable (YOFC) to complete the first research phase, achieving the transition from industrial-grade to automotive-grade cable assemblies. The research comprehensively validated performance under extreme environments such as high temperatures (125°C) and high vibrations (V3 level), completing a full verification process from assemblies to individual components and from test benches to actual vehicles, ensuring applicability across all vehicle environments including cockpits, chassis, and roofs.

Research focused on designing and optimizing optical fibers, cables, and connectors, ultimately producing automotive-grade cable harness assemblies with complete optical, mechanical, and environmental characteristics. Rigorous verification confirmed stable operation under various complex environments including extreme cold and heat. Component verification included 53 key tests covering optical performance, mechanical strength, and environmental adaptability. Bench testing evaluated over ten indicators including Ethernet communication functionality, robustness, and voltage stability according to national standards (e.g., GB/T 24581, QC/T 2910) and enterprise standards.

For vehicle testing, the Dongfeng Eπ007 model completed 12,000 km of extreme road testing in Xiangyang, including bumpy and high-vibration scenarios, with stable communication and no packet loss.

Product Code: XX015

Chapter 1 Central + Zonal Communication Topology Architecture

1.1 Definition and Classification of In-Vehicle Communication Networks
Classification of In-Vehicle Communication Networks
Classification System and Technical Overview of In-Vehicle Communication Networks (1)
Classification System and Technical Overview of In-Vehicle Communication Networks (2)
Classification System and Technical Overview of In-Vehicle Communication Networks (3)
1.2 Deployment Status and Trends of Central + Zonal Architecture
Evolution Trend of Vehicle E/E Architecture
In Central + Zonal Architecture, Communication Bandwidth Will Increase Significantly by Orders of Magnitude
In Central + Zonal Architecture, Control and Communication Functions Are Zone-Integrated
Deployment Status of E/E Architecture and Future Five-Year Trend, 2024-2030E
Deployment Status of E/E Architecture and Future Five-Year Trend, 2024-2030E (Appendix Table)
Three Development Stages in E/E Evolution: Multi Box, One Box, One Chip (1)
Three Development Stages in E/E Evolution: Multi Box, One Box, One Chip (2)
Multi-Domain DCU - Typical Multi Box Solution
Cockpit-Driving Integrated CCU - One Box Solution
Cockpit-Driving Integrated CCU - Typical One Box Solution
Central Computing CCU - One Chip Solution
Central Computing CCU - Typical One Chip Solution
Shipment Proportion of Multi BOX / One BOX Solutions
Central Computing CCU - Development Direction of Central + Zonal Architecture (1)
Central Computing CCU - Development Direction of Central + Zonal Architecture (2)
Central Computing CCU - Development Direction of Central + Zonal Architecture (3)
Central Computing CCU - Development Direction of Central + Zonal Architecture (4)
1.3 Cockpit-Driving Integration Architecture Design and Communication Requirements
How Central + Zonal Architecture Reconstructs Automotive Nervous System
Evolution of Central + Zonal Architecture: Cross-Domain Integration and Mechatronics
Evolution of Central + Zonal Architecture: Necessity of Cockpit-Driving Integration (1)
Evolution of Central + Zonal Architecture: Necessity of Cockpit-Driving Integration (2)
Evolution of Central + Zonal Architecture: Key Issues in Cockpit-Driving Integration - Data Communication and Protocol Optimization
Evolution of Central + Zonal Architecture: Key Issues in Cockpit-Driving Integration - System Compatibility and Expansion Breakthroughs
Evolution of Central + Zonal Architecture: Cockpit-Driving System Integration Strategy - Hardware Integration Architecture (1)
Evolution of Central + Zonal Architecture: Cockpit-Driving System Integration Strategy - Hardware Integration Architecture (2)
Evolution of Central + Zonal Architecture: Cockpit-Driving System Integration Strategy - Software Collaboration Architecture (1)
Evolution of Central + Zonal Architecture: Cockpit-Driving System Integration Strategy - Software Collaboration Architecture (2)
Evolution of Central + Zonal Architecture: Cockpit-Driving System Integration Strategy - Human-Machine Interaction Architecture
Evolution of Central + Zonal Architecture: Circuit Multiplexing Integration Strategy for Cockpit-Driving Integrated Domain Control
Evolution of Central + Zonal Architecture: Image Processing Strategy for Cockpit-Driving Integrated Domain Control
Evolution of Central + Zonal Architecture: Unified Management of System State Machines for Cockpit-Driving Integrated Domain Control
Evolution of Central + Zonal Architecture: Storage Multiplexing for Cockpit-Driving Integrated Domain Control
Evolution of Central + Zonal Architecture: OTA Reuse and Communication Diagnostics, Electrical Inspection Strategies for Cockpit-Driving Integrated Domain Control
Establishment of Central + Zonal Architecture Communication Architecture
Communication Network Construction of Central Computing Platform in Zonal Architecture
Communication Requirements in Central + Zonal Architecture: Backbone Communication
Communication Requirements in Central + Zonal Architecture: Backbone Communication - Communication Topology for L3/L4 Autonomous Driving
Communication Requirements in Central + Zonal Architecture: Backbone Communication - High-Speed Ethernet (1)
Communication Requirements in Central + Zonal Architecture: Backbone Communication - High-Speed Ethernet (2)
Communication Requirements in Central + Zonal Architecture: Backbone Communication - In-Vehicle Ethernet Switch Chips
Communication Requirements in Central + Zonal Architecture: Backbone Communication - In-Vehicle Fiber Optic Ethernet
Communication Requirements in Central + Zonal Architecture: Local Low-Speed Applications
Communication Requirements in Central + Zonal Architecture: Local Low-Speed Applications - Zonal ECU Communication (10Base-T1s and CAN-XL)
Communication Requirements in Central + Zonal Architecture: High-Speed Video Transmission (10G+ SerDes)
Communication Requirements in Central + Zonal Architecture: High-Speed Video Transmission (10G+ SerDes)
Communication Requirements in Central + Zonal Architecture: Inter-Chip Interconnection
Communication Requirements in Central + Zonal Architecture: Inter-Chip Interconnection - Communication Between SoC and Storage
Communication Requirements in Central + Zonal Architecture: Inter-Chip Interconnection - NVIDIA NVLink C2C
Communication Requirements in Central + Zonal Architecture: Edge-Side Wireless Communication
Communication Requirements in Central + Zonal Architecture: Zonal Gateway/Central Gateway
Communication Requirements in Central + Zonal Architecture: Central Gateway
Communication Requirements in Central + Zonal Architecture: Zonal Gateway
Communication Requirements in Central + Zonal Architecture: Zonal Gateway Processor Selection
Communication Requirements in Central + Zonal Architecture: Vehicle-Cloud Interconnection
Cybersecurity Challenges in Central + Zonal Architecture
Cybersecurity Protection Solutions for Ethernet Applications in Central + Zonal Architecture (1)
Cybersecurity Protection Solutions for Ethernet Applications in Central + Zonal Architecture (2)
Cybersecurity Protection Solutions for Ethernet Applications in Central + Zonal Architecture (3)

Chapter 2 Evolution Trends in In-Vehicle Communication (by Sub-Application Scenarios)

2.1 Communication Requirements for Intelligent Driving Scenarios
- 2.1.1 Penetration Rate of L1-L4 Intelligent Driving Systems in China's Passenger Cars
China's "Taxonomy of Driving Automation for Vehicles"
Installation rate of L1-L4 intelligent driving systems (including hardware pre-embedded) in China's Passenger Cars, 2022-2030E

2.1.2 Communication Links in Intelligent Driving Scenarios

Communication Logic in intelligent Driving Scenarios
Autonomous Driving Significantly increases Requirements for Vehicle Communication Network Performance, Computing Power, And Speed
Typical Communication Connections in Autonomous Driving Systems
Peripheral Communication of Autonomous Driving Domain Controllers

2.1.3 Communication Links for Intelligent Driving Cameras

Demand Prospects for ADAS In-Vehicle Cameras
Communication Bandwidth Requirements for High-Level ADAS
360° Surround-View Communication Links
Scenario Matching of SerDes Communication Chips for In-Vehicle Cameras (1)
Scenario Matching of SerDes Communication Chips for In-Vehicle Cameras (2)
SerDes Communication Bandwidth Requirements for In-Vehicle Cameras: Design of High-Speed Lossless Transmission In-Vehicle Camera Systems (1)
SerDes Communication Bandwidth Requirements for In-Vehicle Cameras: Design of High-Speed Lossless Transmission In-Vehicle Camera Systems (2)
Application of Automotive-Grade SerDes Chips in Cameras for Different ADAS Levels
Application of Automotive-Grade SerDes Chips in Cameras for Different ADAS Levels: Typical Configurations for Highway/Urban NOA
Appendix: Camera Installations and SerDes Communication Chip Deployments by Intelligent Driving Level in China, 2022-2030E (1)
Appendix: Camera Installations and SerDes Communication Chip Deployments by Intelligent Driving Level in China, 2022-2030E (2)
Appendix: Camera Installations and SerDes Communication Chip Deployments by Intelligent Driving Level in China, 2022-2030E (3)
Integration Solutions for SerDes Sensors (1): Rsemi Serializer-Deserializer Integrated Chip Solution
Integration Solutions for SerDes Sensors (2): Rsemi 6-Channel Deserializer Chip Solution
Integration Solutions for SerDes Sensors (3): Rsemi & Sony Semiconductor "Intelligent Driving 5V Super Vision" Solution
Integration Solutions for SerDes Sensors (4): iCatch Technology's Multi-Channel Surround-View Monitoring System Based on Valens VA7000
Integration Solutions for SerDes Sensors (5): 8MP Camera Connection Solution Based on Valens VA7000

2.1.4 Communication Links for Intelligent Driving Radars and 4D Imaging Radars

Radar: Working Principle and Structural Composition
Current Communication Methods for In-Vehicle Radars and 4D Imaging Radars
Next-Stage Evolution Direction of In-Vehicle Radars: Central Computing Radar (1)
Next-Stage Evolution Direction of In-Vehicle Radars: Central Computing Radar (2)
Implementation Solutions for Radars Based on Algorithm Deployment Locations (1)
Implementation Solutions for Radars Based on Algorithm Deployment Locations (2)
Implementation Solutions for Radars Based on Algorithm Deployment Locations (3): Central Computing Radar
Schematic Diagram of Multiple "Central Computing Radars" Connected Via SerDes Interfaces
Performance Improvement Logic for "Central Computing Radars" - Higher Performance (1)
Performance Improvement Logic for "Central Computing Radars" - Higher Performance (2)
Performance Improvement Logic for "Central Computing Radars" - Lower System Costs (1)
Performance Improvement Logic for "Central Computing Radars" - Lower System Costs (2)
Performance Improvement Logic for "Central Computing Radars" - Other Factors (1)
Performance Improvement Logic for "Central Computing Radars" - Other Factors (2)
Key Challenges of "Central Computing Radars"
Deployment Cases of Central Computing Radar Products: Continental AG
Deployment Cases of Central Computing Radar Products: Ambarella Oculii (1)
Deployment Cases of Central Computing Radar Products: Ambarella Oculii (2)
Deployment Cases of Central Computing Radar Products: Ambarella Oculii (3)
Deployment Cases of Central Computing Radar Products: XretinAl Technology (1)
Deployment Cases of Central Computing Radar Products: XretinAl Technology (2)
Deployment Cases of Central Computing Radar Products: Fusionride
Deployment Cases of Central Computing Radar Products: Others
Chip Solutions for Central Computing Radars: TI (Texas Instruments)
Chip Solutions for Central Computing Radars: NXP
Chip Solutions for Central Computing Radars: NXP
Market Size for Radars (including 4D Imaging Radars and Central Computing Radars) in China's Passenger Cars, 2022-2030E

2.1.5 Communication Links for Intelligent Driving LiDARs

Current Structural Principles and Bandwidth Requirements of Lidars
Next-Stage "Lidar Probe" Centralization Scheme (1)
Next-Stage "Lidar Probe" Centralization Scheme (2)
Market Size for LiDARs in China's Passenger Cars, 2022-2030E

2.1.6 Integrated Communication Links for Intelligent Driving Domain Controllers

Communication Links in Intelligent Driving Domains: Ethernet Switch Chips and Ethernet PHY Chips
Huawei's MDC610 Intelligent Driving Domain Controller: Hardware Motherboard and Chip Components
Huawei's MDC610 Intelligent Driving Domain Controller: System Design Schematic
Huawei's MDC610 Intelligent Driving Domain Controller: Cost Assessment
Teardown of XPeng's Xavier Autonomous Driving Domain Controller Board (1)
Teardown of XPeng's Xavier Autonomous Driving Domain Controller Board (2)
Teardown of XPeng's Xavier Autonomous Driving Domain Controller Board (3)
Tesla's Autonomous Driving Domain Controller AP3.0 Hardware Board
Li Auto L9 Autonomous Driving Domain Controller
ThunderX Auto RazorDCX Tongass: Qualcomm SA8255P Cockpit-Parking Integrated Domain Controller
2.2 Communication in Intelligent Cockpit Scenarios
- 2.2.1 Penetration Rate of L0-L4 Intelligent Cockpits in China's Passenger Cars
Classification Logic for Intelligent Cockpit Levels and Communication Interface Configurations
Penetration Rates of Intelligent Cockpits by Level (L0/L1/L2/L3/L4), 2024-2030E

2.2.2 Communication Links in Intelligent Cockpit Scenarios

Communication Connection Methods for Intelligent Cockpit Hardware Platforms
Classification of Intelligent Cockpit Hardware Platform Systems
Core Modules of Intelligent Cockpit Hardware Platforms
Main Components of Intelligent Cockpit Domain Controllers (1)
Main Components of Intelligent Cockpit Domain Controllers (2)

2.2.3 Communication Links for Center Console Infotainment Displays

In-Vehicle Display Communication Links (1)
In-Vehicle Display Communication Links (2)
Analysis of Communication Links and Requirements for In-Vehicle Displays with Different Resolutions
Types of In-Vehicle Display Interfaces (1)
Types of In-Vehicle Display Interfaces (2)
Types of In-Vehicle Display Interfaces (3)
Types of In-Vehicle Display Interfaces: Embedded DisplayPort (eDP)
Types of In-Vehicle Display Interfaces: Embedded DisplayPort (eDP)
Types of In-Vehicle Display Interfaces: SerDes Supporting Multiple Interface Types
Integrated SerDes Communication Solutions for Display Terminals (1): Norelsys One-stop SerDes Solution
Integrated SerDes Communication Solutions for Display Terminals (2): Rsemi 32Gbps High-performance SerDes Chip for In-Vehicle Displays
Integrated SerDes Communication Solutions for Display Terminals (3): Inova's Automotive Display SerDes Solution Supporting 4 Daisy-chained Displays
Integrated SerDes Communication Solutions for Display Terminals (4): ROHM's Multi-Display Solution for Vehicles (1)
Integrated SerDes Communication Solutions for Display Terminals (5): ROHM's Multi-Display Solution for Vehicles (2)
Large Center Console Screens (>=10") in China's Passenger Cars: Installations and Installation Rate, 2024-2025
LCD Instrument Clusters (>=10") in China's Passenger Cars: Installations and Installation Rate, 2024-2025
Rear-seat Entertainment Screens in China's Passenger Cars: Installations and Installation Rate, 2024-2025
Co-pilot Screens in China's Passenger Cars: Installations and Installation Rate, 2024-2025

2.2.4 AR HUD Display Communication Link

AR HUD Display Communication Link
Domestic Passenger Car HUD: Installations and Installation Rate, 2024-2025
Domestic Passenger Car HUD (by Product Type): Installations and Proportion, 2024-2025

2.2.5 Streaming Media Electronic Rearview Mirror Communication Link

Intelligent Cockpit Display Link: Automotive Streaming Media Rearview Mirror
Streaming Media Rearview Mirror & Electronic Exterior Rearview Mirror (CMS): Typical Equipped Models

2.2.6 Summary of In-Vehicle Display Links

Penetration Rate and Supporting Quantity of In-Vehicle Displays (Center Console Instrument, Rear Row, Co-Pilot, Streaming Media, HUD) in China's Passenger Cars, 2022-2030E
Penetration Rate and Supporting Quantity of In-Vehicle Displays (Center Console Instrument, Rear Row, Co-Pilot, Streaming Media, HUD) in China's Passenger Cars, 2022-2030E

2.2.7 Intelligent Cockpit Audio Communication Link

Intelligent Cockpit Audio Link
Intelligent Cockpit Audio Link: Digital Microphone - A2B Bus (1)
Intelligent Cockpit Audio Link: Digital Microphone - A2B Bus (2)
Intelligent Cockpit Audio Link: ADI Audio Bus A2B Solution

2.2.8 Intelligent Cockpit Domain Controller Communication Integration Link

Installations and Installation Rate of Domestic Passenger Car Intelligent Cockpit Domain Controllers, January-May 2025
Black Sesame Technologies + Intel: Next-Generation Intelligent Cockpit and Driving Integration Platform (1)
Black Sesame Technologies + Intel: Next-Generation Intelligent Cockpit and Driving Integration Platform (2)
Qualcomm SA8775P Cockpit Domain Controller Platform: Communication Design (Taking Desay SV ICPS01E as an Example)
Qualcomm SA8295P Cockpit Domain Controller Platform Teardown: Front of PCB Upper Board (Zeekr 007)
Qualcomm SA8295P Cockpit Domain Controller Platform Teardown: Back of PCB Upper Board (Zeekr 007)
Qualcomm SA8295P Cockpit Domain Controller Platform Teardown: Interface (Zeekr 007)
Qualcomm SA8295P Cockpit Domain Controller Platform Teardown: Cost Analysis (Zeekr 007)
Qualcomm 8155 Cockpit Domain Controller Platform: Communication Design (Taking Nobo Automotive as an Example)
MediaTek MT2712 Cockpit Domain Controller Platform: Communication Design (Taking Megatronix as an Example)
SemiDrive's Intelligent Cockpit SoC X9 Series Reference Board Based on ROMH SerDes IC
Communication Design in Mercedes-Benz NTG7 Cockpit PCB Board (1)
Communication Design in Mercedes-Benz NTG7 Cockpit PCB Board (2)
2.3 Vehicle Control Communication Scenarios
BMS
Basic Functions of On-Board BMS
On-Board BMS Communication Requirements
Wired BMS Communication Methods
Wired BMS Topology Structure
BMS Wired Communication Solution: Application of Neuron's AUTBUS Technology in BMS
BMS Wired Communication Solution: Changan Deepal BMS Control Board (1) - Functional Module Division
BMS Wired Communication Solution: Changan Deepal BMS Control Board (2) - Using CAN Communication
BMS Wired Communication Solution: Changan Deepal BMS Control Board (3) - SBC Chip with Integrated CAN-FD
Wireless BMS Communication Methods: Mostly Using Low-Power Bluetooth (Dedicated 2.4GHz)
Wireless BMS Communication Methods: Infineon Bluetooth 5.4 vBMS Solution
Wireless BMS Communication Methods: ADI Dedicated 2.4GHz vBMS Solution
Wireless BMS Communication Methods: NXP Ultra-Wideband (UWB) vBMS Solution (1)
Wireless BMS Communication Methods: NXP Ultra-Wideband (UWB) vBMS Solution (2)
Schematic Diagram of Wireless BMS Power Battery Pack
Wireless BMS Communication Topology and Evolution Trend (1)
Wireless BMS Communication Topology and Evolution Trend (2)
Communication Indicators of wBMS
BMS Wired Communication VS wBMS Wireless Communication
Advantages of Wireless Battery Management System (wBMS)

2.3.2 Chassis-by-Wire System

Current Stage (2025) Chassis-by-Wire System Electrical Architecture (12V), for L2+
Parameters and Indicators of L2+ Chassis-by-Wire System Domain Controller
Future 3-5 Years (2028-2030) Chassis-by-Wire System Electrical Architecture (12+48V), for L3/L4
Chassis-by-Wire System Communication Architecture at L3-L4

5 Years Later (2030+) Chassis-by-Wire System Electrical Architecture (Dual Power 48V), for L5

Wire-controlled Technology Communication Architecture at L5
2.4 Inter-Chip Communication Scenarios
Challenges Faced by Parallel Computing and Transmission of On-Board Processors (1)
Challenges Faced by Parallel Computing and Transmission of On-Board Processors (2)
Applications of PCIe
PCIe Standard Specification: Has Evolved to PCIe 8.0
PCIe Standard Specification: Automobiles Mainly Apply PCIe 4.0 and Below Standards, and Gradually Introduce PCIe 5.0 Standard
PCIe is Suitable for Central + Zonal Architecture: In the Future EEA Architecture, the Market Demand for PCIe Switches is Increasing
PCIe is Suitable for Central + Zonal Architecture: PCIe Switches are Very Suitable for In-Vehicle Networks in the AI Era
Summary of Application Scenarios of Automotive-Grade PCIe Switches
Application Scenarios of Automotive-Grade PCIe Switches: High-Speed Intra-Chip Communication is Required in Multi-Chip on a Single Board
Application Scenarios of Automotive-Grade PCIe Switches: Zonal Architecture Evolution Brings PCIe SSD Storage Requirements (1)
Application Scenarios of Automotive-Grade PCIe Switches: Zonal Architecture Evolution Brings PCIe SSD Storage Requirements (2)
Application Scenarios of Automotive-Grade PCIe Switches
Application Cases of PCIe Switches: OEM Deployment Strategies (1)
Application Cases of PCIe Switches: OEM Deployment Strategies (2)
Application Cases of PCIe Switches (1)
Application Cases of PCIe Switches (2)
Development Process of Automotive-Grade PCIe Switches: Suppliers and Products

Chapter 3 Evolution Trends of Vehicle Communication (by Sub-Technology Type)

3.1 Summary and Comparison of In-Vehicle Communication Bus Technologies
Summary and Comparison Table of In-Vehicle Communication Bus Technologies
Automotive Ethernet Physical Layer Standards
3.2 In-Vehicle Backbone Network Communication Technology (Copper Cable)
- 3.2.1 100/1000 BASE-T1
Modern Mainstream Backbone Communication: 100 BASE-T1 and 1000 BASE-T1

100 BASE-T1 Application Case: 100Base-T1 Automotive Ethernet Interface Design of SemiDrive G9X Body Domain Controller

100 BASE-T1 Application Case: ONVO L60 Communication Architecture

1000 BASE-T1 Application Case: XPeng XEEA3.5 Vehicle Communication Architecture (1)

1000 BASE-T1 Application Case: XPeng XEEA3.5 Vehicle Communication Architecture (2)

1000 BASE-T1 Application Case: Intelligent Driving Domain Controller Design with Orin as the Core

3.2.2 2.5G Ethernet

Next-Generation Automotive Ethernet: 2.5G Ethernet Ring Network
Cost Comparison Between 2.5G Ethernet and Gigabit Network
Development Process of 2.5G Ethernet Products: Suppliers and Products
2.5G Ethernet Product Solutions (1)
2.5G Ethernet Product Solutions (2)

3.2.3 10G Ethernet

Communication Port Trend (1): The Number of In-Vehicle Ethernet Ports Will Exceed 100 in the Future
Communication Port Trend (2): Chip Vendors Layout Multi-Port Automotive Ethernet Chips
OEMs Have a Strong Demand for 10G+ Bandwidth, and Chip Manufacturers are Accelerating the Deployment of 10G+
10G Automotive Ethernet Solution: Aeonsemi Nemo Chipset

3.2.4 Market Pattern and Product List of Automotive Ethernet PHY Chips

Automotive Ethernet PHY Chips Exist as Independent Chips
Key Technical Parameters of Automotive Ethernet PHY Chips
Global Automotive Ethernet PHY Chip Market Competition Pattern: Dominated by Overseas Enterprises
List and Product Selection of Foreign Automotive Ethernet PHY Chip Suppliers (1)
List and Product Selection of Foreign Automotive Ethernet PHY Chip Suppliers (2)
List and Product Selection of Foreign Automotive Ethernet PHY Chip Suppliers (3)
Domestic Automotive Ethernet PHY Chip Market Competition Pattern: The Domestic First Echelon Has Taken Shape, and Mass Production Capacity Needs to Be Improved
List and Product Selection of Domestic Automotive Ethernet PHY Chip Suppliers (1)
List and Product Selection of Domestic Automotive Ethernet PHY Chip Suppliers (2)
Automotive Ethernet PHY Chip Products (1)
Automotive Ethernet PHY Chip Products (2)
Automotive Ethernet PHY Chip Products (3)

3.2.5 Market Pattern and Product List of Automotive Ethernet Switch Chips

Functions of Automotive Ethernet Switch Chips
Deployment Positions of Automotive Ethernet Switch Chips
Demand Analysis of Automotive Ethernet Switch Chips
Global Automotive Ethernet Switch Chip Market Competition Pattern
List and Product Selection of Foreign Automotive Ethernet Switch Chip Suppliers (1)
List and Product Selection of Foreign Automotive Ethernet Switch Chip Suppliers (2)
List and Product Selection of Foreign Automotive Ethernet Switch Chip Suppliers (3)
List and Product Selection of Foreign Automotive Ethernet Switch Chip Suppliers (4)
Domestic Automotive Ethernet Switch Chip Market Competition Pattern
List and Product Selection of Domestic Automotive Ethernet Switch Chip Suppliers (1)
List and Product Selection of Domestic Automotive Ethernet Switch Chip Suppliers (2)
List and Product Selection of Domestic Automotive Ethernet Switch Chip Suppliers (3)
Motorcomm Electronic Automotive-Grade TSN Switch Product - Yushu Series
Automotive Ethernet Switch Chip Product: Application of Realtek Gigabit Automotive Ethernet Switch Chip RTL9068
Cost and Market Analysis of Automotive Ethernet Chips
Price of Automotive Ethernet PHY Chips
Price of Automotive Ethernet Switch Chips
Application Scenarios of Automotive Ethernet
Number of Automotive Ethernet PHY and Switch Chips Equipped in Passenger Cars of Different Autonomous Driving Levels
Installations and Market Size of Ethernet PHY and Switch Chips in Chin's Passenger Cars, 2022-2030E (1)
Installations and Market Size of Ethernet PHY and Switch Chips in Chin's Passenger Cars, 2022-2030E (2)
Market Size of Automotive Ethernet Switch Chips in China's Passenger Cars, 2023-2026
3.3 In-Vehicle Backbone Network Communication Technology (Optical Communication)
Evolution of In-Vehicle Networks
Mainstream In-Vehicle Optical Communication Solutions - Fiber Ethernet and Automotive PON
Conditions for On-Board Application of In-Vehicle Optical Communication Technology

3.3.1 Fiber Ethernet

Automotive Ethernet Fiber Communication: Developing from Copper Cable to Fiber Communication
Automotive Optical Network Based on Silicon Photonics
Automotive Ethernet Fiber Communication: Transmission Medium
Automotive Ethernet Fiber Communication: Background and Advantages of Optical Communication
Advantages of Automotive Ethernet Fiber Communication (1)
Advantages of Automotive Ethernet Fiber Communication (2)
Advantages of Automotive Ethernet Fiber Communication (3)
Advantages of Automotive Ethernet Fiber Communication (4): Comparison of Technical Standards Between Optical Communication and Copper Cable Electrical Communication
Composition of Automotive Ethernet Fiber Communication
Technical Requirements for Automotive Ethernet Fiber Communication
Application Scenarios of Automotive Optical Ethernet Technology
Application Scenarios of Automotive Optical Ethernet Technology: Autonomous Driving (1)
Application Scenarios of Automotive Optical Ethernet Technology: Autonomous Driving (2)
Application Scenarios of Automotive Optical Ethernet Technology: Autonomous Driving (3)
Application Scenarios of Automotive Optical Ethernet Technology: Autonomous Driving (4)
Development Process of Automotive Fiber Ethernet Communication Products
Maturity of Automotive Optical Communication Industry Chain (1)
Maturity of Automotive Optical Communication Industry Chain (2)
AutoLink & Zhongji Innolight Released Automotive Optical Communication Module Products and Solutions
Development Process of Automotive Ethernet Fiber Communication Products: Suppliers and Products (1)
Development Process of Automotive Ethernet Fiber Communication Products: Suppliers and Products (2)
Development Process of Automotive Fiber Ethernet Communication Products (1)
Development Process of Automotive Fiber Ethernet Communication Products (2)
Automotive Fiber Ethernet Communication Solutions (1)
Automotive Fiber Ethernet Communication Solutions (2)
Automotive Fiber Ethernet Communication Solutions (7)
Development Process of Automotive Ethernet Fiber Communication Products: Summary of OEM Layouts
OEM Layouts of Automotive Fiber Ethernet Communication (1)
OEM Layouts of Automotive Fiber Ethernet Communication (2)
OEM Layouts of Automotive Fiber Ethernet Communication (3)

3.3.2 Fiber PON

Evolution and Classification of Optical PON Networks (1)
Evolution and Classification of Optical PON Networks (2)
Technical Advantages of Fiber PON Networks
Market Advantages of Fiber PON Networks
Technical Classification of Automotive Optical PON Networks: XG-PON and XGS-PON Technologies
Automotive Optical PON Network Solutions: Suppliers
Automotive Optical PON Network Solutions: Poncan Semiconductor TS-PON Technology (1)
Automotive Optical PON Network Solutions: Poncan Semiconductor TS-PON Technology (2)
Automotive Optical PON Network Solutions: Poncan Semiconductor TS-PON Technology (3)
Automotive Optical PON Network Solutions: Poncan Semiconductor TS-PON Technology (4)
Automotive Optical PON Network Solutions: SoC Chip of Poncan Semiconductor TS-PON Technology
Application Scenarios of Automotive Optical PON Networks
Industry Chain of Automotive Optical PON Equipment

3.3.3 Automotive Optical Communication Packaging Technology

Automotive Optical Communication Packaging: Relationship Between Silicon Photonics, Optical Modules and CPO
Automotive Optical Communication Packaging: Next-Generation Communication Chip Packaging Technology, CPO
Automotive Optical Communication Packaging: Next-Generation Communication Chip Packaging Technology, Technical Evolution from Pluggable, NPO to CPO
Automotive Optical Communication Packaging: Next-Generation Communication Chip Packaging Technology, SerDes + CPO Integration
3.4 In-Vehicle Low-Speed Communication Technology
- 3.4.1 10 BASE-T1S
10BASE-T1S Automotive Ethernet
Three Typical 10M Ethernet Physical Layer Configurations
Characteristic 1 of 10BASE-T1S Automotive Ethernet: Supporting Multi-Point Topology Structure, Simplifying Regional Architecture
Characteristic 2 of 10BASE-T1S Automotive Ethernet: PLCA Physical Layer Collision Prevention
Advantages of 10M Automotive Ethernet
Application Scenarios of 10BASE-T1S Automotive Ethernet
List of 10M Automotive Ethernet Chip Manufacturers and Products
10M Automotive Ethernet Product: Microchip LAN867x Series
10M Automotive Ethernet Products
10M Automotive Ethernet Application Solution: BMW Will Adopt ADI's 10BASE-T1S E2B Technology in Intelligent Cockpit Ambient Lights
10M Automotive Ethernet Application Solution: ON Semiconductor 10BASE-T1S Headlight Solution

3.4.2 CAN XL

Evolution Trend of CAN Communication
CAN XL
Technical Specifications and Standardization of CAN XL
CAN-XL OSI Protocol Framework
Typical Application Scenario of CAN XL: Millimeter-Wave Radar
Development Process of CAN-XL Industry
Development Process of CAN-XL Industry: List of Core Product Suppliers and Products of CAN XL (1)
Development Process of CAN-XL Industry: List of Core Product Suppliers and Products of CAN XL (2)
Development Process of CAN-XL Industry: List of Core Product Suppliers and Products of CAN XL (3)
Development Process of CAN-XL Industry: List of Core Product Suppliers and Products of CAN XL (4)
Development Process of CAN-XL Industry: List of Core Product Suppliers and Products of CAN XL (5)
CAN-XL Products (1)
CAN-XL Products (2)
CAN-XL Products (3)
CAN-XL Products (4)
CAN-XL Competitors: Competition Between CAN-XL and FlexRay, 10BASE-T1S Ethernet

3.4.3 CAN FD

CAN Bus Communication: Low-Speed CAN and High-Speed CAN
CAN-FD Communication Bus: Classic CAN-FD
Extended Versions of CAN-FD: CAN FD Light
Extended Versions of CAN-FD: CAN FD SIC
CAN-FD Application Solutions (1)
CAN-FD Application Solutions (2)
CAN-FD Application Solutions (3)
Future Application Trends of Existing CAN Communication Technologies
List and Product Selection of CAN FD Chip Suppliers (1)
List and Product Selection of CAN FD Chip Suppliers (2)

3.4.4 CAN/LIN/FlexRay

Application Scenarios of CAN Transceivers in Automobiles
LIN Bus
Application Scenarios of LIN in Automobiles
Domestic Market Competition Pattern of CAN/LIN Interface Chips: Previously Monopolized by Foreign Manufacturers, Domestic Substitution Trend is Gradually Emerging
Development of Domestic CAN Transceiver Chips
List and Product Selection of CAN/LIN Chip Suppliers (1)
List and Product Selection of CAN/LIN Chip Suppliers (2)
List and Product Selection of CAN/LIN Chip Suppliers (3)
List and Product Selection of CAN/LIN Chip Suppliers (4)
Application Solutions of CAN Transceivers
FlexRay
FlexRay Application Case: Chassis Dynamic Control of Audi A8
3.5 High-Speed Video Transmission Technology
- 3.5.1 Core Technologies of Automotive SerDes
Automotive High-Speed Video Transmission Technology: Application Scenarios of SerDes
Automotive High-Speed Video Transmission Technology: Working Principle of SerDes (1)
Automotive High-Speed Video Transmission Technology: Working Principle of SerDes (2)
Technical Challenges of Automotive SerDes (1): CDR Clock Data Recovery
Technical Challenges of Automotive SerDes (2): Signal Difference with High-Frequency Attenuation
Technical Challenges of Automotive SerDes (3): PAM4 Encoding Technology
Technical Challenges of Automotive SerDes (4): High-Speed ADC Chips (1)
Technical Challenges of Automotive SerDes (4): High-Speed ADC Chips (2)
Technical Challenges of Automotive SerDes (5): High-Speed ADC Chips (3)
Technical Challenges of Automotive SerDes (6): High-Speed ADC Chips (4)
Technical Challenges of Automotive SerDes (7): Production Process

3.5.2 Automotive SerDes Standards and Protocols

SerDes Standards and Protocols: Summary of Proprietary Protocols (1)
SerDes Standards and Protocols: Summary of Proprietary Protocols (2)
SerDes Standards and Protocols: Proprietary Protocol: GMSL Moving Towards Publicity - Establishment of OpenGMSL Association
SerDes Standards and Protocols: Proprietary Protocol: GMSL Moving Towards Publicity - Evolution of GMSL/LVDS to Automotive Ethernet (1)
SerDes Standards and Protocols: Proprietary Protocol: GMSL Moving Towards Publicity - Evolution of GMSL/LVDS to Automotive Ethernet (2)
SerDes Standards and Protocols: Summary of Public Protocols (1)
SerDes Standards and P