Automotive-Grade Power Semiconductor and Module (SiC, GaN) Industry Research Report,2025

Description

SiC/GaN Research: Sales volume of 800V+ architecture-based vehicles will increase more than 10 times, and hybrid carbon (SiC+IGBT) power modules are rapidly being deployed in vehicles.

Sales volume of 800V+ architecture-based vehicles will increase more than 10 times, driving the installation of SiC/GaN power chips in vehicles.

The third-generation semiconductors, such as those made from wide-bandgap materials like silicon carbide (SiC) and gallium nitride (GaN), are better suited for manufacturing high-temperature, high-frequency, radiation-resistant, and high-power devices due to their wider bandgap, higher breakdown electric field, higher thermal conductivity, greater electron saturation velocity, and higher radiation resistance. They are the primary choice for upgrading the performance of power semiconductors in the new energy vehicle sector.

SiC power devices possess feature high voltage resistance, low loss, and high frequency, catering to high-temperature, high-voltage and high-power applications. They are widely used in key components such as main drive inverters, on-board chargers (OBCs), and DC/DC converters. They are also the best partners for high-voltage architectures. As 800V high-voltage platforms become the mainstream and costs continue to decline, SiC will expand from main drive inverters to fields such as automotive compressors and active suspensions.

GaN power devices have advantages such as high switching frequency, high temperature resistance, and low loss, and can be used to make power, radio frequency, and optoelectronic devices. Because GaN has a higher electron mobility than SiC, GaN can achieve a higher switching frequency. However, its power range is not particularly wide, and its drain-source on-resistance is greatly affected by temperature, thus it has performance disadvantages in high-current and high-temperature scenarios. Currently, GaN has made progress in the automotive field covering OBCs and DC-DC converters.

According to ResearchInChina's database, there were only 13 800-1000V high-voltage architecture passenger car models on sale in China in 2022. In 2024, the number exceeded 47. By the first half of 2025, the number had reached 70. China's 800V high-voltage architecture passenger cars on sale extend from luxury brands such as Porsche and Mercedes-Benz to mid-range brands such as NIO, Xpeng, and Zeekr, and then to models priced at RMB150,000-200,000 such as those from BYD and Leapmotor.

In 2024, 739,000 passenger cars based on 800-1000V high-voltage architectures were sold in China, accounting for 6.9% of the total sales of new energy passenger cars in the country. It is projected that by 2025, the penetration rate of such passenger cars will reach 10.9%, with the sales volume reaching 1.495 million units. By 2030, the penetration rate will exceed 35%, with shipments exceeding 7.45 million units, more than 10 times the sales volume in 2024.

In the future, more all-SiC BEVs will emerge, involving 800V high-voltage architectures. Under such architectures, key components including air conditioning compressors (3-10kW), battery packs, inverters (5-600kW), DC charging piles, DC/DC converters (1-5kW), and OBCs (3-30kW) will all use SiC devices. Driven by technology, the demand for SiC/GaN power chips (automotive grade, charging equipment, etc.) for passenger cars in China hit 73 million units in 2024, and is expected to reach 146 million units in 2025, representing a year-on-year spike of 98.6%. By 2030, the demand will be 608 million units, and the industry will enter a rapid development stage

While 800V high-voltage platforms are being installed on a large scale in vehicles, BYD is gradually upgrading its vehicles to 1000V platforms, and raising the withstand voltage of automotive SiC power devices to 1500V-1700V accordingly.

BYD has taken the lead in releasing its next-generation automotive-grade 1500V high-power SiC power chip. Equipped with the Super e-Platform, it secures an electronic control efficiency of 99.7% and a cost reduction of 40% compared to imports.

Utilizing stacked laser welding technology and optimizing the chip interconnect structure, it has successfully reduced the stray inductance by 75% and dynamic loss by 30% compared to traditional packaging;

The peak current can reach 1000A, with overcurrent capacity enhanced by 10%;

The charging power can be up to 1000kW, nearly 70% higher than the industry's mainstream 600kW fast charging technology;

The nano-silver sintering technology reduces the thermal resistance of the bonding layer by 95%, improves reliability and extends lifespan by more than 5 times.

By combining Cuclipbonding technology with silicon nitride AMB substrates, the chip size is reduced by 50% and the power density is doubled.

This is the industry's first mass-produced automotive-grade SiC power chip with the highest voltage level, first seen in the Han L EV, Tang L EV, Yangwang U7 and Denza N9.

Dongfeng eπ plans to adopt a 1700V SiC power module on its next-generation ultra-1000V platform. This module was officially launched in June 2025, with a 60% reduction in switching loss. The second-generation SiC chip technology optimizes the gate drive design (supporting +15~+18V drive voltage) and low parasitic inductance packaging (<=10nH), slashing Eon/Eoff loss. Compared to traditional IGBTs, the system efficiency jumps from 96% to 99%, which can extend the vehicle's range by more than 3%.

SiC power devices continue to introduce new packaging technologies to improve efficiency, and hybrid carbon (SiC+IGBT) power modules are rapidly being deployed in vehicles.

SiC power devices continue to introduce new technologies to improve efficiency, such as embedded packaging technology and three-voltage-level topology. Many OEMs and Tier 1 suppliers have launched corresponding solutions.

Embedded packaging technology: High-voltage power chips (such as SiC and GaN chips) are directly embedded in the PCB, replacing traditional discrete power modules, which can significantly improve the high-density integration and performance of electric drive controllers. For the same outflow requirements, the amount of semiconductors used can be reduced by 20%-30% compared to frame-packaged modules. In the WLTC cycle, compared with the 800V SiC frame package, the 800V SiC embedded package reduces energy loss by about 60%, and cuts down switching loss and conduction loss. Moreover, under the same temperature conditions, the lifespan of embedded power modules is several times that of frame-packaged modules.

Three-voltage-level topology: A three-voltage-level inverter circuit can output high and low voltage levels by turning on the upper and lower transistors, and output zero level by clamping the middle diode. Compared to the two-voltage-level solution, the three-voltage-level solution has better waveform quality and less noise; switching loss are reduced by about 75%, device heat generation is less, and lifespan is longer; ripple current is lower, reducing equipment vibration and heat generation, resulting in more stable operation; filter design is more flexible, inductor and capacitor values can be reduced, and size and weight are reduced by 30%-50%; and dynamic response is faster.

GAC Group's new ADiMOTION adopts GAC Quark Electric Drive 2.0. Equipped with an embedded power module, the size reduces by 80% and the maximum electronic control efficiency hits 99.9%. Under a 1000V high-voltage platform, the drive motor power density reaches 17.29kW/kg, and the CLTC operating efficiency of the electric drive system is as high as 93%.

The Chip Inlay Power Board (CIPB), developed by ZF's Asia Pacific R&D team, achieves ultimate inverter performance by embedding power chips into the PCB, reducing stray inductance, increasing volumetric power density, and thus gaining the ultimate inverter performance. At the same time, this technology enables compact and lightweight designs that are compatible with market-standard wafers or dies and allow for free adjustment of semiconductor type, chip quantity, and size.

Geely's latest E-DHT 11-in-1 hybrid system is the first to adopt a hybrid carbon electronic control system, which combines IGBTs and SiC TPAK discrete devices. IGBTs excel at stable output in low-to-medium frequency scenarios, while SiC is more efficient in high-voltage, high-frequency environments. The synergy between the two can enable the power control module to achieve an efficiency of over 99%.

Among them, the hybrid carbon module adopts three-voltage-level SiC high-efficiency technology and has two packaging forms: plastic-encapsulated module and SiC TPAK discrete device. Meanwhile, the SiC stepless boost module can maintain stable system voltage even when the battery level is below 20% through global voltage optimization.

Hybrid carbon (SiC+IGBT) power modules help balance performance and cost and are rapidly being mass-produced and deployed in vehicles. SiC and Si-based power electronics can be used in combination at different levels to achieve a balance between performance and cost.

In inverters built with discrete components, SiC and Si devices can be flexibly mixed and connected in parallel, and SiC and Si can even be mixed at the module level or the device level (bare die).

In a BEV equipped with multiple motors, the main motor inverter can leverage SiC, while the auxiliary motor can use Si. For two-phase or open-winding motors, both power modules can be SiC, Si, or a combination of both.

XPeng's next-generation hybrid SiC coaxial electric drive technology balances cost and performance by optimizing the hybrid application of SiC and silicon-based devices, and has been applied to vehicle models such as the new G9.

The electric drive system boasts a CLTC efficiency of up to 93.5%.

While reducing the amount of SiC chips by 60%, the output power is raised by 10%;

With a coaxial motor layout and compact design, the electric drive system is 30% smaller and 7.5% lighter.

This electric drive technology is based on a global 800V SiC platform and can work in conjunction with 5C superchargeable AI batteries.

GaN devices are entering the automotive OBC field, and may continue to grow in the future.

So far, OEMs including Tesla, Changan Automobile, Mazda, and Geely VREMT, as well as Tier 1 suppliers such as Inovance, UAES and Sungrow, have taken the lead in adopting GaN solutions in the OBC field. From the perspective of GaN suppliers, Innoscience, Infineon, and Navitas are launching automotive electronics.

Inovance's next-generation 6.6kW GaN automotive 2-in-1 power supply integrates an OBC and a DC-DC converter. It uses GaN power devices to achieve an industry-leading charging efficiency of 96% and a total power density of 4.8kW/L. Compared to traditional Si/SiC solutions, the power density is increased by 30% to 4.8kW/L, the average efficiency of the OBC at full load exceeds 96%, and the operating efficiency of the DC/DC converter is as high as 97.09%@700W. Compared to traditional Si/SiC solutions, the weight is reduced by 20%.

This product is suitable for vehicles with battery voltage ranges from 200V to 500V. It has optimized both the power circuit and the high-frequency high-power PCB wiring technology to reduce interference and loss caused by high-speed switching. The magnetic components of cascaded/parallel converters are integrated into a single design, systematically optimizing size and loss. For heat dissipation, a water channel structure with an integrated profile design increases the heat dissipation area, and reduces thermal resistance, size and weight.

In addition to OBCs, GaN chips, with their narrow pulse, high peak current, and high efficiency, can achieve longer detection distances and reduce power loss and temperature rise, better catering to automotive LiDAR systems. Furthermore, the application of GaN in DC-DC converters is expanding. GaN devices are gradually penetrating the new energy vehicle field, and their potential growth should not be ignored.

Product Code: CL009

Chapter 1 Overview of Power Semiconductors

1.1 Definition and Classification
Definition
Classification
Materials
Materials: SiC
Materials: GaN (1)
Materials: GaN (2)
Materials: GaN (3)
Materials: GaN VS SiC (1)
Materials: GaN VS SiC (2)
Materials: The Third-Generation Semiconductor Materials Will Exist for a Long Time
1.2 Automotive Application Scenarios
Automotive Application
Automotive Application: SiC/GaN power devices are mainly used in "electric drive, battery, electric control" systems
Automotive Application: Development process of GaN power devices in the automotive field (1)
Automotive Application: Development process of GaN power devices in the automotive field (2)
Automotive Application: Development process of GaN power devices in the automotive field (3)
Automotive Application: Potential application fields of GaN power devices
1.3 Third-Generation Semiconductors: Automotive-Grade SiC Power Device Industry and Market
Automotive-Grade SiC Power Devices: The Best Partner for High-Voltage Architectures
Automotive-Grade SiC Power Devices: Advantages of 800-1000V SiC Technology
Automotive-Grade SiC Power Devices: SiC Industry Chain
Automotive-Grade SiC Power Devices: SiC Supply Chain
Automotive-Grade SiC Power Devices: SiC Supply Chain - SiC Substrates and Epitaxial Technology
Automotive-Grade SiC Power Devices: SiC Supply Chain - SiC Substrate Development Trends
Automotive-Grade SiC Power Devices: SiC Supply Chain - SiC Substrate Price
Automotive-Grade SiC Power Devices: SiC Supply Chain - Mainstream SiC Substrate Vendors
Automotive-Grade SiC Power Devices: SiC Supply Chain - Epitaxial Cost and Price
Automotive-Grade SiC Power Devices: SiC Supply Chain - Epitaxial Capacity Layout
Automotive-Grade SiC Power Devices: SiC Supply Chain - Packaging Technology (1)
Automotive-Grade SiC Power Devices: SiC Supply Chain - Packaging Technology (2)
Automotive-Grade SiC Power Devices: SiC Supply Chain - Packaging Technology (3)
Automotive-Grade SiC Power Devices: SiC Supply Chain - Packaging Technology (4)
Automotive-Grade SiC Power Devices: 800-1000V Power Device Packaging Cases
Automotive-Grade SiC Power Devices: Global Supplier Competitive Landscape
Automotive-Grade SiC Power Devices: Global SiC Power Device Industry Landscape
Automotive-Grade SiC Power Devices: Conductive SiC Power Devices Used in New Energy Vehicles
Automotive-Grade SiC Power Devices: SiC Application Solutions in Vehicle Models with 800-1000V Architectures
Automotive-Grade SiC Power Devices: List of Vehicle Models with SiC Power Devices and 800-1000V Architectures
Automotive-Grade SiC Power Devices: Development Trends of SiC in New Energy Passenger Cars with 800-1000V Architectures
Automotive-Grade SiC Power Devices: List of Vehicle Models Equipped with SiC Power Devices and 1200-1500V Architectures
Automotive-Grade SiC Power Devices: Competitive Landscape of SiC Power Devices for New Energy Passenger Cars
Automotive-Grade SiC Power Devices: 650-1500V SiC Power Chips
Automotive-Grade SiC Power Devices: 650-1500V SiC Power Modules
Automotive-Grade SiC Power Devices: Technological Trends, 2025-2030E
Global SiC Power Device Market Size, 2020-2030E
Core Application Scenarios of SiC Power Devices in Chinese Passenger Cars
China's Automotive-Grade Passenger Car SiC Chip Market Size, 2022-2030E
1.4 Third-Generation Semiconductors: Automotive-Grade GaN Power Device Industry and Market
Automotive-Grade GaN Power Devices: 800-1000V High-Voltage Architecture Application
Automotive-Grade GaN Power Devices: GaN Supply Chain - Differences Between SiC and GaN Process Technologies
Automotive-Grade GaN Power Devices: GaN Supply Chain - GaN Epitaxial Substrate Materials
Automotive-Grade GaN Power Devices: GaN Supply Chain - New Diamond-Based GaN Epitaxial Substrate Materials (1)
Automotive-Grade GaN Power Devices: GaN Supply Chain - New Diamond-Based GaN Epitaxial Substrate Materials (2)
Automotive-Grade GaN Power Devices: GaN Supply Chain - New Diamond-Based GaN Epitaxial Substrate Materials (3)
Automotive-Grade GaN Power Devices: GaN Supply Chain - Mainstream GaN Packaging Technologies - Discrete Devices (1)
Automotive-Grade GaN Power Devices: GaN Supply Chain - Mainstream GaN Packaging Technologies - Discrete Devices (2)
Automotive-Grade GaN Power Devices: GaN Supply Chain - Mainstream GaN Packaging Technologies - Composite Devices (1)
Automotive-Grade GaN Power Devices: GaN Supply Chain - Mainstream GaN Packaging Technologies - Composite Devices (2)
Automotive-Grade GaN Power Devices: GaN Supply Chain - Comparison of Mainstream GaN Packaging Technologies
Automotive-Grade GaN Power Devices: GaN Supply Chain - Advanced GaN Packaging Technologies (1): Electrical Performance Optimization
Automotive-Grade GaN Power Devices: GaN Supply Chain - Advanced GaN Packaging Technologies (2): Innovative Thermal Management Structures
Automotive-Grade GaN Power Devices: GaN Supply Chain - Advanced GaN Packaging Technologies (3): Integrated Packaging
Automotive-Grade GaN Power Devices: GaN Supply Chain - Advanced GaN Packaging Technologies (2): Stress Optimization Design
Automotive-Grade GaN Power Devices: GaN Supply Chain - Device Cost Comparison
Automotive-Grade GaN Power Devices: Major Suppliers and Technical Routes (1)
Automotive-Grade GaN Power Devices: Major Suppliers and Technical Routes (2)
Automotive-Grade GaN Power Devices: Major Suppliers and Technical Routes (3)
Automotive-Grade GaN Power Devices: Major Suppliers and Technical Routes (4)
Automotive-Grade GaN Power Devices:Product Cases (1)
Automotive-Grade GaN Power Devices:Product Cases (2)
Automotive-Grade GaN Power Device Price (1)
Automotive-Grade GaN Power Device Price (2)
Global GaN Power Device Market Size, 2020-2030E
Core Application Scenarios of GaN Power Devices in Chinese Passenger Cars
China's Passenger Car GaN Power Device Market Size, 2025-2030E
1.5 Automotive-Grade Power Semiconductor Certification Standards
Automotive-Grade Power Semiconductor Standards
Automotive-Grade Power Semiconductor Standards: AEC-Q
Automotive-Grade Power Semiconductor Standards: AEC-Q101 (Discrete Devices)
Automotive-Grade Power Semiconductor Standards: AQG 324 (Power Modules) (1)
Automotive-Grade Power Semiconductor Standards: AQG 324 (Power Modules) (2)
Automotive-Grade Power Semiconductor Standards: AQG 324 (Power Modules) (3)
Automotive-Grade Power Semiconductor Standards: IATF 16949 (Quality Management System Certification System)
Automotive-Grade Power Semiconductor Standards: ISO 26262 (Functional Safety) (1)
Automotive-Grade Power Semiconductor Standards: ISO 26262 (Functional Safety) (2)

Chapter 2 Automotive-Grade Power Semiconductor Application Scenarios and Market

2.1 Application Scenarios: Main Drive Inverters
Main Drive Inverters
Main Drive Inverters: SiC Power Modules Are Applied to 800V and Higher-Voltage Platforms (1)
Main Drive Inverters: SiC Power Modules Are Applied to 800V and Higher-Voltage Platforms (2)
Main Drive Inverters: Technological and Cost Differences
800V Motor Controllers - Products and Technologies of Core Suppliers
Development Trends of Main Drive Inverters: GaN Devices (1)
Development Trends of Main Drive Inverters: GaN Devices (2)
Technological Innovations in Main Drive Inverters: Hyundai's 2-Stage Motor System Design (1)
Technological Innovations in Main Drive Inverters: Hyundai's 2-Stage Motor System Design (2)
Passenger Cars with 800-1000V High-Voltage Architectures on Sale in China as of Q2 2025 (1)
Passenger Cars with 800-1000V High-Voltage Architectures on Sale in China as of Q2 2025 (2)
Passenger Cars with 800-1000V High-Voltage Architectures on Sale in China as of Q2 2025 (3)
Competitive Landscape of Passenger Cars with 800-1000V High-Voltage Architectures on Sale in China
Sales Volume and Penetration Rate of Passenger Cars with 800-1000V High-Voltage Architectures in China, 2022-2030E
Baseline Assumptions for Forecast of Main Drive SiC Chip Market Size for Passenger Cars with 800-1000V High-Voltage Architectures in China
Table: Main Drive SiC Chip Market Size for Passenger Cars with 800-1000V High-Voltage Architectures in China, 2022-2030E
2.2 Application Scenarios: OBCs
OBCs
OBCs: Power Evolution
OBCs: Power architecture
OBCs: 400V Voltage Platforms (1)
OBCs: 400V Voltage Platforms (2)
OBCs: 800V Voltage Platforms (1)
OBC Development Trends (1): Bidirectional OBCs
OBC Development Trends (2): GaN (1)
OBC Development Trends (2): GaN (2)
OBC Development Trends (2): GaN (3) - GaN OBCs
OBC Development Trends (2): GaN (4) - Bidirectional GaN Power Devices
OBC Development Trends (2): GaN (5) - Bidirectional GaN Power Devices
Baseline Assumptions for Forecast of China's New Energy Passenger Car OBC SiC Chip Market Size
Table: China's New Energy Passenger Car OBC SiC Chip Market Size, 2020-2030E
2.3 Application Scenarios: High-Voltage DC Converters
High-Voltage DC Converters
High-Voltage DC Converters: onsemi's SiC Product Application Design
High-Voltage DC Converters: STMicroelectronics' SiC Product Application Design
High-Voltage DC Converter Development Trends: GaN Devices
China's New Energy Passenger Car High-Voltage DC/DC SiC/GaN Market Size, 2022-2030E
Tabl: China's New Energy Passenger Car High-Voltage DC/DC SiC/GaN Market Size, 2022-2030E
2.4 Application Scenarios: Electric Compressors
Electric Compressors (1)
Electric Compressors (2)
Electric Compressor Solutions (1)
Electric Compressor Solutions (2)
China's New Energy Passenger Car Electric Compressor SiC Market Size, 2022-2030E
Table: China's New Energy Passenger Car Electric Compressor SiC Market Size, 2022-2030E
2.5 Application Scenarios: DC Chargers
Comparison of Different Voltage System Topologies and MOSFETs for DC Chargers
DC Charger Development Trends: Evolution of Modules and Power Devices
DC Charger Development Trends: Accelerated Construction of Megawatt-Level Fast Charging Networks
DC Charger Development Trends: National Energy Administration's Three-Year Charging Pile Growth Action Plan
DC Charger Development Trends: GB 46519-2025 "Minimum Allowable Values of Energy Efficiency and Energy Efficiency Grades for Electric Vehicle Power Supply Equipment"
DC Charger Development Trends: Vendors Accelerate Procurement Bidding for SiC Devices
DC Charger Development Trends: Some Application Cases of SiC in DC Chargers
Baseline Assumptions for Forecast of China's SiC DC Charger Market Size
Table: China's SiC DC Charger Market Size, 2022-2030E
2.6 Automotive-Grade Passenger Car SiC/GaN Chip Market Size in China
China's Automotive-Grade Passenger Car SiC Chip Market Size, 2022-2030E
China's Automotive-Grade Passenger Car GaN Chip Market Size, 2022-2030E

Chapter 3 Development Trends and Supply Chain Capacity Distribution of Automotive-Grade Power Devices

3.1 Development Trends (1): Embedded Packaging Technology
Embedded Packaging Technology (1)
Embedded Packaging Technology (2)
Embedded Packaging Technology (3)
Embedded SiC Packaging Solutions: GAC Quark Electric Drive 2.0
Embedded SiC Packaging Solutions: Shanghai Chengzhi's SiC Embedded Power Module
Embedded SiC Packaging Solutions: Xinhuarui Semiconductor's Embedded SiC Packaging
Embedded SiC Packaging Solutions: ZF's CIPB
Embedded SiC Packaging Solutions: Infineon's Embedded Packaging
Embedded SiC Packaging Solutions: UAES' Embedded Inverter Brick
Embedded GaN Packaging Solutions: Horse Powertrain's Independent Power GaN Embedded Packaging Module Design (1)
Embedded GaN Packaging Solutions: Horse Powertrain's Independent Power GaN Embedded Packaging Module Design (2)
Embedded GaN Packaging Solutions: Horse Powertrain's Independent Power GaN Embedded Packaging Module Design (7)
3.2 Development Trends (2): Three-Voltage-Level SiC Modules
Three-Voltage-Level Inverter Technology (1)
Three-Voltage-Level Inverter Technology (6)
Three-Voltage-Level SiC Module Solutions: Three-Voltage-Level 1200V SiC Modules
Three-Voltage-Level SiC Module Solutions: Three-Voltage-Level Inverter Technology of OEMs
Three-Voltage-Level SiC Module Solutions: UAES' T-type Three-Voltage-Level Motor Controllers
3.3 Development Trends (3): Si/SiC Hybrid Power Modules
Si/SiC Hybrid Power Modules (1)
Si/SiC Hybrid Power Modules (5)
Si/SiC Hybrid Power Module Solutions
Si/SiC Hybrid Power Module Solutions: XPeng's Hybrid SiC Coaxial Electric Drive Technology
Si/SiC Hybrid Power Module Solutions: Geely's SiC Hybrid Drive Integration Technology
Si/SiC Hybrid Power Module Solutions: InfiMotion's All-in-One Electric Drive
Si/SiC Hybrid Power Module Solutions: ZF's CIPB
Si/SiC Hybrid Power Module Solutions: Inovance's PD4H Hybrid Carbon Electronic Control
3.4 Production Capacity Layout of Domestic and Foreign Automotive-Grade Power Semiconductor Vendors
Production Capacity Layout of Domestic and Foreign Automotive-Grade Power Semiconductor Vendors (1)
Production Capacity Layout of Domestic and Foreign Automotive-Grade Power Semiconductor Vendors (2)
Production Capacity Layout of Domestic and Foreign Automotive-Grade Power Semiconductor Vendors (8)
Production Capacity Layout of Domestic and Foreign Automotive-Grade Power Semiconductor Vendors (9)
3.5 Production Capacity Layout of Domestic and Foreign Third-Generation Power Semiconductor Material Vendors
Production Capacity Layout of Domestic and Foreign Third-Generation Power Semiconductor Material Vendors (1)
Production Capacity Layout of Domestic and Foreign Third-Generation Power Semiconductor Material Vendors (5)
3.6 Revenue of Domestic and Foreign Third-Generation Semiconductor Power Device Vendors
Revenue, Gross Profit and Business of Domestic and Foreign Third-Generation Semiconductor Power Device Vendors (1)
Revenue, Gross Profit and Business of Domestic and Foreign Third-Generation Semiconductor Power Device Vendors (2)
Revenue, Gross Profit and Business of Domestic and Foreign Third-Generation Semiconductor Power Device Vendors (3)
Revenue, Gross Profit and Business of Domestic and Foreign Third-Generation Semiconductor Power Device Vendors (4)

Chapter 4 Power Semiconductor and Module Layout Strategies of OEMs

4.1 Layout Strategies
Investing in/Joint Venture/Self-built Power Semiconductor Companies (1)
Investing in/Joint Venture/Self-built Power Semiconductor Companies (2)
4.2 BYD
Power Semiconductor Layout
Power Semiconductor Layout: Capacity Distribution
Evolution of Power Semiconductor Application (1)
Evolution of Power Semiconductor Application (2)
Sales Proportion of 800V Vehicle Models (1)
Sales Proportion of 800V Vehicle Models (2)
1500V SiC: Next-Generation High-Voltage SiC Power Chips (1)
1500V SiC: Next-Generation High-Voltage SiC Power Chips (2)
1500V SiC: Next-Generation High-Voltage SiC Power Chips (3)
1500V SiC Application: Super e-Platform
1500V SiC Application: 12-in-1 Electric Drive Assembly (1)
1500V SiC Application: 12-in-1 Electric Drive Assembly (2)
1200V SiC Application: 8-in-1 Electric Drive Assembly (1)
1200V SiC Application: 8-in-1 Electric Drive Assembly (2)
1200V SiC Application: 8-in-1 Electric Drive Assembly (3)
GaN Application: Lingyuan Intelligent UAV System Uses GaN
4.3 Li Auto
Power Semiconductor Layout
Power Semiconductor Layout: SiC Electric Drive Technology System and Capacity Distribution
Evolution of Power Semiconductor Application
Sales Proportion of 800V Vehicle Models
800V SiC: Self-developed High-voltage SiC Power Modules (1)
800V SiC: Self-developed High-voltage SiC Power Modules (2)
800V SiC Application: Huixiang 5-in-1 Electric Drive Assembly
4.4 XPeng
Power Semiconductor Layout
Evolution of Power Semiconductor Application
Sales Proportion of 800V Vehicle Models
800V SiC: Hybrid Carbon Modules
800V SiC Application: Next-Generation Hybrid Carbon Coaxial Electric Drive (1)
800V SiC Application: Next-Generation Hybrid Carbon Coaxial Electric Drive (2)
800V SiC Application: Next-Generation Hybrid Carbon Coaxial Electric Drive (3)
800V SiC: Plastic-Encapsulated SiC Modules (1)
800V SiC: Plastic-Encapsulated SiC Modules (2)
800V SiC Application: Electric Drive Based on SEPA 2.0
800V SiC Application: 800V Electric Drive Systems (1)
800V SiC Application: 800V Electric Drive Systems (2)
4.5 NIO
Power Semiconductor Layout
Evolution of Power Semiconductor Application
Sales Proportion of 800V Vehicle Models
1200V SiC Application: The Latest Electric Drive System
1200V SiC Application: 900V High-Performance Electric Drive Systems (1)
1200V SiC Application: 900V High-Performance Electric Drive Systems (2)
1200V SiC Application: 900V High-Performance Electric Drive Systems (3)
800V SiC Application: Second-Generation Electric Drive Systems (1)
800V SiC Application: Second-Generation Electric Drive Systems (2)
800V SiC Application: Second-Generation Electric Drive Systems (3)
4.6 Leapmotor
Power Semiconductor Layout
Power Semiconductor Layout: Capacity Distribution
Evolution of Power Semiconductor Application
Sales Proportion of 800V Vehicle Models
800V SiC Application: 4-in-1 Range Extender Drive Systems
800V SiC Application: Electric Drive Systems (1)
800V SiC Application: Electric Drive Systems (2)
4.7 Xiaomi Auto
Power Semiconductor Layout
Power Semiconductor Layout: Supply Chain (1)
Power Semiconductor Layout: Supply Chain (2)
Evolution of Power Semiconductor Application
Sales Proportion of 800V Vehicle Models
800V SiC Application: V6s Plus Super Motors
800V SiC Application: 800V SiC Electric Drive Systems
400V/800V SiC Application: V6/V6s Motors
4.8 Geely
Power Semiconductor Layout
Evolution of Power Semiconductor Application (1)
Evolution of Power Semiconductor Application (2)
Evolution of Power Semiconductor Application (3)
Sales Proportion of 800V Vehicle Models (1)
Sales Proportion of 800V Vehicle Models (2)
800V SiC: Hybrid Carbon Modules
800V SiC Application: E-DHT 11-in-1 Hybrid Systems
800V SiC Application: 800V High-Voltage Platforms
GaN Application: Gemini Range Extenders
GaN Application: GaN Range Extended Power Generation Systems
4.9 SAIC IM
Power Semiconductor Layout
Evolution of Power Semiconductor Application
Sales Proportion of 800V Vehicle Models
800V SiC Application: Quasi-900V Dual SiC Platforms
800V SiC Application: Next-Generation Hurricane Motor
800V SiC Application: Hurricane Motor
4.10 GAC Group
Power Semiconductor Layout
Evolution of Power Semiconductor Application
Sales Proportion of 800V Vehicle Models
800V SiC Application: Quark Electric Drive 2.0 (1)
800V SiC Application: Quark Electric Drive 2.0 (2)
800V SiC Application: Quark Electric Drive 1.0 (1)
800V SiC Application: Quark Electric Drive 1.0 (2)
800V SiC Application: Quark Electric Drive 1.0 (3)
GaN Deployment: GaN Power Chip Projects
4.11 FAW Hongqi
Automotive Power Semiconductor Layout (1)
Automotive Power Semiconductor Layout (2)
Evolution of Power Semiconductor Application
800V SiC Application: Tiangong Battery-Electric Platform
1700V SiC: 1700V Ultra-High-Voltage SiC Power Devices
800V SiC: 750V SiC Power Chips
800V SiC Application: M220-220 Electric Drive Systems
4.12 Chery
Power Semiconductor Layout
Evolution of Power Semiconductor Application (1)
Evolution of Power Semiconductor Application (2)
Sales Proportion of 800V Vehicle Models
800V SiC Application: Underwater Thruster
800V SiC Application: Kunpeng Hybrid System (1)
800V SiC Application: Kunpeng Hybrid System (2)
1200V SiC Application: Fourth-Generation Hybrid Transmission
800V SiC Application: 800V Electric Drive Platforms
4.13 Great Wall Motor
Power Semiconductor Layout
Evolution of Power Semiconductor Application (1)
Evolution of Power Semiconductor Application (2)
Sales Proportion of 800V Vehicle Models
1200V SiC Application: Hi4 Electric Hybrid System (1)
1200V SiC Application: Hi4 Electric Hybrid System (2)
1200V SiC Application: Hi4 Electric Hybrid System (3) - Hi4-Z Drive Platform
800V SiC Application: X-in-1 Electric Drive System
4.14 Changan Automobile
Power Semiconductor Layout
Evolution of Power Semiconductor Application
800V SiC Application: Super Range Extender 2.0
800V SiC Application: 7-in-1 Electric Drive Assembly
GaN Application: GaN OBCs
4.15 Dongfeng Motor
Power Semiconductor Layout
Evolution of Power Semiconductor Application
Evolution of Power Semiconductor Application: Electric Drive
High-Voltage SiC Application: Mach Power (1)
High-Voltage SiC Application: Mach Power (2) - iD4
High-Voltage SiC Application: Mach Power (3) - iD5
High-Voltage SiC Application: Mach Power (4) - Off-Road Powertrain
1700V SiC: 1700V SiC MOSFETs
800V SiC: SiC Modules
800V SiC Application: 10-in-1 Ultra-High-Speed Electric Drive Systems
800V SiC Application: Lanhai Intelligent Hybrid Technology
4.16 Harmony Intelligent Mobility Alliance (HIMA)
Power Semiconductor Layout
Evolution of Power Semiconductor Application
Sales Proportion of 800V Vehicle Models
800V SiC Application: Huawei Drive ONE Golden Range Extender Power Platform
800V SiC Application: Second-Generation Huawei DriveONE 800V High-Voltage Power Platform
800V SiC Application: Huawei DriveONE Hyperconverged Gold Power Platform
800V SiC Application: First-Generation Huawei DriveONE 800V High-Voltage Power Platform
4.17 BAIC
Power Semiconductor Layout
Evolution of Power Semiconductor Application
Sales Proportion of 800V Models (including ARCFOX)
Evolution of Power Semiconductor Application: Powertrain Products
Evolution of Power Semiconductor Application: Powertrain Planning (1)
Evolution of Power Semiconductor Application: Powertrain Planning (2)
800V SiC Application: a-power
4.18 Tesla
Power Semiconductor Layout
Evolution of Power Semiconductor Application
SiC Application: Energy Storage Systems
SiC Application: Inverters
4.19 Volkswagen
Power Semiconductor Layout
Evolution of Power Semiconductor Application
SiC Application: Automotive Energy Storage Systems
SiC Application: 800V High-Voltage Platforms
4.20 BMW
Power Semiconductor Layout
Evolution of Power Semiconductor Application
SiC Application: Sixth-Generation BMW eDrive Technology
SiC Application: Sixth-Generation BMW eDrive Technology - Electric Drive Systems (1)
SiC Application: Sixth-Generation BMW eDrive Technology - Electric Drive Systems (2)
SiC Application: Sixth-Generation BMW eDrive Technology - Electric Drive Systems (3)
SiC Application: BMW eDrive Systems Equipped with SiC Inverters
4.21 Daimler
Power Semiconductor Layout
Evolution of Power Semiconductor Application
Power Semiconductor Layout: Vehicle Model Configuration Strategy
SiC Application: Inverters
SiC Application: Magna eDS System
4.22 Honda Motor
Power Semiconductor Layout
Evolution of Power Semiconductor Application
SiC: SiC Modules
4.23 Toyota Motor
Power Semiconductor Layout
Evolution of Power Semiconductor Application
Core Power Semiconductor Technology: SiC
Core Power Semiconductor Technology: GaN
SiC Application: Traction Inverters
SiC Application: Sixth-Generation Hybrid System
GaN Application: GaN Inverter

Chapter 5 Foreign Automotive-Grade Power Semiconductor Vendors

5.1 Infineon
Power Semiconductor Layout
Power Semiconductor Layout: "In China, For China" Strategy
Power Semiconductor Wafer Foundry Process and Product Application
Power Semiconductor Wafer Foundry Process: Wafer Technology
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
Core SiC Technology: Trench-based SiC MOSFETs (1)
Core SiC Technology: Trench-based SiC MOSFETs (2)
Core SiC Technology: Next-Generation Trench-based SiC Superjunction (TSJ) Technology
Core GaN Technology: CoolGaN(TM) Technology
SiC MOSFET Packaging Technology
SiC MOSFET Packaging Technology: Embedded Packaging Technology (1)
SiC MOSFET Packaging Technology: Embedded Packaging Technology (2)
SiC Products: CoolSiC(TM) MOSFETs
SiC Products: CoolSiC(TM) MOSFET Discretes
SiC Products: CoolSiC(TM) MOSFET Modules
SiC Products: Si/SiC Hybrid Modules
G2 SiC MOSFETs: 650V CoolSiC MOSFETs
G2 SiC MOSFETs: 1400V CoolSiC MOSFETs (1)
G2 SiC MOSFETs: 1400V CoolSiC MOSFETs (2)
G2 Si/SiC Hybrid Modules: HybridPACK Drive G2 CoolSiC Modules
GaN Products: CoolGaN
G1 CoolGaN: CoolGaN(TM) Automotive Transistor 100 V G1 Family
Power Semiconductor Cooperation: SiC Packaging Technology in Cooperation with ROHM (1)
Power Semiconductor Cooperation: SiC Packaging Technology in Cooperation with ROHM (2)
5.2 onsemi
Power Semiconductor Layout
Power Semiconductor Capacity Distribution
Power Semiconductor Technology Development Roadmap
Power Semiconductor Product Line and Technology Evolution
Core SiC Technology: Planar SiC MOSFETs (1)
Core SiC Technology: Planar SiC MOSFETs (2)
Core SiC Technology: Next-Generation Trench-based SiC MOSFETs
GaN Core Technology: vGaN (1)
GaN Core Technology: vGaN (2)
SiC Products: EliteSiC MOSFET Diodes
SiC Products: EliteSiC MOSFETs
SiC Products: EliteSiC MOSFETs, SiC Module/Hybrid Modules
M3 SiC MOSFET: EliteSiC MOSFET Bare Die
M3 SiC MOSFET: M3S 650V SiC MOSFET Device
SiC Product Application: Main Drive Inverters
5.3 STMicroelectronics
Development History
Development Process: Localization Strategy in China
Power Semiconductor Wafer Foundry Process and Product Application
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
SiC Products: STPOWER
SiC Products: STPOWER SiC MOSFETs
SiC Products: STPOWER SiC Diodes
GaN Products: STPOWER
5.4 Mitsubishi Electric
Power Semiconductor Layout
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
Core SiC Technology: Trench-based SiC MOSFETs
Automotive-Grade SiC Products: J3-Series SiC-MOSFET Modules (1)
Automotive-Grade SiC Products: J3-Series SiC-MOSFET Modules (2)
Automotive-Grade SiC Products: J3-Series SiC-MOSFET Modules (3)
Automotive-Grade SiC Products: J3-Series SiC-MOSFET Modules (4)
Automotive-Grade SiC Products: SiC-MOSFET Bare Dies
Automotive-Grade SiC Application: Main Drive Inverters/Range Extenders
5.5 Fuji Electric
Power Semiconductor Layout
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
Core SiC Technology: All-SiC Trench-based MOSFETs
SiC Products: SiC Schottky Barrier Diodes
SiC Products: SiC Hybrid Modules (1)
SiC Products: SiC Hybrid Modules (2)
G2 SiC Modules: 1200V All-SiC Modules
SiC Product Application: Bidirectional OBCs
5.6 Vishay Intertechnology
Power Semiconductor Layout and Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
Automotive-Grade SiC Modules
Automotive-Grade SiC Modules: EF Series Power MOSFETs
Automotive-Grade SiC Modules: 1200V SiC Single-Phase Full-Bridge Modules
GaN Products: D3GaN
G2 GaN Product Application: 400V Main Drive Inverters
5.7 Toshiba
Power Semiconductor Layout
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
Core SiC Technology: Innovation in SiC Device Structure (1)
Core SiC Technology: Innovation in SiC Device Structure (2)
SiC Products: SiC Modules/Chips
G3 SiC Products: SiC MOSFETs (1)
G3 SiC Products: SiC MOSFETs (2)
5.8 Denso
Power Semiconductor Layout (1)
Power Semiconductor Layout (2)
Power Semiconductor Capacity Distribution
Core SiC Technology: U-shaped Trench-based SiC MOSFETs
Core SiC Technology: SiC Epitaxial Growth Technology
Power Semiconductor Product Line and Technology Evolution

Chapter 6: Domestic Automotive-Grade Power Semiconductor Vendors

6.1 Silan Microelectronics
Power Semiconductor Layout
Production Lines of Subsidiaries
Power Semiconductor Wafer Foundry Process and Product Application
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
SiC Product Technology Development Roadmap
G2 SiC MOSFET: 1200V SiC MOS
G2 SiC MOSFET: 750V SiC MOS
Automotive-Grade SiC Products: B3G SiC Modules
SiC Products: Discretes Suitable for OBCs
SiC Product Application: OBCs
SiC Product Application: Level 1 DC-DC Power Supply Solution
6.2 CRRC Times Electric
Power Semiconductor Layout
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
G3 SiC Products: TO SiC Devices
G3 SiC Products: All-SiC Power Modules
6.3 StarPower
Power Semiconductor Layout
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
G2 SiC Products: 1200V SiC MOSFET
G2 SiC Products: SiC Modules
6.4 United Nova Technology
Power Semiconductor Layout
Revenue in H1 2025
Power Semiconductor Wafer Foundry Process and Product Application
Power Semiconductor Wafer Foundry Process Technology Platform
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
SiC MOS Chip Technology Layout
G1.7 SiC Products: 1500V SiC MOS Encapsulated Modules
6.5 Accopower
Power Semiconductor Layout
Power Semiconductor Capacity Distribution
Core Power Semiconductor Technology
Power Semiconductor Product Line and Technology Evolution
Automotive-Grade SiC Products: APD Series SiC Modules (1)
Automotive-Grade SiC Products: APD Series SiC Modules (2)
Automotive-Grade SiC Products: Next-Generation APD Series SiC Modules
6.6 China Resources Microelectronics
Power Semiconductor Layout
Power Semiconductor Wafer Foundry Process and Product Application
Manufacturing and Services: Wafer Foundry Core Technology
Manufacturing and Services: Wafer Foundry IP Alliance, EDA
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
GaN Products
Automotive-Grade SiC Products
Automotive-Grade SiC Products: SiC MOSFETs
G2 SiC Products: Main Drive SiC Modules
G4 SiC Products: Main Drive SiC Modules
6.7 Wingtech Technology
Power Semiconductor Layout and Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
GaN Products
Automotive-Grade GaN Product Application: Gemini Range Extenders
Automotive-Grade SiC Products: 1200V SiC MOSFETs
6.8 Basic Semiconductor
Power Semiconductor Layout
Power Semiconductor Capacity Distribution
Automotive-Grade SiC Products: PcoreTM 6-Series Modules (1)
Automotive-Grade SiC Products: PcoreTM 6-Series Modules (2)
Automotive-Grade SiC Products: PcoreTM 2-Series Modules
Automotive-Grade SiC Products: PcoreTM 1-Series Modules
6.9 NCE Power
Power Semiconductor Layout
Power Semiconductor Product Line and Technology Evolution
SiC Products: Super Trench Platform Series
G3 SiC Products (1)
G3 SiC Products (2)
G2 SiC Products
Automotive-Grade SiC Products: NCE Automotive Electronics Series
Automotive-Grade SiC Product Application: 48V Automotive Systems
6.10 Founder Microelectronics
Power Semiconductor Layout
Power Semiconductor Capacity Distribution
Power Semiconductor Product Line and Technology Evolution
Automotive-Grade SiC Products
Automotive-Grade SiC Product Application: Main Drive Controllers
Automotive-Grade SiC Product Application: OBCs
Automotive-Grade SiC Product Application: DC Chargers
Automotive-Grade SiC Product Application: DC-DC Converters
Automotive-Grade SiC Product Application: Air Suspension
Automotive-Grade SiC Product Application: Motor and Compressor Drive
Automotive-Grade SiC Product Application: PTC Heaters

Chapter 7 Domestic and Foreign Third-Generation Power Semiconductor Material Vendors

7.1 Wolfspeed (formerly Cree)
Business and Development History
Revenue in Q2 FY2025
Capacity Layout
Core SiC Technology Evolution: Planar Gate VS. Trench-based Gate SiC MOSFET
Automotive-Grade SiC Products
SiC Products: Used in EV Powertrain
SiC Products: Used in EV Powertrain - Discrete SiC MOSFETs (1)
SiC Products: Used in EV Powertrain - Discrete SiC MOSFETs (2)
SiC Products: Used in EV Powertrain - Discrete SiC MOSFETs (3)
SiC Product Application: XM Series Three-Phase Inverters
SiC Products: Used in OBCs
SiC Products: Used in OBCs - E Series (1)
SiC Products: Used in OBCs - E Series (2)
SiC Products: Used in OBCs - E Series (3)
SiC Products: Used in OBCs - E Series Solutions
SiC Products: Used in Onboard DC/DC Converters
New E Series Automotive-Grade SiC MOSFETs: E3M0900170D
New E Series Automotive-Grade SiC MOSFETs: E3M0900170J
7.2 Coherent
Business and Capacity Layout
Revenue in FY2024-Q1 FY2025
Core Technology: SHARP(TM) Technology for Recycling LiB Waste
Application of SiC Products in the Automotive Industry
Automotive-Grade SiC Products
SiC Substrate Materials: Conductive and Semi-Insulating Substrates
SiC Substrate Materials: SiC Epitaxial Wafers
7.3 Navitas Semiconductor
Business
Revenue in 2024
Capacity Layout
Core Technology: GaN and SiC Technology
Core Technology: GaNFast(TM) Technology
Evolution of GaN Solutions
Applications of GaN Products in the Automotive Industry
Automotive-Grade GaN/SiC Products
Automotive-Grade SiC Products: TOLL Packaged Third-Generation Fast SiC MOSFETs (1)
Automotive-Grade SiC Pro