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PUBLISHER: Stratistics Market Research Consulting | PRODUCT CODE: 1438161

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PUBLISHER: Stratistics Market Research Consulting | PRODUCT CODE: 1438161

Molded Interconnect Devices Market Forecasts to 2030 - Global Analysis By Product Type, By Process (Laser Direct Structuring, Film Techniques and Two-Shot Molding), End User and By Geography

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According to Stratistics MRC, the Global Molded Interconnect Devices (MID) Market is accounted for $1.3 billion in 2023 and is expected to reach $3.5 billion by 2030 growing at a CAGR of 14.4% during the forecast period. Molded Interconnect Devices (MID) are three-dimensional circuit structures formed by integrating electronics directly into injection-molded plastic components. This technology enables compact and lightweight designs, combining mechanical and electrical functions in a single part. MID is utilized in various industries, such as automotive and consumer electronics, to create efficient and space-saving electronic devices.

Market Dynamics:

Driver:

Growing demand for connected devices

The increasing demand for connected devices, driven by trends like the Internet of Things (IoT), is a key driver in the molded interconnect devices (MID) market. MID technology allows the seamless integration of electronic components into three-dimensional structures, enabling compact and multifunctional devices. As the demand for smart and interconnected products rises across industries such as automotive, healthcare and consumer electronics, MID's ability to efficiently combine mechanical and electrical functions positions it as a crucial solution for meeting these evolving market needs.

Restraint:

High initial investment costs

Establishing the infrastructure for MID production, including specialized machinery and technology, requires substantial financial resources. Companies face challenges in allocating funds for research, development and production setup, hindering widespread adoption. The financial barriers limit market entry for potential competitors and may slow down the overall growth of the MID market.

Opportunity:

Advancements in manufacturing technologies

Advancements in manufacturing technologies present a significant opportunity in the molded interconnect device (MID) market by enhancing production efficiency and expanding design possibilities. Innovations like additive manufacturing, laser direct structuring, and 3D printing enable more intricate and customized MID designs. This streamlines the manufacturing process and allows for the integration of complex electronic functionalities. As a result, the MID market can capitalize on these advancements to offer more sophisticated, compact and cost-effective solutions, fostering industry growth.

Threat:

Fluctuations in raw material prices

Fluctuations in raw material prices pose a significant threat to the molded interconnect device (MID) market. As MID relies on specialized materials for both electronic and structural components, any volatility in the prices of these raw materials can impact production costs and overall profitability. Manufacturers may face challenges in maintaining competitive pricing and the uncertainty in material costs can disrupt supply chains, affecting the stability and growth of the MID market.

Covid-19 Impact:

The COVID-19 pandemic has impacted the molded interconnect devices (MID) market by disrupting global supply chains, causing production delays and affecting consumer demand. Lockdowns, social distancing measures and economic uncertainties have led to challenges in manufacturing and distribution. Additionally, shifts in priorities and reduced consumer spending have influenced the adoption of MID in various industries. Adaptation to remote work and changes in consumer behavior have also influenced market dynamics, requiring strategic adjustments from industry players.

The laser direct structuring (LDS) segment is expected to be the largest during the forecast period

The laser direct structuring (LDS) segment is projected to be the largest in the forecast period due to its advanced capabilities in molded interconnect device (MID) manufacturing. LDS technology enables precise and intricate circuit patterns by selectively activating additives in the molded substrate using laser beams. This method offers high flexibility and design complexity, making it increasingly favored in diverse applications. The demand for sophisticated electronic devices and the growing trend towards miniaturization contribute to the dominance of the LDS segment in the market.

The sensors segment is expected to have the highest CAGR during the forecast period

The sensors segment is anticipated to exhibit the highest growth rate during the forecast period in the molded interconnect devices (MID) market. This surge is attributed to the escalating demand for compact and integrated sensor solutions across industries. MID technology's ability to seamlessly embed sensors within three-dimensional structures enhances design efficiency and functionality, driving the growing adoption of MID in sensor applications and contributing to the segment's robust growth.

Region with largest share:

North America is poised to lead the molded interconnect devices (MID) market, boasting the largest share during the forecast period. This dominance is attributed to a robust electronics industry, technological innovation and widespread adoption across sectors like automotive, healthcare and telecommunications. Favorable economic conditions, a well-established manufacturing infrastructure and a proactive approach towards advanced technologies contribute to the region's prominence. The continuous demand for compact and multifunctional electronic solutions further propels the growth of the MID market in North America.

Region with highest CAGR:

The Asia-Pacific region is poised for rapid growth in the molded interconnect devices (MID) market due to its burgeoning electronics manufacturing sector, increasing adoption of advanced technologies and expanding consumer electronics markets. The region benefits from a robust supply chain, cost-effective manufacturing capabilities and a rising demand for compact and integrated electronic solutions. With supportive government initiatives and a flourishing innovation ecosystem, Asia-Pacific is becoming a focal point for MID applications, contributing to the anticipated swift expansion of the market.

Key players in the market

Some of the key players in Molded Interconnect Devices (MID) market include Amphenol Corporation, Cicor Group, Galtronics USA Inc. (Baylin Technologies), Harting Technology Group, Kubler Group, LP Technologies, Inc., LPKF Laser & Electronics AG, MacDermid Alpha Electronics Solutions, MID Solutions, Inc., Molex LLC, Multiple Dimensions AG, RTP Company, Taoglas, TE Connectivity Ltd., T-Ink Inc. and Yomura Technologies Inc.

Key Developments:

In November 2023, Molex has built a new medical device campus in Poland in a $110m project that adds high power busbar and battery interconnect for its electrification business. The new Molex facility Katowice, Poland, has an initial 23,000 square-meter manufacturing space for advanced medical devices for Phillips-Medisize as well as electric vehicle and electrification interconnect for Molex customers. The site will have advanced medical device assembly, packaging and injection molding and also manufacture interconnect battery solutions for electric vehicles and high-power busbar solutions for Molex's electrification business.

In May 2022, Taoglas has signed a partnership agreement with Dejerao. The company will help Dejerao's customers by providing best-in-class RF antennas for cellular bonding devices used in mobile applications.

In March 2022, Amphenol Corporation has expanded its SURLOK Plus Series to include 8 mm and 10.3 mm right-angle connectors, with a voltage range of 1500 VDC to meet energy storage and high-power connection and transfer requirements.

Product Types Covered:

  • Antenna & Connectivity Modules
  • Connectors & Switches
  • Lighting Systems
  • Sensors
  • Other Product Types

Processes Covered:

  • Laser Direct Structuring (LDS)
  • Film Techniques
  • Two-Shot Molding

End Users Covered:

  • Telecommunications
  • Automotive
  • Consumer Electronics
  • Industrial
  • Medical
  • Military & Aerospace
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Product Code: SMRC25130

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 End User Analysis
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Molded Interconnect Devices (MID) Market, By Product Type

  • 5.1 Introduction
  • 5.2 Antenna & Connectivity Modules
  • 5.3 Connectors & Switches
  • 5.4 Lighting Systems
  • 5.5 Sensors
  • 5.6 Other Product Types

6 Global Molded Interconnect Devices (MID) Market, By Process

  • 6.1 Introduction
  • 6.2 Laser Direct Structuring (LDS)
  • 6.3 Film Techniques
  • 6.4 Two-Shot Molding

7 Global Molded Interconnect Devices (MID) Market, By End User

  • 7.1 Introduction
  • 7.2 Telecommunications
  • 7.3 Automotive
  • 7.4 Consumer Electronics
  • 7.5 Industrial
  • 7.6 Medical
  • 7.7 Military & Aerospace
  • 7.8 Other End Users

8 Global Molded Interconnect Devices (MID) Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Amphenol Corporation
  • 10.2 Cicor Group
  • 10.3 Galtronics USA Inc. (Baylin Technologies)
  • 10.4 Harting Technology Group
  • 10.5 Kubler Group
  • 10.6 LP Technologies, Inc.
  • 10.7 LPKF Laser & Electronics AG
  • 10.8 MacDermid Alpha Electronics Solutions
  • 10.9 MID Solutions, Inc.
  • 10.10 Molex LLC
  • 10.11 Multiple Dimensions AG
  • 10.12 RTP Company
  • 10.13 Taoglas
  • 10.14 TE Connectivity Ltd.
  • 10.15 T-Ink Inc.
  • 10.16 Yomura Technologies Inc.
Product Code: SMRC25130

List of Tables

  • Table 1 Global Molded Interconnect Devices (MID) Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 3 Global Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 4 Global Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 5 Global Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 6 Global Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 7 Global Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 8 Global Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 9 Global Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 10 Global Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 11 Global Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 12 Global Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 13 Global Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 14 Global Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 15 Global Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 16 Global Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 17 Global Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 18 Global Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 19 Global Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 20 North America Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 21 North America Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 22 North America Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 23 North America Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 24 North America Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 25 North America Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 26 North America Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 27 North America Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 28 North America Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 29 North America Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 30 North America Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 31 North America Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 32 North America Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 33 North America Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 34 North America Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 35 North America Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 36 North America Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 37 North America Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 38 North America Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 39 Europe Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 40 Europe Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 41 Europe Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 42 Europe Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 43 Europe Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 44 Europe Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 45 Europe Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 46 Europe Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 47 Europe Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 48 Europe Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 49 Europe Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 50 Europe Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 51 Europe Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 52 Europe Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 53 Europe Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 54 Europe Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 55 Europe Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 56 Europe Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 57 Europe Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 58 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 59 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 60 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 61 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 62 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 63 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 64 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 65 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 66 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 67 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 68 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 69 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 70 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 71 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 72 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 73 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 74 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 75 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 76 Asia Pacific Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 77 South America Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 78 South America Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 79 South America Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 80 South America Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 81 South America Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 82 South America Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 83 South America Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 84 South America Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 85 South America Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 86 South America Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 87 South America Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 88 South America Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 89 South America Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 90 South America Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 91 South America Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 92 South America Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 93 South America Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 94 South America Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 95 South America Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 96 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Country (2021-2030) ($MN)
  • Table 97 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Product Type (2021-2030) ($MN)
  • Table 98 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Antenna & Connectivity Modules (2021-2030) ($MN)
  • Table 99 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Connectors & Switches (2021-2030) ($MN)
  • Table 100 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Lighting Systems (2021-2030) ($MN)
  • Table 101 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Sensors (2021-2030) ($MN)
  • Table 102 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Other Product Types (2021-2030) ($MN)
  • Table 103 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Process (2021-2030) ($MN)
  • Table 104 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Laser Direct Structuring (LDS) (2021-2030) ($MN)
  • Table 105 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Film Techniques (2021-2030) ($MN)
  • Table 106 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Two-Shot Molding (2021-2030) ($MN)
  • Table 107 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By End User (2021-2030) ($MN)
  • Table 108 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Telecommunications (2021-2030) ($MN)
  • Table 109 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 110 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 111 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 112 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Medical (2021-2030) ($MN)
  • Table 113 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Military & Aerospace (2021-2030) ($MN)
  • Table 114 Middle East & Africa Molded Interconnect Devices (MID) Market Outlook, By Other End Users (2021-2030) ($MN)
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