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PUBLISHER: The Business Research Company | PRODUCT CODE: 1184362

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PUBLISHER: The Business Research Company | PRODUCT CODE: 1184362

Semiconductor Assembly And Packaging Equipment Global Market Opportunities And Strategies To 2031

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“"Semiconductor Assembly And Packaging Equipment Global Market Opportunities And Strategies To 2031 ” from The Business Research Company provides the strategists; marketers and senior management with the critical information they need to assess the global semiconductor assembly and packaging equipment market as it emerges from the COVID-19 shut down.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 12 geographies.
  • Understand how the market is being affected by the coronavirus and how it is likely to emerge and grow as the impact of the virus abates.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market research findings.
  • Benchmark performance against key competitors.
  • Utilize the relationships between key data sets for superior strategizing.
  • Suitable for supporting your internal and external presentations with reliable high-quality data and analysis
  • Report will be updated with the latest data and delivered to you within 3-5 working days of order.

Where is the largest and fastest growing market for semiconductor assembly and packaging equipment? How does the market relate to the overall economy; demography and other similar markets? What forces will shape the market going forward? “The semiconductor assembly and packaging equipment Global Market Report 2022, report ” from The Business Research Company answers all these questions and many more.

The report covers market characteristics; size and growth; segmentation; regional and country breakdowns; competitive landscape; market shares; trends and strategies for this market. It traces the market's historic and forecast market growth by geography. It places the market within the context of the wider semiconductor assembly and packaging equipment market; and compares it with other markets.

The report covers the following chapters:

  • Introduction and Market Characteristics: Brief introduction to the segmentations covered in the market, defintions and explanations about semiconductor assembly and packaging equipment market.
  • Key Trends: Highlights the major trends shaping the global semiconductor assembly and packaging equipment market. This section also highlights likely future developments in the market.
  • Global Market Size and Growth: Global historic (2016-2021) and forecast (2021-2026), and (2026-2031) market values, and drivers and restraints that support and control the growth of the market in the historic and forecast periods.
  • Regional Analysis: Historic (2016-2021) and forecast (2021-2026), and (2026-2031) market values and growth and market share comparison by region.
  • Market Segmentation: Contains the market values (2016-2031) and analysis for each segment by type, by application, and by end-user in the market.
  • Regional Market Size and Growth: Regional market size (2021), historic (2016-2021) and forecast (2021-2026), and (2026-2031) market values, and growth and market share comparison of countries within the region. This report includes information on the regions Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa and major countries within each region.
  • Competitive Landscape: Details on the competitive landscape of the market, estimated market shares and company profiles of the leading players.
  • Key Mergers and Acquisitions: Information on recent mergers and acquisitions in the market covered in the report. This section gives key financial details of mergers and acquisitions, which have shaped the market in recent years.
  • Market Opportunities And Strategies: Describes market opportunities and strategies based on findings of the research, with information on growth opportunities across countries, segments and strategies to be followed in those markets.
  • Conclusions And Recommendations: Includes recommendations for semiconductor assembly and packaging equipment providers in terms of product/service offerings geographic expansion, marketing strategies and target groups.
  • Appendix: This section includes details on the NAICS codes covered, abbreviations and currencies codes used in this report.

Scope:

Markets Covered:

  • 1) By Type: Plating Equipment; Inspection And Dicing Equipment; Wire Bonding Equipment; Die-Bonding Equipment; Other Types
  • 2) By Application: Consumer Electronics; Healthcare Devices; Automotive; Enterprise Storage; Other Applications
  • 3) By End-User: OSATs; IDMs
  • Companies Mentioned: Tokyo Electron Ltd.; Applied Materials, Inc.; Kulicke and Soffa Industries, Inc.; ASML Holding N.V; BE Semiconductor Industries N.V
  • Countries: China; Australia; India; Indonesia; Japan; South Korea; USA; Brazil; France; Germany; UK; Russia
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets; GDP proportions; expenditure per capita; semiconductor assembly and packaging equipment indicators comparison.
  • Data segmentations: country and regional historic and forecast data; market share of competitors; market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Product Code: o&s609

Table of Contents

1. Executive Summary

2. Table of Contents

3. List of Figures

4. List of Tables

5. Report Structure

6. Introduction and Market Characteristics

  • 6.1. General Market Definition
  • 6.2. Summary
  • 6.3. Market Segmentation By Type
    • 6.3.1. Plating Equipment
    • 6.3.2. Inspection And Dicing Equipment
    • 6.3.3. Wire Bonding Equipment
    • 6.3.4. Die-Bonding Equipment
    • 6.3.5. Other Types
  • 6.4. Market Segmentation By Application
    • 6.4.1. Consumer Electronics
    • 6.4.2. Healthcare Devices
    • 6.4.3. Automotive
    • 6.4.4. Enterprise Storage
    • 6.4.5. Other Applications
  • 6.5. Market Segmentation By End-User
    • 6.5.1. OSATs
    • 6.5.2. IDMs

7. Major Market Trends

  • 7.1. Introduction of Big Data and AI Technology In Semiconductor Equipment
  • 7.2. Product Innovation
  • 7.3. Compound Semiconductor Equipment
  • 7.4. Increasing Investments
  • 7.5. Strategic Partnerships

8. Global Market Size And Growth

  • 8.1. Market Size
  • 8.2. Historic Market Growth, 2016 - 2021, Value ($ Million)
    • 8.2.1. Market Drivers 2016 - 2021
    • 8.2.2. Market Restraints 2016 - 2021
  • 8.3. Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
    • 8.3.1. Market Drivers 2021 - 2026
    • 8.3.2. Market Restraints 2021 - 2026

9. Global Market Segmentation

  • 9.1. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 9.2. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By Application, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 9.3. Global Semiconductor Assembly And Packaging Equipment Market, Segmentation By End-User, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

10. Global Market, Regional And Country Analysis

  • 10.1. Global Semiconductor Assembly And Packaging Equipment Market, By Region, Historic and Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 10.2. Global Semiconductor Assembly And Packaging Equipment Market, By Country, Historic and Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

11. Asia-Pacific Market

  • 11.1. Summary
  • 11.2. Market Overview
    • 11.2.1. Region Information
    • 11.2.2. Market Information
    • 11.2.3. Background Information
    • 11.2.4. Government Initiatives
    • 11.2.5. Regulations
    • 11.2.6. Regulatory Bodies
    • 11.2.7. Major Associations
    • 11.2.8. Taxes Levied
    • 11.2.9. Corporate Tax Structure
    • 11.2.10. Investments
    • 11.2.11. Major Companies
  • 11.3. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 11.4. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 11.5. Asia-Pacific Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 11.6. Asia Pacific Semiconductor Assembly And Packaging Equipment Market: Country Analysis
  • 11.7. China Market
  • 11.8. Summary
  • 11.9. Market Overview
    • 11.9.1. Country Information
    • 11.9.2. Market Information
    • 11.9.3. Background Information
    • 11.9.4. Government Initiatives
    • 11.9.5. Regulations
    • 11.9.6. Regulatory Bodies
    • 11.9.7. Major Associations
    • 11.9.8. Taxes Levied
    • 11.9.9. Corporate Tax Structure
    • 11.9.10. Investments
    • 11.9.11. Major Companies
  • 11.10. China Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 11.11. China Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 11.12. China Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 11.13. India Market
  • 11.14. India Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 11.15. India Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 11.16. India Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 11.17. Japan Market
  • 11.18. Japan Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 11.19. Japan Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 11.20. Japan Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 11.21. Australia Market
  • 11.22. Australia Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 11.23. Australia Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 11.24. Australia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 11.25. Indonesia Market
  • 11.26. Indonesia Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 11.27. Indonesia Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 11.28. Indonesia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 11.29. South Korea Market
  • 11.30. South Korea Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 11.31. South Korea Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 11.32. South Korea Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

12. Western Europe Market

  • 12.1. Summary
  • 12.2. Market Overview
    • 12.2.1. Region Information
    • 12.2.2. Market Information
    • 12.2.3. Background Information
    • 12.2.4. Government Initiatives
    • 12.2.5. Regulations
    • 12.2.6. Regulatory Bodies
    • 12.2.7. Major Associations
    • 12.2.8. Taxes Levied
    • 12.2.9. Corporate Tax Structure
    • 12.2.10. Investments
    • 12.2.11. Major Companies
  • 12.3. Western Europe Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 12.4. Western Europe Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 12.5. Western Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 12.6. Western Europe Semiconductor Assembly And Packaging Equipment Market: Country Analysis
  • 12.7. UK Market
  • 12.8. UK Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 12.9. UK Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 12.10. UK Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 12.11. Germany Market
  • 12.12. Germany Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 12.13. Germany Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 12.14. Germany Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 12.15. France Market
  • 12.16. France Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 12.17. France Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 12.18. France Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

13. Eastern Europe Market

  • 13.1. Summary
  • 13.2. Market Overview
    • 13.2.1. Region Information
    • 13.2.2. Market Information
    • 13.2.3. Background Information
    • 13.2.4. Government Initiatives
    • 13.2.5. Regulations
    • 13.2.6. Regulatory bodies
    • 13.2.7. Major Associations
    • 13.2.8. Taxes Levied
    • 13.2.9. Corporate Tax Structure
    • 13.2.10. Investments
    • 13.2.11. Major Companies
  • 13.3. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 13.4. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 13.5. Eastern Europe Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 13.6. Eastern Europe Semiconductor Assembly And Packaging Equipment Market: Country Analysis
  • 13.7. Russia Market
  • 13.8. Russia Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 13.9. Russia Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 13.10. Russia Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

14. North America Market

  • 14.1. Summary
  • 14.2. Market Overview
    • 14.2.1. Region Information
    • 14.2.2. Market Information
    • 14.2.3. Background Information
    • 14.2.4. Government Initiatives
    • 14.2.5. Regulations
    • 14.2.6. Regulatory bodies
    • 14.2.7. Major Associations
    • 14.2.8. Taxes Levied
    • 14.2.9. Corporate Tax Structure
    • 14.2.10. Investments
    • 14.2.11. Major Companies
  • 14.3. North America Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 14.4. North America Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 14.5. North America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 14.6. North America Semiconductor Assembly And Packaging Equipment Market: Country Analysis
  • 14.7. USA Market
  • 14.8. Summary
  • 14.9. Market Overview
    • 14.9.1. Country Information
    • 14.9.2. Market Information
    • 14.9.3. Background Information
    • 14.9.4. Government Initiatives
    • 14.9.5. Regulations
    • 14.9.6. Regulatory bodies
    • 14.9.7. Major Associations
    • 14.9.8. Taxes Levied
    • 14.9.9. Corporate Tax Structure
    • 14.9.10. Investments
    • 14.9.11. Major Companies
  • 14.10. USA Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 14.11. USA Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 14.12. USA Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

15. South America Market

  • 15.1. Summary
  • 15.2. Market Overview
    • 15.2.1. Region Information
    • 15.2.2. Market Information
    • 15.2.3. Background Information
    • 15.2.4. Government Initiatives
    • 15.2.5. Regulations
    • 15.2.6. Regulatory Bodies
    • 15.2.7. Major Associations
    • 15.2.8. Taxes Levied
    • 15.2.9. Corporate Tax Structure
    • 15.2.10. Investments
    • 15.2.11. Major Companies
  • 15.3. South America Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 15.4. South America Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 15.5. South America Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)
  • 15.6. South America Semiconductor Assembly And Packaging Equipment Market: Country Analysis
  • 15.7. Brazil Market
  • 15.8. Brazil Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 15.9. Brazil Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 15.10. Brazil Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

16. Middle East Market

  • 16.1. Summary
  • 16.2. Market Overview
    • 16.2.1. Region Information
    • 16.2.2. Market Information
    • 16.2.3. Background Information
    • 16.2.4. Government Initiatives
    • 16.2.5. Regulations
    • 16.2.6. Regulatory Bodies
    • 16.2.7. Major Associations
    • 16.2.8. Corporate Tax Structure
    • 16.2.9. Investments
    • 16.2.10. Major Companies
  • 16.3. Middle East Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 16.4. Middle East Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 16.5. Middle East Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

17. Africa Market

  • 17.1. Summary
  • 17.2. Market Overview
    • 17.2.1. Region Information
    • 17.2.2. Market Information
    • 17.2.3. Background Information
    • 17.2.4. Government Initiatives
    • 17.2.5. Regulations
    • 17.2.6. Regulatory Bodies
    • 17.2.7. Major Associations
    • 17.2.8. Taxes Levied
    • 17.2.9. Corporate Tax Structure
    • 17.2.10. Investments
    • 17.2.11. Major Companies
  • 17.3. Africa Semiconductor Assembly And Packaging Equipment Market, Historic Market Growth, 2016 - 2021, Value ($ Million)
  • 17.4. Africa Semiconductor Assembly And Packaging Equipment Market, Forecast Market Growth, 2021 - 2026, 2031F Value ($ Million)
  • 17.5. Africa Semiconductor Assembly And Packaging Equipment Market, Segmentation By Type, Historic And Forecast, 2016 - 2021, 2026F, 2031F, Value ($ Million)

18. Competitive Landscape And Company Profiles

  • 18.1. Company Profiles
  • 18.2. Tokyo Electron Ltd
    • 18.2.1. Company Overview
    • 18.2.2. Products And Services
    • 18.2.3. Financial Overview
  • 18.3. Applied Materials, Inc.
    • 18.3.1. Company Overview
    • 18.3.2. Products And Services
    • 18.3.3. Business Strategy
    • 18.3.4. Financial Overview
  • 18.4. Kulicke and Soffa Industries, Inc
    • 18.4.1. Company Overview
    • 18.4.2. Products And Services
    • 18.4.3. Business Strategy
    • 18.4.4. Financial Overview
  • 18.5. ASML Holding N.V
    • 18.5.1. Company Overview
    • 18.5.2. Products And Services
    • 18.5.3. Financial Overview
  • 18.6. BE Semiconductor Industries N.V
    • 18.6.1. Company Overview
    • 18.6.2. Products And Services
    • 18.6.3. Business Strategy
    • 18.6.4. Financial Overview

19. Key Mergers and Acquisitions

  • 19.1. Atlas Copco Acquired Ceres Technologies Inc.
  • 19.2. Applied Materials Inc. Acquired Picosun Oy
  • 19.3. Wingtech Technology Acquired Nexperia
  • 19.4. Applied Materials Inc. Acquired Kokusai Electric Corporation

20. Market Opportunities And Strategies

  • 20.1. Global Semiconductor Assembly And Packaging Equipment Market In 2026 - Countries Offering Most New Opportunities
  • 20.2. Global Semiconductor Assembly And Packaging Equipment Market In 2026 - Segments Offering Most New Opportunities
  • 20.3. Global Semiconductor Assembly And Packaging Equipment Market In 2026 - Growth Strategies
    • 20.3.1. Market Trend Based Strategies
    • 20.3.2. Competitor Strategies

21. Semiconductor Assembly And Packaging Equipment Market, Conclusions And Recommendations

  • 21.1. Conclusions
  • 21.2. Recommendations
    • 21.2.1. Product
    • 21.2.2. Place
    • 21.2.3. Price
    • 21.2.4. Promotion
    • 21.2.5. People

22. Appendix

  • 22.1. Market Data Sources
  • 22.2. Research Methodology
  • 22.3. Currencies
  • 22.4. The Business Research Company
  • 22.5. Copyright and Disclaimer
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