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PUBLISHER: TechSci Research | PRODUCT CODE: 1901688

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PUBLISHER: TechSci Research | PRODUCT CODE: 1901688

Through Hole Passive Components Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Component, By Leads Model, By Application By Region & Competition, 2021-2031F

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The Global Through Hole Passive Components Market will grow from USD 37.29 Billion in 2025 to USD 62.13 Billion by 2031 at a 8.88% CAGR. Through-hole passive components are electronic elements such as resistors, capacitors, and inductors that feature leads designed to be inserted through drilled holes in a printed circuit board and soldered to establish a connection.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 37.29 Billion
Market Size 2031USD 62.13 Billion
CAGR 2026-20318.88%
Fastest Growing SegmentSensors
Largest MarketAsia Pacific

Key Market Drivers

The rising demand for high-reliability automotive electronics and EV powertrains acts as a primary catalyst for the adoption of through-hole passive components. As manufacturers transition toward electrification, the requirement for components enduring thermal cycling and high-voltage loads becomes critical. Through-hole resistors and capacitors are integrated into inverters because their leaded architecture provides robust mechanical anchorage against vibrations.

Key Market Challenges

The rapid industry-wide transition toward Surface Mount Technology represents the primary impediment to the expansion of the Global Through Hole Passive Components Market. This shift is fundamentally driven by the relentless demand for miniaturization and the necessity to optimize component density on printed circuit boards. Surface mount counterparts offer superior compatibility with high-speed automated assembly systems, significantly reducing manufacturing costs compared to the manual or semi-automated insertion processes required for through-hole leads.

Key Market Trends

The advancement of automated robotic insertion and AI-driven manufacturing is fundamentally reshaping the production landscape for through-hole passive components. Manufacturers are increasingly deploying advanced insertion machines that eliminate the traditional reliance on manual labor, thereby neutralizing the cost disparities between through-hole and surface mount assembly. This transition is critical for maintaining the viability of leaded resistors and capacitors in mass-production environments where precision and speed are paramount.

Key Market Players

  • Murata Manufacturing Co., Ltd.
  • TDK Corporation
  • Vishay Intertechnology, Inc.
  • Panasonic Corporation
  • AVX Corporation
  • KEMET Corporation
  • Taiyo Yuden Co., Ltd.
  • Wurth Elektronik GmbH & Co. KG
  • Yageo Corporation
  • Samsung Electro-Mechanics Co., Ltd.

Report Scope:

In this report, the Global Through Hole Passive Components Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Through Hole Passive Components Market, By Component:

  • Resistors
  • Capacitors
  • Inductors
  • Diodes
  • Transducers
  • Sensors
  • and Others

Through Hole Passive Components Market, By Leads Model:

  • Axial Leads and Radial Leads

Through Hole Passive Components Market, By Application:

  • Consumer Electronics
  • IT & Telecommunication
  • Automotive
  • Industrial
  • Aerospace & Defense
  • Healthcare
  • and Others

Through Hole Passive Components Market, By Region:

  • North America
  • United States
  • Canada
  • Mexico
  • Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • South America
  • Brazil
  • Argentina
  • Colombia
  • Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Through Hole Passive Components Market.

Available Customizations:

Global Through Hole Passive Components Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).
Product Code: 16470

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Through Hole Passive Components Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Component (Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, and Others)
    • 5.2.2. By Leads Model (Axial Leads and Radial Leads)
    • 5.2.3. By Application (Consumer Electronics, IT & Telecommunication, Automotive, Industrial, Aerospace & Defense, Healthcare, and Others)
    • 5.2.4. By Region
    • 5.2.5. By Company (2025)
  • 5.3. Market Map

6. North America Through Hole Passive Components Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Component
    • 6.2.2. By Leads Model
    • 6.2.3. By Application
    • 6.2.4. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Through Hole Passive Components Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Component
        • 6.3.1.2.2. By Leads Model
        • 6.3.1.2.3. By Application
    • 6.3.2. Canada Through Hole Passive Components Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Component
        • 6.3.2.2.2. By Leads Model
        • 6.3.2.2.3. By Application
    • 6.3.3. Mexico Through Hole Passive Components Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Component
        • 6.3.3.2.2. By Leads Model
        • 6.3.3.2.3. By Application

7. Europe Through Hole Passive Components Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Component
    • 7.2.2. By Leads Model
    • 7.2.3. By Application
    • 7.2.4. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Through Hole Passive Components Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Component
        • 7.3.1.2.2. By Leads Model
        • 7.3.1.2.3. By Application
    • 7.3.2. France Through Hole Passive Components Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Component
        • 7.3.2.2.2. By Leads Model
        • 7.3.2.2.3. By Application
    • 7.3.3. United Kingdom Through Hole Passive Components Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Component
        • 7.3.3.2.2. By Leads Model
        • 7.3.3.2.3. By Application
    • 7.3.4. Italy Through Hole Passive Components Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Component
        • 7.3.4.2.2. By Leads Model
        • 7.3.4.2.3. By Application
    • 7.3.5. Spain Through Hole Passive Components Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Component
        • 7.3.5.2.2. By Leads Model
        • 7.3.5.2.3. By Application

8. Asia Pacific Through Hole Passive Components Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Component
    • 8.2.2. By Leads Model
    • 8.2.3. By Application
    • 8.2.4. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Through Hole Passive Components Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Component
        • 8.3.1.2.2. By Leads Model
        • 8.3.1.2.3. By Application
    • 8.3.2. India Through Hole Passive Components Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Component
        • 8.3.2.2.2. By Leads Model
        • 8.3.2.2.3. By Application
    • 8.3.3. Japan Through Hole Passive Components Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Component
        • 8.3.3.2.2. By Leads Model
        • 8.3.3.2.3. By Application
    • 8.3.4. South Korea Through Hole Passive Components Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Component
        • 8.3.4.2.2. By Leads Model
        • 8.3.4.2.3. By Application
    • 8.3.5. Australia Through Hole Passive Components Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Component
        • 8.3.5.2.2. By Leads Model
        • 8.3.5.2.3. By Application

9. Middle East & Africa Through Hole Passive Components Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Component
    • 9.2.2. By Leads Model
    • 9.2.3. By Application
    • 9.2.4. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Through Hole Passive Components Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Component
        • 9.3.1.2.2. By Leads Model
        • 9.3.1.2.3. By Application
    • 9.3.2. UAE Through Hole Passive Components Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Component
        • 9.3.2.2.2. By Leads Model
        • 9.3.2.2.3. By Application
    • 9.3.3. South Africa Through Hole Passive Components Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Component
        • 9.3.3.2.2. By Leads Model
        • 9.3.3.2.3. By Application

10. South America Through Hole Passive Components Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Component
    • 10.2.2. By Leads Model
    • 10.2.3. By Application
    • 10.2.4. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Through Hole Passive Components Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Component
        • 10.3.1.2.2. By Leads Model
        • 10.3.1.2.3. By Application
    • 10.3.2. Colombia Through Hole Passive Components Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Component
        • 10.3.2.2.2. By Leads Model
        • 10.3.2.2.3. By Application
    • 10.3.3. Argentina Through Hole Passive Components Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Component
        • 10.3.3.2.2. By Leads Model
        • 10.3.3.2.3. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Through Hole Passive Components Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Murata Manufacturing Co., Ltd.
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. TDK Corporation
  • 15.3. Vishay Intertechnology, Inc.
  • 15.4. Panasonic Corporation
  • 15.5. AVX Corporation
  • 15.6. KEMET Corporation
  • 15.7. Taiyo Yuden Co., Ltd.
  • 15.8. Wurth Elektronik GmbH & Co. KG
  • 15.9. Yageo Corporation
  • 15.10. Samsung Electro-Mechanics Co., Ltd.

16. Strategic Recommendations

17. About Us & Disclaimer

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