Wire-to-Board Connector Global Market Report 2026

A wire-to-board connector is an electrical connector designed to link a group of individual wires to a printed circuit board (PCB), facilitating the transmission of power and signals to the board. These connectors find application in various settings, including lighting systems, PCB testing, and power supplies.

The primary types of wire-to-board connectors are categorized as below 1.00 mm, 1.00 mm to 2.00 mm, and above 2.00 mm. 'Below 1.00 mm' refers to lengths less than one millimeter (mm). The different styles include accessory, header, housing, plug, receptacle, and socket, and they are employed in transportation, consumer electronics, communications, industries, military applications, and other sectors.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

Tariffs have affected the wire-to-board connector market by raising costs for imported metals, plastics, plating materials, and precision tooling components used in connector fabrication. Industrial, automotive, and consumer electronics segments in Europe and North America face increased pricing pressure due to their dependence on Asian supply chains. Nevertheless, tariffs are also stimulating local tooling production, encouraging domestic connector assembly, and supporting innovation in durable, cost-efficient connector designs to reduce long-term import reliance.

The wire-to-board connector market research report is one of a series of new reports from The Business Research Company that provides wire-to-board connector market statistics, including wire-to-board connector industry global market size, regional shares, competitors with a wire-to-board connector market share, detailed wire-to-board connector market segments, market trends and opportunities, and any further data you may need to thrive in the wire-to-board connector industry. This wire-to-board connector market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The wire-to-board connector market size has grown steadily in recent years. It will grow from $5.06 billion in 2025 to $5.28 billion in 2026 at a compound annual growth rate (CAGR) of 4.2%. The growth in the historic period can be attributed to growth in traditional pcb-based electronics, reliance on manual wiring processes, expansion of early consumer electronics, increased use in transportation systems, development of basic connector housing technologies.

The wire-to-board connector market size is expected to see steady growth in the next few years. It will grow to $6.41 billion in 2030 at a compound annual growth rate (CAGR) of 5.0%. The growth in the forecast period can be attributed to rising demand for high-power and miniaturized connectors, expansion of electric mobility applications, increasing adoption of automated industrial systems, growth in smart consumer electronics, development of advanced pcb testing and power supply solutions. Major trends in the forecast period include adoption of intelligent high-density connector designs, integration of IoT-enabled pcb connectivity solutions, advancement of automated manufacturing for precision connectors, expansion of electrification-driven connector requirements, development of AI-assisted quality inspection systems.

The rising number of data centers is expected to drive the growth of the wire-to-board connector market in the future. A data center is a physical space, building, or structure that houses the IT technology needed to create, execute, and provide applications and services, as well as to store and manage the associated data. Wire-to-board connectors are critical components used in data centers to establish electrical connections between circuit boards and other devices; this leads to increased data transmission speeds and more accurate signals, resulting in reduced heat generation. For example, in September 2024, the National Telecommunications and Information Administration, a U.S. government agency, reported that the United States has approximately 5,000 data centers, with demand for these facilities projected to grow by about 9% annually until 2030. Therefore, the increasing number of data centers is propelling the growth of the wire-to-board connector market.

Major companies in the wire-to-board connector market are concentrating on developing innovative products, such as USB 3.2 compatible connectors, to enable faster data transfer and ensure reliable connectivity in automotive and electronic applications. USB 3.2 compatible connectors are advanced components that support high-speed data transfer of up to 20 Gbps, considerably faster than traditional USB 2.0 or 3.0, and facilitate dependable transmission of data, video, and power across automotive systems, computers, and consumer electronics. For example, in February 2025, Hirose Electric Co. Ltd., a Japan-based electronics manufacturer, introduced the AU1 Series, a USB 3.2 compatible wire-to-board connector designed for automotive applications. The AU1 Series builds upon the internal design of Hirose's CX Series USB Type-C connectors, delivering high-speed signal transmission while complying with rigorous automotive standards for vibration and heat resistance (USCAR-2 and USCAR-30). Its reinforced shell, Connector Position Assurance (CPA) mechanism, and support for multiple key codes enhance reliability, durability, and board design flexibility, making it suitable for in-vehicle infotainment systems, internal signal transmission, and charging ports. The connector supports USB 3.2 Gen2, DisplayPort 1.4, and HDMI standards, with plans to expand to 24-pin variations for diverse automotive applications.

In December 2024, Molex LLC, a U.S.-based manufacturing and technology company, acquired AirBorn Inc. for an undisclosed amount. With this acquisition, Molex LLC aims to substantially expand its portfolio of ruggedized and high-performance interconnect solutions to better serve the demanding aerospace, defense, and industrial sectors. AirBorn Inc. is a U.S.-based provider of engineered interconnect solutions, including custom connectors, power products, and RF components for mission-critical applications.

Major companies operating in the wire-to-board connector market are Hon HAI Precision Industry Co Ltd., Yamaichi Electronics Co.Ltd., 3M Co., Fujitsu Limited, Luxshare Precision Industry Co. Ltd., Kyocera Corporation, TE Connectivity Ltd., Amphenol Corporation, Molex LLC., Phoenix Contact GmbH and Co KG., ITT Inc., Japan Aviation Electronics Industry Ltd., Panduit Corp., Hirose Electric Co Ltd., Wurth Elektronik GmbH and Co KG., Harting Technology Group, Lemo SA, Samtec Inc., Smiths Interconnect Inc., AVX Corporation, Glenair, Souriau SAS, ERNI Deutschland GmbH, Rosenberger Group, I-PEX Inc., Omnetics Connector Corporation, JST MFG Co Ltd., Nicomatic SA, Advanced Interconnections Corp

Asia-Pacific was the largest region in the wire-to-board connector market in 2025 and is expected to be the fastest-growing region in the wire-to-board connector market report during the forecast period. The regions covered in the wire-to-board connector market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the wire-to-board connector market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The wire-to-board connector market consists of sales of pin header connectors, socket connectors, IDC connectors, and Board connectors. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Wire-to-Board Connector Market Global Report 2026 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses wire-to-board connector market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for wire-to-board connector ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The wire-to-board connector market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
• The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
• The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
• The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
• The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
• The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
• Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.

Scope

• Markets Covered:1) By Type: Below 1.00 MM; 1.00 MM To 2.00 MM; Above 2.00 MM
• 2) By Style: Accessory; Header; Housing; Plug; Receptacle; Socket
• 3) By Application: Transportation; Consumer Electronics; Communications; Industries; Military; Other Applications
• Subsegments:
• 1) By Below 1.00 MM: 0.30 MM; 0.50 MM; 0.75 MM
• 2) By 1.00 MM To 2.00 MM: 1.00 MM; 1.25 MM; 1.50 MM; 1.75 MM; 2.00 MM
• 3) By Above 2.00 MM: 2.50 MM; 3.00 MM; 4.00 MM; 5.00 MM
• Companies Mentioned: Hon Hai Precision Industry Co Ltd.; Yamaichi Electronics Co.Ltd.; 3M Co.; Fujitsu Limited; Luxshare Precision Industry Co. Ltd.; Kyocera Corporation; TE Connectivity Ltd.; Amphenol Corporation; Molex LLC.; Phoenix Contact GmbH and Co KG.; ITT Inc.; Japan Aviation Electronics Industry Ltd.; Panduit Corp.; Hirose Electric Co Ltd.; Wurth Elektronik GmbH and Co KG.; Harting Technology Group; Lemo SA; Samtec Inc.; Smiths Interconnect Inc.; AVX Corporation; Glenair; Souriau SAS; ERNI Deutschland GmbH; Rosenberger Group; I-PEX Inc.; Omnetics Connector Corporation; JST MFG Co Ltd.; Nicomatic SA; Advanced Interconnections Corp
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
• Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time Series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
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