PUBLISHER: The Business Research Company | PRODUCT CODE: 1927064
PUBLISHER: The Business Research Company | PRODUCT CODE: 1927064
Organic substrate packaging material stands as a highly dependable and intricately designed element within semiconductor packaging, serving as a foundational layer in semiconductor construction.
The technology associated with organic substrate packaging material encompasses various package types like small outline (SO), grid array (GA), flat no-leads packages, quad flat packages (QFP), dual in-line packages (DIP), and others. For instance, a small outline package constitutes a surface-mounted component with pins positioned on both sides of its body. These technologies find applications across diverse sectors including consumer electronics, automotive, manufacturing, healthcare, and more, catering to end-uses such as mobile phones, flat panel displays (FPD), and various other applications.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
Tariffs are influencing the organic substrate packaging material market by increasing costs of imported resins, copper foils, glass fibers, and advanced fabrication equipment. Asia-Pacific regions such as Taiwan, South Korea, and China are most affected due to their central role in semiconductor packaging, while North America faces higher procurement costs. These tariffs are raising packaging costs and impacting semiconductor pricing. However, they are also driving regional capacity expansion, local material sourcing, and innovation in next-generation substrate technologies.
The organic substrate packaging material market research report is one of a series of new reports from The Business Research Company that provides organic substrate packaging material market statistics, including organic substrate packaging material industry global market size, regional shares, competitors with a organic substrate packaging material market share, detailed organic substrate packaging material market segments, market trends and opportunities, and any further data you may need to thrive in the organic substrate packaging material industry. This organic substrate packaging material market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The organic substrate packaging material market size has grown strongly in recent years. It will grow from $15.44 billion in 2025 to $16.37 billion in 2026 at a compound annual growth rate (CAGR) of 6.0%. The growth in the historic period can be attributed to growth of consumer electronics manufacturing, expansion of semiconductor fabrication capacity, increasing demand for compact electronic devices, rising adoption of integrated circuits, improvements in substrate material technologies.
The organic substrate packaging material market size is expected to see strong growth in the next few years. It will grow to $20.3 billion in 2030 at a compound annual growth rate (CAGR) of 5.5%. The growth in the forecast period can be attributed to increasing investments in advanced packaging technologies, rising adoption of electric and autonomous vehicles, expansion of high-performance computing applications, growing demand for chip miniaturization, increasing integration of ai-enabled semiconductor devices. Major trends in the forecast period include increasing adoption of advanced semiconductor packaging, rising demand for high-density interconnect substrates, growing use in automotive electronics, expansion of miniaturized electronic devices, enhanced focus on thermal and electrical performance.
The increasing adoption of self-driving vehicles is expected to propel the organic substrate packaging material market growth going forward. Self-driving vehicles, also known as autonomous cars, are capable of sensing their surroundings and operating without human interaction. These vehicles rely heavily on semiconductors to process and interpret the captured data. The growing use of semiconductors is driving demand for advanced packaging solutions, which in turn increases the need for organic substrate packaging materials. For instance, in September 2024, according to S&P Global Mobility, Autonomy Forecasts, a US-based automotive intelligence and data company, sales of autonomous vehicles in the US are projected to grow gradually, with approximately 230,000 autonomous light vehicles expected to be sold by 2034 as part of mobility-as-a-service offerings. Therefore, the increasing adoption of self-driving vehicles is driving growth in the organic substrate packaging material market.
Major companies in the organic substrate packaging material market are concentrating on innovative solutions, such as biodegradable materials and eco-friendly laminations, to meet the growing demand for sustainable packaging options that enhance product safety and environmental responsibility. The Ultra C vac-p flux cleaning tool is a vacuum-based technology designed to efficiently remove flux residues from chip structures in fan-out panel-level packaging (FOPLP), ensuring optimal cleanliness for advanced semiconductor packaging processes. For instance, in July 2024, ACM Research, Inc., a US-based semiconductor company, launched the Ultra C vac-p flux cleaning tool for FOPLP. Utilizing vacuum technology, the new tool efficiently removes flux residues from chiplet structures. ACM also announced that it received a purchase order from a major China-based semiconductor manufacturer. ACM's Ultra C vac-p represents a significant advancement in addressing the cleaning challenges associated with next-generation advanced packaging technologies.
In May 2023, TIPA Compostable Packaging, an Israel-based producer of flexible compostable and sustainable packaging solutions, acquired Bio4Pack for an undisclosed amount. With this acquisition, TIPA aimed to broaden its product portfolio and strengthen its footprint in European markets by integrating Bio4Pack's compostable films, laminates, bags, and trays into its offering. Bio4Pack is a Germany-based manufacturer of compostable and bio-based packaging materials for food, retail, and consumer-goods applications.
Major companies operating in the organic substrate packaging material market are Amkor Technology, Incorporated, Advanced Semiconductor Engineering, Incorporated, Shinko Electric Industries, Co., Ltd., Showa Denko, K.K., Kyocera Corporation, WUS Printed Circuit, Co., Ltd., Unimicron Technology Corporation, Ibiden Co., Ltd., AT&S Austria Technologie & Systemtechnik, Aktiengesellschaft, Samsung Electro-Mechanics Co., Ltd., Nippon Mektron, Ltd., Tripod Technology Corporation, Compeq Manufacturing Co., Ltd., HannStar Board Corporation, Kingboard Chemical Holdings Limited, Sumitomo Bakelite Co., Ltd., Panasonic Corporation, Rogers Corporation, Shenzhen Kinwong Electronic Co., Ltd., Unitech Printed Circuit Board Corporation, Young Poong Electronics Co., Ltd., CMK Corporation, Daeduck GDS Co., Ltd., Dynamic Electronics Co., Ltd., Flexium Interconnect, Inc., Interflex Co., Ltd., LG Innotek Co., Ltd.
Asia-Pacific was the largest region in the organic substrate packaging material market share in 2025. North America was the second-largest region in the organic substrate packaging material market. The regions covered in the organic substrate packaging material market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa
The countries covered in the organic substrate packaging material market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain
The organic substrate packaging material market consists of sales of integrated circuit packaging, flip-chip scale packaging, and high-density multilayers. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
Organic Substrate Packaging Material Market Global Report 2026 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.
This report focuses organic substrate packaging material market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
Where is the largest and fastest growing market for organic substrate packaging material ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The organic substrate packaging material market global report from the Business Research Company answers all these questions and many more.
The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.
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