PUBLISHER: The Business Research Company | PRODUCT CODE: 1927120
PUBLISHER: The Business Research Company | PRODUCT CODE: 1927120
Polyamide hot melt adhesives are thermoplastic adhesives derived from polyamide resins, which are created from dimer acids and diamines. Renowned for their strong bonding capabilities, flexibility, and heat resistance, these adhesives are well-suited for a wide range of industrial uses. Their ability to withstand high temperatures while resisting moisture and chemicals adds to their significant value.
The primary types of polyamide hot melt adhesives include granules, powder, and others. Granular polyamide hot melt adhesives consist of small, bead-like polyamide adhesive particles specifically formulated for hot melt applications. They come in various forms, including thermosetting and thermoplastic types, and are utilized in several sectors such as footwear and textiles, automotive, electrical, woodworking, and more.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
Tariffs have impacted the polyamide hot melt adhesives market by raising costs of imported resins and specialized processing materials, affecting pricing across industrial applications. Automotive, footwear, and electrical segments are most affected, particularly in asia pacific and north america where manufacturing volumes are high. On the positive side, tariffs are driving local sourcing of adhesive raw materials and encouraging regional production facilities to improve supply chain resilience.
The polyamide hot melt adhesives market research report is one of a series of new reports from The Business Research Company that provides polyamide hot melt adhesives market statistics, including polyamide hot melt adhesives industry global market size, regional shares, competitors with a polyamide hot melt adhesives market share, detailed polyamide hot melt adhesives market segments, market trends and opportunities, and any further data you may need to thrive in the polyamide hot melt adhesives industry. This polyamide hot melt adhesives market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The polyamide hot melt adhesives market size has grown strongly in recent years. It will grow from $0.66 billion in 2025 to $0.7 billion in 2026 at a compound annual growth rate (CAGR) of 5.6%. The growth in the historic period can be attributed to growth of footwear manufacturing, expansion of woodworking industries, demand for durable bonding materials, adoption of thermoplastic adhesives, industrial automation growth.
The polyamide hot melt adhesives market size is expected to see strong growth in the next few years. It will grow to $0.87 billion in 2030 at a compound annual growth rate (CAGR) of 5.6%. The growth in the forecast period can be attributed to rising electric vehicle production, increased demand for lightweight bonding solutions, growth in electronics manufacturing, shift toward solvent free adhesives, expansion of automated assembly lines. Major trends in the forecast period include growing use in automotive assembly, rising demand for high heat resistant adhesives, expansion in footwear and textile bonding, increased adoption in electrical components, focus on faster setting adhesive solutions.
The rising demand for consumer electronics is projected to drive the growth of the polyamide hot melt adhesives market in the coming years. Consumer electronics encompass devices designed for everyday use, reflecting advancements in technology, increased internet connectivity, and the widespread adoption of smart devices to meet diverse consumer needs. Polyamide hot melt adhesives offer high thermal stability, excellent electrical insulation, and strong, durable bonds that endure mechanical stress and temperature changes, ensuring reliable and long-lasting assembly of components. For example, in May 2023, the Japan Electronics and Information Technology Industries Association reported that total electronic equipment production in Japan reached 771,457 units. Furthermore, consumer electronics production in May 2023 rose to 32,099 units from 25,268 units in May 2022. Thus, the growing demand for consumer electronics is fueling the polyamide hot melt adhesives market.
Key players in the polyamide hot melt adhesives market are developing hot melt label adhesive solutions to enhance durability, performance, and versatility across various labeling applications. These adhesives are activated by heat to apply labels effectively. For instance, in April 2023, Avery Dennison and Dow, a U.S.-based materials science and digital identification company, introduced an innovative hot melt label adhesive designed to improve packaging recyclability. This adhesive facilitates the mechanical recycling of polyolefin filmic labels and polypropylene (PP) or polyethylene (PE) packaging in a single stream, treating them as a mono-material. It is the first olefinic hot melt adhesive specifically designed for chilled food applications within the labeling market and has received Recyclass approval for recycling in the high-density polyethylene (HDPE) colored stream in European markets.
In May 2025, Lisheng, a China-based specialty chemical manufacturer, partnered with ADINO Group GmbH to create a joint venture named Shandong ADINO New Materials Co. Through this partnership, Lisheng and ADINO seek to advance high-performance hot melt adhesive technologies, particularly polyamide (PA) hot melt adhesives, by integrating Lisheng's manufacturing expertise and local market presence with ADINO's proprietary adhesive formulations, thereby improving product performance for demanding industrial applications. ADINO Group GmbH is a Germany-based adhesives technology company focused on the development of advanced adhesive solutions and high-performance hot melt systems.
Major companies operating in the polyamide hot melt adhesives market are BASF SE, Henkel AG & Co. KGaA, H.B. Fuller Company, Arkema S.A., DuPont, Evonik Industries, Huntsman Corporation, 3M Company, Bostik, Beardow Adams Ltd., Jowat SE, Buhnen GmbH & Co. KG, Palmetto Adhesives Company, Schaetti, Sipol, Shanghai Tianyang Hot Melt Adhesive Co., Ltd., Huate Bonding Material, Avery Dennison Corporation, Paramelt B.V., Tex Year Industries Inc., Nan Pao Resins Chemical Co., Ltd., DELO Industrie Klebstoffe GmbH & Co. KGaA
Asia-Pacific was the largest region in the polyamide hot melt adhesives market in 2025, and is expected to be the fastest-growing region in the forecast period. The regions covered in the polyamide hot melt adhesives market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa
The countries covered in the polyamide hot melt adhesives market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain
The polyamide hot melt adhesives market consists of sales of aliphatic polyamide, aromatic polyamide, semi-aromatic polyamide, and modified polyamide. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
Polyamide Hot Melt Adhesives Market Global Report 2026 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.
This report focuses polyamide hot melt adhesives market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
Where is the largest and fastest growing market for polyamide hot melt adhesives ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The polyamide hot melt adhesives market global report from the Business Research Company answers all these questions and many more.
The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.
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