Picture

Questions?

+1-866-353-3335

SEARCH
What are you looking for?
Need help finding what you are looking for? Contact Us
Compare

PUBLISHER: TECHCET | PRODUCT CODE: 1413697

Cover Image

PUBLISHER: TECHCET | PRODUCT CODE: 1413697

Sputter Targets Market Report (a Critical Materials Report) 2023-2024

PUBLISHED:
PAGES: 228 Pages
DELIVERY TIME: 1-2 business days
SELECT AN OPTION
PDF (Single User License)
USD 8900
PDF (2-User License)
USD 15575
PDF (3-5 User License)
USD 20025

Add to Cart

This report covers the sputtering targets and supply-chain for key metals used in semiconductor device fabrication. The report contains data and analysis from TECHCET's data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. Sputtering targets are critical in semiconductor manufacturing as sputtering allows the deposition of different materials to form interconnects, barriers layers, and other films for semiconductor devices, MEMS, and sensors.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. TARGET BUSINESS-MARKET OVERVIEW
  • 1.2. TARGET MARKET TRENDS IMPACTING 2023 OUTLOOK
  • 1.3. TECHNOLOGY TRENDS
  • 1.4. TARGET MARKET FORECAST
  • 1.5. COMPETITIVE LANDSCAPE
  • 1.6. EHS ISSUES/CONCERNS
  • 1.7. TARGET MARKET ASSESSMENT

2. SCOPE, PURPOSE AND METHODOLOGY

  • 2.1. SCOPE
  • 2.2. PURPOSE
  • 2.3. METHODOLOGY
  • 2.4. OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3. SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK

  • 3.1. WORLDWIDE ECONOMY AND OUTLOOK
    • 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
    • 3.1.2. TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
    • 3.1.3. SEMICONDUCTOR SALES GROWTH
  • 3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
    • 3.2.1. SMARTPHONES
    • 3.2.2. PC UNIT SHIPMENTS
    • 3.2.3. SERVERS / IT MARKET
  • 3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
    • 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
    • 3.3.2. WW FAB EXPANSION DRIVING GROWTH
    • 3.3.3. EQUIPMENT SPENDING TRENDS
    • 3.3.4. TECHNOLOGY ROADMAPS
    • 3.3.5. FAB INVESTMENT ASSESSMENT
  • 3.4. POLICY & TRADE TRENDS AND IMPACT
  • 3.5. SEMICONDUCTOR MATERIALS OVERVIEW
    • 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
    • 3.5.2. LOGISTICS ISSUES EASED DOWN
    • 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2027
    • 3.5.4. TECHCET'S MATERIAL FORECAST

4. SPUTTERING TARGET MARKET LANDSCAPE AND FORECAST

  • 4.1. CY2023 MARKET LANDSCAPE HIGHLIGHTS
  • 4.2. MARKET STATISTICS & FORECASTS
  • 4.3. FORECAST METHODOLOGY
    • 4.3.1. TARGET MARKET FORECAST
    • 4.3.2. 2023 TARGET MARKET SIZE BY TYPE
    • 4.3.3. ESTIMATE FOR PRECIOUS METAL TARGET MARKET
    • 4.3.4. TOTAL SPUTTERING TARGET MARKET FORECAST
    • 4.3.5. COPPER MARKET FORECAST
    • 4.3.6. TANTALUM MARKET FORECAST
    • 4.3.7. ALUMINUM MARKET FORECAST
    • 4.3.8. TITANIUM MARKET FORECAST
    • 4.3.9. NIV, AL, AG, AU, TI TARGETS USED IN POWER DEVICES-WIDE BAND GAP DEVICES
    • 4.3.10. TARGET METAL FORECAST BY POWER DEVICE TYPE
    • 4.3.11. TARGET METAL FORECAST FOR SIC AND GAN POWER DEVICES
  • 4.4. SUPPLIER MARKET SHARE AND ACTIVITY
    • 4.4.1. TARGET SUPPLIER UPDATES-1 OF 3
    • 4.4.2. TARGET COMPANY UPDATES-2 OF 3
    • 4.4.3. RUTHENIUM TARGET SUPPLIERS
  • 4.5. COMMENT ON REGIONAL TRENDS/DRIVERS
    • 4.5.1. REGIONAL TRENDS AND ISSUES
    • 4.5.2. SPUTTERING TARGET PRODUCTION LOCATIONS-REGIONAL TRENDS
    • 4.5.3. REGIONAL MARKET SIZE AND TRENDS
  • 4.6. METAL TARGET COST STRUCTURE
  • 4.7. EHS/SUSTAINABILITY, REGULATIONS, AND LOGISTIC ISSUES
  • 4.8. M&A ACTIVITY AND PARTNERSHIPS
  • 4.9. PLANT CLOSURES-NONE
  • 4.10. NEW ENTRANTS-NONE
  • 4.11. RISKS & DISCONTINUATIONS
  • 4.12. TECHCET ANALYST ASSESSMENT OF TARGET SUPPLIERS AND MARKET

5. SUB-TIER SUPPLY-CHAINS

  • 5.1. COPPER (CU) METAL-RAW MATERIAL
    • 5.1.1. CU METAL- RAW MATERIAL SUPPLY CHAIN
    • 5.1.2. CU METAL-MARKET DEMAND
    • 5.1.3. CU DEMAND IN VEHICLES
    • 5.1.4. LME CU METAL PRICING
  • 5.2. TANTALUM (TA)-RAW MATERIAL
    • 5.2.1. TA METAL-MINING SUPPLY CHAIN TRENDS
    • 5.2.2. TA METAL-GLOBAL DEMAND
    • 5.2.3. TA METAL-CLOSED MARKET ECONOMICS
  • 5.3. ALUMINUM (AL) METAL-BAUXITE AND ALUMINA MINING
    • 5.3.1. AL METAL-SMELTING
    • 5.3.2. AL METAL-GLOBAL DEMAND
    • 5.3.3. LME AL METAL PRICING
  • 5.4. TITANIUM (TI) METAL- TI MINERAL CONCENTRATE
    • 5.4.1. TI MINERAL CONCENTRATE PRICING
    • 5.4.2. TI METAL-MILL PRODUCT DEMAND
    • 5.4.3. TI METAL-SPONGE PRODUCTION AND CAPACITY
    • 5.4.4. TI METAL-SPONGE PRODUCTION AND CAPACITY
    • 5.4.5. TI METAL MARKET TRENDS-RUSSIA/UKRAINE CONFLICT
    • 5.4.6. TI METAL-TI SPONGE FOR SEMICONDUCTOR
    • 5.4.7. TI METAL- TI SPONGE PRODUCTION ACTIVITY IN CHINA
  • 5.5. TUNGSTEN (W) METAL-MINING
    • 5.5.1. W METAL-GLOBAL DEMAND
    • 5.5.2. W SUPPLY CHAIN AND CHINA
    • 5.5.3. W METAL-HIGH PURITY W POWDER SUPPLIERS
    • 5.5.4. W METAL PRICING
  • 5.6. COBALT (CO) METAL-MINING
    • 5.6.1. CO METAL-DEMAND
    • 5.6.2. CO METAL PRICING
  • 5.7. MOLYBDENUM (MO) METAL-MINING
    • 5.7.1. GENERALIZATION OF MO SUPPLY CHAIN
    • 5.7.2. MO APPLICATIONS
  • 5.8. PRECIOUS METALS-GOLD (AU) MINING PRODUCTION
    • 5.8.1. PRECIOUS METALS-SILVER (AG) MINING
    • 5.8.2. PRECIOUS METALS CONSUMPTION BY APPLICATIONS
    • 5.8.3. PRECIOUS METAL SUPPLY/DEMAND TRENDS
    • 5.8.4. PRECIOUS METAL PRICING
    • 5.8.5. PRECIOUS METAL PRICING
    • 5.8.6. HIGH-PURITY MANGANESE (MN)
  • 5.9. SUB-TIER SUPPLY-CHAIN: DISRUPTIONS
  • 5.10. SUB-TIER SUPPLY-CHAIN M&A ACTIVITY
  • 5.11. SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
  • 5.12. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT
    • 5.12.1. SPUTTER TARGETS SUB-TIER MARKET ASSESSMENT

6. TECHNICAL DRIVERS/MATERIAL CHANGES AND TRANSITIONS

  • 6.1. 300 MM TARGET MARKET SEGMENT DRIVERS DEVICES
    • 6.1.1. 200 MM TARGET MARKET SEGMENT DRIVERS
    • 6.1.2. LOGIC-GENERAL PROCESS FLOW LOGIC PVD 10 NM & BELOW
    • 6.1.3. GENERAL PROCESS FLOW ADVANCED DRAM
  • 6.2. NEW DEVELOPMENTS IN THE TECHNOLOGY OR MARKETS: UNIVERSITY AND SUPPLIER R&D IN 5-7 YEARS
    • 6.2.1. POWER RAIL
    • 6.2.2. SPECIALTY (STT MRAM, FE RAM, OTHER) MEMORY PVD MATERIALS
    • 6.2.3. PIEZOELECTRIC MATERIALS-PZT

7. SUPPLIER PROFILES

  • FURUYA METAL CO.
  • GO ELEMENT
  • GRIKIN
  • HONEYWELL
  • HUIZHOU TOP METAL MATERIAL (TOPM)
  • ...and 15+ more

8. APPENDICES

TABLE OF FIGURES

  • FIGURE 1: TOTAL SPUTTERING TARGET MARKET REVENUES
  • FIGURE 2: SEMICONDUCTOR TARGET MARKET FORECAST
  • FIGURE 3: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2022)
  • FIGURE 4: 3-MONTH AVERAGE MONTHLY SALES FROM TAIWAN (TSMC, UMC, VIS, ASE GLOBAL, CHIPMOS, KYEC)
  • FIGURE 5: WORLDWIDE SEMICONDUCTOR SALES
  • FIGURE 6: 2022 SEMICONDUCTOR CHIP APPLICATIONS
  • FIGURE 7: MOBILE PHONE SHIPMENTS WW ESTIMATES
  • FIGURE 8: WORLDWIDE PC AND TABLET FORECAST
  • FIGURE 9: ELECTRIFICATION TREND BY WORLD REGION
  • FIGURE 10: SEMICONDUCTOR AUTOMOTIVE PRODUCTION
  • FIGURE 11: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40B
  • FIGURE 12: CHIP EXPANSIONS 2022-2027 US $366B
  • FIGURE 13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 14: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (US$ B)
  • FIGURE 15: OVERVIEW OF ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP
  • FIGURE 16: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
  • FIGURE 17: EUROPE CHIP EXPANSION UPSIDE
  • FIGURE 18: PORT OF LA
  • FIGURE 19: TECHCET WAFER START FORECAST BY NODE
  • FIGURE 20: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK
  • FIGURE 21: SPUTTERING TARGET MARKET FORECAST
  • FIGURE 22: ESTIMATED 2023 SPUTTERING TARGET MARKET SIZE BY MATERIAL SEGMENT (IN US$ MILLIONS)
  • FIGURE 23: PRECIOUS METAL TARGET FORECAST (AFTER PRECIOUS METAL VALUE PASS THROUGH)
  • FIGURE 24: TOTAL METAL TARGET FORECAST (AFTER PRECIOUS METAL VALUE PASS THROUGH
  • FIGURE 25: SPUTTERING TARGET MARKET FORECAST
  • FIGURE 26: ESTIMATE OF 2022 CU TARGET SALE BY TYPE
  • FIGURE 27: ESTIMATE CU AND TA TARGETS SALES BY LOGIC NODE
  • FIGURE 28: TA SPUTTERING TARGET MARKET FORECAST
  • FIGURE 29: AL SPUTTERING TARGET MARKET FORECAST
  • FIGURE 30: TI SPUTTERING TARGET MARKET FORECAST
  • FIGURE 31: 2022 POWER DEVICE TARGET MARKET SIZE
  • FIGURE 32: 2027 FORECASTED POWER DEVICE MARKET SIZE
  • FIGURE 33: 2022 TARGET MARKET SIZE FOR SIC AND GAN POWER DEVICES
  • FIGURE 34: 2027 FORECASTED TARGET MARKET SIZE FOR SIC AND GAN POWER DEVICES
  • FIGURE 35: EST. 2022 SUPPLIER MARKET SHARE(EXCLUDING PRECIOUS METALS)
  • FIGURE 36: 2022 REGIONAL SHARE (AS A % OF TOTAL TARGET DEMAND BY USD)
  • FIGURE 37: 2021 EST. GLOBAL CU MINE PRODUCTION 21 MILLION MT
  • FIGURE 38: 2022 EST. GLOBAL REFINED CU CONSUMPTION 25 MILLION MT
  • FIGURE 39: ESTIMATE COPPER CONSUMPTION BY VEHICLE TYPE (KG PER VEHICLE)
  • FIGURE 40: LME CU PRICE CHART
  • FIGURE 41: 2022 EST. TANTALUM MINE PRODUCTION 2000 MT
  • FIGURE 42: 2021 TANTALUM APPLICATION (~2,200 T)
  • FIGURE 43: EST. WORLD BAUXITE MINING PRODUCTION 2022 380 MILLION MT
  • FIGURE 44: EST. WORLD ALUMINUM SMELTING PRODUCTION 2022 69 MILLION MT
  • FIGURE 45: EST. 2022 GLOBAL AL DEMAND 96 MILLION MT
  • FIGURE 46: LME AL PRICE CHART
  • FIGURE 47: EST. GLOBAL TI CONCENTRATE MINING PRODUCTION -2022 9,500 MILLION MT
  • FIGURE 48: TI MINERAL CONCENTRATE PRICING
  • FIGURE 49: EST. GLOBAL 2020 TI MILL PRODUCT OUTPUT, ~175,000 MT
  • FIGURE 50: EST. GLOBAL TI SPONGE PRODUCTION-2022 260,000 THOUSAND MT
  • FIGURE 51: EST. GLOBAL TI SPONGE CAPACITY-2022 350,000 THOUSAND MT
  • FIGURE 52: EST. 2022 W MINE PRODUCTION 84,000 T
  • FIGURE 53: W PRICE CHART
  • FIGURE 54: EST. 2022 CO MINE PRODUCTION 190,000 MT
  • FIGURE 55: EST. 2020 GLOBAL CO DEMAND 175,000 MT
  • FIGURE 56: LME CO METAL PRICE CHART
  • FIGURE 57: EST. 2021 MOLYBDENUM MINING PRODUCTION, 300,000 METRIC TONS
  • FIGURE 58: GENERALIZATION OF MO SUPPLY CHAIN
  • FIGURE 59: EST 2020 MOLYBDENUM USE BY APPLICATION
  • FIGURE 60: 2022 AU MINING PRODUCTION 3,100 MT
  • FIGURE 61: 2022 AG MINING PRODUCTION ~26,000 MT
  • FIGURE 62: GOLD METAL PRICE CHARTS
  • FIGURE 63: SILVER METAL PRICE CHARTS
  • FIGURE 64: PALLADIUM METAL PRICE CHARTS
  • FIGURE 65: PLATINUM METAL PRICE CHARTS
  • FIGURE 66: 3DNAND
  • FIGURE 67: BURIED POWER RAIL STRUCTURE
  • FIGURE 68: MRAM DEVICE STRUCTURE
  • FIGURE 69: CHALCOGENIDE MEMORY ROADMAP (SK HYNIX)

TABLES

  • TABLE 1: CHINA'S INTERESTS IN MINING AND REFINING THAT RELATE TO SEMICONDUCTOR SPUTTER TARGET METALS
  • TABLE 2: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
  • TABLE 3: IMF ECONOMIC OUTLOOK*
  • TABLE 4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2022
  • TABLE 5: WIDE BAND GAP (WBG) SEGMENT REVENUES AND CAGRS
  • TABLE 6: ESTIMATED NUMBER OF TARGETS BY POWER DEVICE TYPE 2022 (# OF 200 MM TARGETS, WITH SIC EXPRESSED AS 150MM)
  • TABLE 7: RUTHENIUM TARGET SUPPLIERS
  • TABLE 8: SPUTTERING TARGET SUPPLIER MANUFACTURING LOCATIONS
  • TABLE 9: REGIONAL SPUTTERING MARKETS
  • TABLE 10: ESTIMATED TARGET COST STRUCTURE (FOR REFERENCE ONLY)
  • TABLE 11: PRECIOUS METAL CONSUMPTION BY APPLICATION
  • TABLE 12: LOGIC PVD APPLICATIONS
  • TABLE 13: 3DNAND PVD APPLICATIONS
  • TABLE 14: DRAM PVD APPLICATIONS
  • TABLE 15: PHASE CHANGE MATERIAL TARGET SUPPLIERS
  • TABLE 16: MRAM TARGET SUPPLIERS
Have a question?
Picture

Jeroen Van Heghe

Manager - EMEA

+32-2-535-7543

Picture

Christine Sirois

Manager - Americas

+1-860-674-8796

Questions? Please give us a call or visit the contact form.
Hi, how can we help?
Contact us!