2025 Global AI Data Center Interconnect Trends

Table of Contents

1. Introduction

• Shipments of Optical Transceiver Modules in 2025 Have Shown Growth for High-Spec 800G and 1.6T Modules

2. AI Data Center Architectures Are Transitioning from Single-Node Designs to a Hierarchical Collaborative Interconnection Model, Encompassing Scale-Up, Scale-Out, and Scale-Across Architectures

• Examples of Scale-Up, Scale-Out, and Scale-Across Interconnect Technologies
• Comparison of Three Major Expansion Architectures for Data Center Networks

3. Rising Demand for High-Bandwidth, Low-Loss Communication Drives Optical Solutions to Replace Copper Wires as Mainstream Interconnects Within Racks and Between Data Centers

• Optical Communication Modules Are Evolving from Pluggable Forms to ASIC Chips and Will Ultimately Achieve Co-Packaging of Optical Components and ASICs
• Supply Chain for Integration of Semiconductor Components, Optical Communication Components, and Computing Equipment in Taiwan

4. Future Competitive Landscape: NVIDIA and Broadcom Will Respectively Focus on Ecosystem Integration and Modularization, Driving Growth in Data Center Interconnect Market

• NVIDIA vs. Broadcom: Comparison of Data Center Interconnect Technologies and Products

5. Market Competition Will Expand from Chip Performance to Development of Systems and Ecosystem Platforms; Enhanced Data Transmission Efficiency Is the Key to Future Success