Asia Pacific Radiation-Hardened Electronics Market Forecast to 2028 - COVID-19 Impact and Regional Analysis - by Component, Manufacturing Technique, and Application

List of Tables

The APAC radiation-hardened electronics market is expected to grow from US$ 250.30 million in 2021 to US$ 366.01 million by 2028; it is estimated to grow at a CAGR of 5.6% from 2021 to 2028.

The increase in demand for radiation-hardened electronics by the end-use industries has influenced manufacturers to invest in product development. Some of the major players operating in the market include BAE Systems; Microchip Technology Inc.; Texas Instruments Incorporated; Renesas Electronics Corporation; and Xilinx, Inc. Some of the recent product developments across the region have taken place in recent years. For instance, in October 2021, VORAGO Technologies announced the Arm Cortex-M4 VA41628 and VA41629, 2 new radiation-hardened microcontrollers designed to give flexibility in space-based missions for the aerospace and defense sector. Consumers of the product will be able to upgrade from previous generations of rad-hard arm microcontrollers with functional compatibility and a more powerful entry-level M4 core and scale up to more highly integrated M4 core options with code compatibility owing to the new product additions to VORAGO's M4 family. Further, Renesas Electronics Corporation introduced a new radiation-hardened 16-channel current driver with an integrated 4-bit decoder in May 2019 to help satellite command and telemetry systems reduce their size, weight, and power (SWaP). The ISL72814SEH combines the decoder, input level shifter, and 16 current driver arrays in a single monolithic IC. For Medium Earth Orbit (MEO), Geosynchronous Earth Orbit (GEO), Highly Elliptical Orbit (HEO), and deep space mission profiles, the device allows satellite designers to considerably boost system capacity while reducing solution footprint by 50%. The rise in investment in product development by the radiation-hardened electronic manufacturers is expected to contribute to the growth of the radiation-hardened electronics market over the forecast period.

With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the APAC radiation-hardened electronics market. The APAC radiation-hardened electronics market is expected to grow at a good CAGR during the forecast period.

APAC Radiation-Hardened Electronics Market Revenue and Forecast to 2028 (US$ Million)

APAC Radiation-Hardened Electronics Market Segmentation

The APAC radiation-hardened electronics market is segmented based on component, manufacturing technique, application, and country. Based on component, the market is segmented into power management components, analog and digital mixed signal devices, memory, and controllers & processors. The power management component segment dominated the market in 2021 and is expected to be the fastest-growing segment during the forecast period. Based on manufacturing technique, the market is segmented into radiation hardening by design (RHBD) and radiation hardening by process (RHBP). The radiation hardening by design (RHBD) segment dominated the market in 2021. It is anticipated to be the fastest-growing segment during the forecast period. Based on application, the market is segmented into aerospace & defense, nuclear power plant, space, and others. The space segment dominated the market in 2021, and the others segment is expected to be the fastest-growing segment during the forecast period. Based on country, the APAC radiation-hardened electronics market is segmented into Australia, China, India, Japan, South Korea, and the Rest of APAC.

BAE Systems; Data Device Corporation; Honeywell International Inc.; Infineon Technologies AG; Microchip Technology Inc.; Renesas Electronics Corporation; STMicroelectronics; Texas Instruments Incorporated; VORAGO Technologies; and Xilinx, Inc. (AMD) are among the leading companies in the APAC radiation-hardened electronics market.

Reasons to Buy:

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the APAC radiation-hardened electronics market.
Highlights key business priorities in order to assist companies to realign their business strategies
The key findings and recommendations highlight crucial progressive industry trends in the APAC radiation-hardened electronics market, thereby allowing players across the value chain to develop effective long-term strategies
Develop/modify business expansion plans by using substantial growth offering developed and emerging markets
Scrutinize in-depth APAC market trends and outlook coupled with the factors driving the radiation-hardened electronics market, as well as those hindering it
Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing, and distribution

Product Code: BMIRE00025597

1. Introduction

1.1 Study Scope
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation

2. Key Takeaways

3. Research Methodology

3.1 Coverage
3.2 Secondary Research
3.3 Primary Research

4. APAC Radiation-Hardened Electronics Market Landscape

4.1 Market Overview
4.2 APAC PEST Analysis
4.3 Ecosystem Analysis

5. APAC Radiation-Hardened Electronics Market - Key Market Dynamics

5.1 Market Drivers
- 5.1.1 Rising Adoption of Radiation-Hardened Electronics
- 5.1.2 Increasing Investment in Space Programs
5.2 Market Restraints
- 5.2.1 High Complexity in Designing Radiation-Hardened Electronics
5.3 Market Opportunities
- 5.3.1 Increasing Investment in Product Development by Major Players
5.4 Future Trends
- 5.4.1 Rising Adoption of radiation-hardened electronics for Medical Applications
5.5 Impact Analysis of Drivers and Restraints

6. Radiation-Hardened Electronics Market - APAC Analysis

6.1 APAC Radiation-Hardened Electronics Market Overview
6.2 APAC Radiation-Hardened Electronics Market Revenue Forecast and Analysis

7. APAC Radiation-Hardened Electronics Market Analysis - By Component

7.1 Overview
7.2 APAC Radiation-Hardened Electronics Market, by Component (2020 and 2028)
7.3 Power Management Components
- 7.3.1 Overview
- 7.3.2 Power Management Components: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
7.4 Analog and Digital Mixed Signal Devices
- 7.4.1 Overview
- 7.4.2 Analog and Digital Mixed Signal Devices: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
7.5 Memory
- 7.5.1 Overview
- 7.5.2 Memory: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
7.6 Controllers and Processors
- 7.6.1 Overview
- 7.6.2 Controllers and Processors: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)

8. APAC Radiation-Hardened Electronics Market Analysis - By Manufacturing Technique

8.1 Overview
8.2 APAC Radiation-Hardened Electronics Market, by Manufacturing Technique (2020 and 2028)
8.3 Radiation Hardening by Design (RHBD)
- 8.3.1 Overview
- 8.3.2 Radiation Hardening by Design (RHBD): Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
8.4 Radiation Hardening by Process (RHBP)
- 8.4.1 Overview
- 8.4.2 Radiation Hardening by Process (RHBP): Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)

9. APAC Radiation-Hardened Electronics Market Analysis - by Application

9.1 Overview
9.2 APAC Radiation-Hardened Electronics Market, by Application (2020 and 2028)
9.3 Aerospace & Defense
- 9.3.1 Overview
- 9.3.2 Aerospace & Defense: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
9.4 Nuclear Power Plant
- 9.4.1 Overview
- 9.4.2 Nuclear Power Plant: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
9.5 Space
- 9.5.1 Overview
- 9.5.2 Space: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)
9.6 Others
- 9.6.1 Overview
- 9.6.2 Others: Radiation-Hardened Electronics Market Revenue and Forecast To 2028 (US$ Million)

10. APAC Radiation-Hardened Electronics Market - Country Analysis

10.1 Overview
- 10.1.1 APAC: Radiation-Hardened Electronics Market, by Key Country
  - 10.1.1.1 Australia: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
    - 10.1.1.1.1 Australia: Radiation-Hardened Electronics Market, by Component
    - 10.1.1.1.2 Australia: Radiation-Hardened Electronics Market, by Manufacturing Technique
    - 10.1.1.1.3 Australia: Radiation-Hardened Electronics Market, by Application
  - 10.1.1.2 China: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
    - 10.1.1.2.1 China: Radiation-Hardened Electronics Market, by Component
    - 10.1.1.2.2 China: Radiation-Hardened Electronics Market, by Manufacturing Technique
    - 10.1.1.2.3 China: Radiation-Hardened Electronics Market, by Application
  - 10.1.1.3 India: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
    - 10.1.1.3.1 India: Radiation-Hardened Electronics Market, by Component
    - 10.1.1.3.2 India: Radiation-Hardened Electronics Market, by Manufacturing Technique
    - 10.1.1.3.3 India: Radiation-Hardened Electronics Market, by Application
  - 10.1.1.4 Japan: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
    - 10.1.1.4.1 Japan: Radiation-Hardened Electronics Market, by Component
    - 10.1.1.4.2 Japan: Radiation-Hardened Electronics Market, by Manufacturing Technique
    - 10.1.1.4.3 Japan: Radiation-Hardened Electronics Market, by Application
  - 10.1.1.5 South Korea: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
    - 10.1.1.5.1 South Korea: Radiation-Hardened Electronics Market, by Component
    - 10.1.1.5.2 South Korea: Radiation-Hardened Electronics Market, by Manufacturing Technique
    - 10.1.1.5.3 South Korea: Radiation-Hardened Electronics Market, by Application
  - 10.1.1.6 Rest of APAC: Radiation-Hardened Electronics Market - Revenue and Forecast to 2028 (US$ Million)
    - 10.1.1.6.1 Rest of APAC: Radiation-Hardened Electronics Market, by Component
    - 10.1.1.6.2 Rest of APAC: Radiation-Hardened Electronics Market, by Manufacturing Technique
    - 10.1.1.6.3 Rest of APAC: Radiation-Hardened Electronics Market, by Application

11. Industry Landscape

11.1 Overview
11.2 Market Initiative
11.3 Merger and Acquisition
11.4 New Development

12. Company Profiles

12.1 BAE Systems
- 12.1.1 Key Facts
- 12.1.2 Business Description
- 12.1.3 Products and Services
- 12.1.4 Financial Overview
- 12.1.5 SWOT Analysis
- 12.1.6 Key Developments
12.2 Data Device Corporation
- 12.2.1 Key Facts
- 12.2.2 Business Description
- 12.2.3 Products and Services
- 12.2.4 Financial Overview
- 12.2.5 SWOT Analysis
- 12.2.6 Key Developments
12.3 Honeywell International Inc.
- 12.3.1 Key Facts
- 12.3.2 Business Description
- 12.3.3 Products and Services
- 12.3.4 Financial Overview
- 12.3.5 SWOT Analysis
- 12.3.6 Key Developments
12.4 Infineon Technologies AG
- 12.4.1 Key Facts
- 12.4.2 Business Description
- 12.4.3 Products and Services
- 12.4.4 Financial Overview
- 12.4.5 SWOT Analysis
- 12.4.6 Key Developments
12.5 Renesas Electronics Corporation
- 12.5.1 Key Facts
- 12.5.2 Business Description
- 12.5.3 Products and Services
- 12.5.4 Financial Overview
- 12.5.5 SWOT Analysis
- 12.5.6 Key Developments
12.6 Texas Instruments Incorporated
- 12.6.1 Key Facts
- 12.6.2 Business Description
- 12.6.3 Products and Services
- 12.6.4 Financial Overview
- 12.6.5 SWOT Analysis
- 12.6.6 Key Developments
12.7 STMicroelectronics
- 12.7.1 Key Facts
- 12.7.2 Business Description
- 12.7.3 Products and Services
- 12.7.4 Financial Overview
- 12.7.5 SWOT Analysis
- 12.7.6 Key Developments
12.8 Xilinx, Inc. (AMD)
- 12.8.1 Key Facts
- 12.8.2 Business Description
- 12.8.3 Products and Services
- 12.8.4 Financial Overview
- 12.8.5 SWOT Analysis
- 12.8.6 Key Developments
12.9 VORAGO Technologies
- 12.9.1 Key Facts
- 12.9.2 Business Description
- 12.9.3 Products and Services
- 12.9.4 Financial Overview
- 12.9.5 SWOT Analysis
- 12.9.6 Key Developments
12.10 Microchip Technology Inc.
- 12.10.1 Key Facts
- 12.10.2 Business Description
- 12.10.3 Products and Services
- 12.10.4 Financial Overview
- 12.10.5 SWOT Analysis
- 12.10.6 Key Developments

13. Appendix

13.1 About The Insight Partners
13.2 Word Index