South & Central America 3D Stacking Market Forecast to 2031 - Regional Analysis by Interconnecting Technology, Device Type, and End User

Description

List of Tables

The South & Central America 3D stacking market was valued at US$ 69.93 million in 2023 and is expected to reach US$ 122.69 million by 2031; it is anticipated to register a CAGR of 7.3% from 2023 to 2031.

Surge in Demand for High-Bandwidth Memory Fuels South & Central America 3D Stacking Market

High-bandwidth memory (HBM), which reaches extremely high density by stacking numerous dynamic random-access memory (DRAMs) vertically, is distinguished by rapid data processing and low power consumption. It is essential in high-performance computing (HPC), such as generative AI, which requires processing enormous amounts of data at significantly fast speeds. Samsung Electronics 12-layer stacked HBM uses next-generation 3D stacking packaging technique to boost performance and yield. With a processing speed of 6.4Gbps and a bandwidth of 819 GB/s, HBM3 is 1.8 times faster than the previous-generation DRAM while using 10% less power. The demand for HBM in high-performance computing applications encourages market players to increase their production. For instance, in March 2024, SK HYNIX INC started volume production of HBM3E1, the newest AI memory product with ultra-high performance. HBM3E is designed for an AI system that processes a huge amount of data quickly. The high-bandwidth memory is used by various industries, including telecommunication, automotive, healthcare, and manufacturing, for high-speed data processing.

HBM utilizes 3D stacking technology, allowing the stacking of multiple layers of chips using vertical channels known as through-silicon vias (TSVs). This enables a greater number of memory chips to be packed into a smaller space, minimizing the distance data must travel between the memory and processor. HBM can help lengthen battery life and reduce energy consumption by offering sustainable benefits to users. This supports users in decreasing the amount of power required to transmit data between memory and processor. Therefore, the surge in demand for high-speed data processing and low-power consumption memories is expected to create lucrative opportunities for the 3D stacking market growth during the forecast period.

South & Central America 3D Stacking Market Overview

The South & Central America 3D stacking market is segmented into Brazil, Argentina, and the Rest of South & Central America. The growing demand for CMOS image sensors in machine vision systems fuels the need for 3D stacking. The 3D stacking market growth in SAM is majorly driven by the rising demand for high-quality cameras in smartphones and tablets and the growing application of image sensors in various sectors such as medical diagnostic & image sensors and automotive. Also, the consumer electronics industry is proliferating in the region due to increasing demand for electronic devices across healthcare, consumer electronics, and manufacturing sectors. South & Central American countries such as Argentina, Chile, Brazil, and Colombia are major players in the consumer electronics industry. The growing number of consumer electronics require 3D stacking for various purposes. For example, 3D stacking is a transformative technology in consumer electronics that enables the creation of more powerful, efficient, and compact devices. Therefore, with the increase in the electronic industry, the demand for 3D stacking is also increasing in South & Central America.

South & Central America 3D Stacking Market Revenue and Forecast to 2031 (US$ Million)

South & Central America 3D Stacking Market Segmentation

The South & Central America 3D stacking market is categorized into interconnecting technology, device type, end user, and country.

Based on interconnecting technology, the South & Central America 3D stacking market is segmented into through-silicon via, monolithic 3D integration, and 3D hybrid bonding. The through-silicon via segment held the largest market share in 2023.

By device type, the South & Central America 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held the largest market share in 2023.

In the terms of end user, the South & Central America 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held the largest market share in 2023.

By country, the South & Central America 3D stacking market is segmented into Brazil, Argentina, and the Rest of South & Central America. Argentina dominated the South & Central America 3D stacking market share in 2023.

Samsung Electronics Co Ltd; Intel Corp; Texas Instruments Inc; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc are some of the leading companies operating in the South & Central America 3D stacking market.

Product Code: BMIRE00031570

1. Introduction

1.1 The Insight Partners Research Report Guidance
1.2 Market Segmentation

2. Executive Summary

2.1 Key Insights
2.2 Market Attractiveness

3. Research Methodology

3.1 Secondary Research
3.2 Primary Research
- 3.2.1 Hypothesis formulation:
- 3.2.2 Macro-economic factor analysis:
- 3.2.3 Developing base number:
- 3.2.4 Data Triangulation:
- 3.2.5 Country level data:

4. South & Central America 3D Stacking Market Landscape

4.1 Overview
4.2 PEST Analysis
4.3 Ecosystem Analysis
- 4.3.1 List of Vendors in the Value Chain

5. South & Central America 3D Stacking Market - Key Market Dynamics

5.1 3D Stacking Market - Key Market Dynamics
5.2 Market Drivers
- 5.2.1 Rising Demand for Consumer Electronics
- 5.2.2 Increasing Use of Heterogeneous Integration and Component Optimization
5.3 Market Restraints
- 5.3.1 Complexity Associated with 3D Stacking Technology
5.4 Market Opportunities
- 5.4.1 Surge in Demand for High-Bandwidth Memory
5.5 Future Trends
- 5.5.1 Fast Processors for Gaming Purposes
5.6 Impact of Drivers and Restraints:

6. 3D Stacking Market -South & Central America Analysis

6.1 South & Central America 3D Stacking Market Overview
6.2 South & Central America 3D Stacking Market Revenue (US$ Million), 2021-2031
6.3 South & Central America 3D Stacking Market Forecast Analysis

7. South & Central America 3D Stacking Market Analysis - by Interconnecting Technology

7.1 Through-Silicon Via
- 7.1.1 Overview
- 7.1.2 Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
7.2 Monolithic 3D Integration
- 7.2.1 Overview
- 7.2.2 Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
7.3 3D Hybrid Bonding
- 7.3.1 Overview
- 7.3.2 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

8. South & Central America 3D Stacking Market Analysis - by Device Type

8.1 Memory Devices
- 8.1.1 Overview
- 8.1.2 Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
8.2 MEMS/Sensors
- 8.2.1 Overview
- 8.2.2 MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
8.3 LEDs
- 8.3.1 Overview
- 8.3.2 LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
8.4 Imaging and Optoelectronics
- 8.4.1 Overview
- 8.4.2 Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
8.5 Others
- 8.5.1 Overview
- 8.5.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

9. South & Central America 3D Stacking Market Analysis - by End User

9.1 Consumer Electronics
- 9.1.1 Overview
- 9.1.2 Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.2 Telecommunication
- 9.2.1 Overview
- 9.2.2 Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.3 Automotive
- 9.3.1 Overview
- 9.3.2 Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.4 Manufacturing
- 9.4.1 Overview
- 9.4.2 Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.5 Healthcare
- 9.5.1 Overview
- 9.5.2 Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
9.6 Others
- 9.6.1 Overview
- 9.6.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

10. South and Central America 3D Stacking Market -Country Analysis

10.1 South and Central America
- 10.1.1 South and Central America 3D Stacking Market, by Key Country - Revenue (2023) (US$ Million)
- 10.1.2 South and Central America 3D Stacking Market - Revenue and Forecast Analysis - by Country
  - 10.1.2.1 South and Central America 3D Stacking Market - Revenue and Forecast Analysis - by Country
  - 10.1.2.2 Brazil: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.2.1 Brazil: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.2.2 Brazil: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.2.3 Brazil: 3D Stacking Market Breakdown, by End User
  - 10.1.2.3 Argentina: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.3.1 Argentina: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.3.2 Argentina: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.3.3 Argentina: 3D Stacking Market Breakdown, by End User
  - 10.1.2.4 Rest of South and Central America: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    - 10.1.2.4.1 Rest of South and Central America: 3D Stacking Market Breakdown, by Interconnecting Technology
    - 10.1.2.4.2 Rest of South and Central America: 3D Stacking Market Breakdown, by Device Type
    - 10.1.2.4.3 Rest of South and Central America: 3D Stacking Market Breakdown, by End User

11. Competitive Landscape

11.1 Heat Map Analysis by Key Players
11.2 Company Positioning & Concentration

12. Industry Landscape

12.1 Overview
12.2 Market Initiative
12.3 Product Development

13. Company Profiles

13.1 Samsung Electronics Co Ltd
- 13.1.1 Key Facts
- 13.1.2 Business Description
- 13.1.3 Products and Services
- 13.1.4 Financial Overview
- 13.1.5 SWOT Analysis
- 13.1.6 Key Developments
13.2 Intel Corp
- 13.2.1 Key Facts
- 13.2.2 Business Description
- 13.2.3 Products and Services
- 13.2.4 Financial Overview
- 13.2.5 SWOT Analysis
- 13.2.6 Key Developments
13.3 Texas Instruments Inc
- 13.3.1 Key Facts
- 13.3.2 Business Description
- 13.3.3 Products and Services
- 13.3.4 Financial Overview
- 13.3.5 SWOT Analysis
- 13.3.6 Key Developments
13.4 Advanced Micro Devices Inc
- 13.4.1 Key Facts
- 13.4.2 Business Description
- 13.4.3 Products and Services
- 13.4.4 Financial Overview
- 13.4.5 SWOT Analysis
- 13.4.6 Key Developments
13.5 3M Co
- 13.5.1 Key Facts
- 13.5.2 Business Description
- 13.5.3 Products and Services
- 13.5.4 Financial Overview
- 13.5.5 SWOT Analysis
- 13.5.6 Key Developments
13.6 Globalfoundries Inc
- 13.6.1 Key Facts
- 13.6.2 Business Description
- 13.6.3 Products and Services
- 13.6.4 Financial Overview
- 13.6.5 SWOT Analysis
- 13.6.6 Key Developments

14. Appendix

14.1 About The Insight Partners
14.2 Word Index