Power Supply In Package Chip Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Product, By Application, By Region, By Competition, 2020-2030F

Description

The Global Power Supply In Package Chip Market, valued at USD 3.06 Billion in 2024, is projected to experience a CAGR of 7.86% to reach USD 4.82 Billion by 2030. The Power Supply In Package (PSiP) chip integrates power management functions, such as DC-DC converters and voltage regulators, with other semiconductor components into a single compact package. This design optimizes power delivery, improves efficiency, and reduces the electronic system's footprint.

Market Overview
Forecast Period	2026-2030
Market Size 2024	USD 3.06 Billion
Market Size 2030	USD 4.82 Billion
CAGR 2025-2030	7.86%
Fastest Growing Segment	PwrSoC
Largest Market	Asia Pacific

Key Market Drivers

The global Power Supply In Package chip market is significantly influenced by the continuous drive towards miniaturization and integration within electronic devices, alongside an escalating demand for energy-efficient power solutions. These twin imperatives directly impact the design and adoption of PSiP technologies, which are critical for optimizing power delivery and reducing system footprints across various applications. The broader semiconductor industry, which encompasses these power management solutions, demonstrated substantial growth, with Infineon Technologies AG reporting in November 2023 that its total revenue for fiscal year 2023 reached €16.309 billion, marking a 15 percent increase over the prior year.

Key Market Challenges

The complexity of thermal management presents a notable challenge directly hampering the growth of the Global Power Supply In Package Chip Market. The dense integration inherent in Power Supply In Package (PSiP) designs generates high power densities within a confined space. This necessitates robust heat dissipation mechanisms to prevent overheating, which is critical for ensuring stable operational performance and extending device longevity. Developing effective thermal solutions adds significant layers of complexity to the design and engineering processes for PSiP products.

Key Market Trends

The adoption of wide bandgap (WBG) semiconductor materials, such as silicon carbide and gallium nitride, represents a pivotal trend reshaping the Global Power Supply In Package Chip Market. These materials enable devices to operate at higher voltages, temperatures, and frequencies than traditional silicon, directly leading to greater power density and improved energy efficiency within compact PSiP designs. The superior electrical properties of WBG semiconductors facilitate faster switching speeds and reduced power losses, which are critical for the demanding performance requirements of modern electronics.

Key Market Players

Infineon Technologies AG
Texas Instruments Incorporated
Semiconductor Components Industries, LLC
STMicroelectronics International N.V.
Analog Devices, Inc.
NXP Semiconductors N.V.
Renesas Electronics Corporation
Vishay Intertechnology, Inc.
Panasonic Corporation
Lextar Electronics Corporation

Report Scope:

In this report, the Global Power Supply In Package Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Power Supply In Package Chip Market, By Product:

PSiP
PwrSoC

Power Supply In Package Chip Market, By Application:

Telecom and IT
Automotive
Consumer Electronics
Medical Devices
Military & Defense

Power Supply In Package Chip Market, By Region:

North America
- United States
- Canada
- Mexico
Europe
- France
- United Kingdom
- Italy
- Germany
- Spain
Asia Pacific
- China
- India
- Japan
- Australia
- South Korea
South America
- Brazil
- Argentina
- Colombia
Middle East & Africa
- South Africa
- Saudi Arabia
- UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Power Supply In Package Chip Market.

Available Customizations:

Global Power Supply In Package Chip Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

1. Product Overview

1.1. Market Definition
1.2. Scope of the Market
- 1.2.1. Markets Covered
- 1.2.2. Years Considered for Study
- 1.2.3. Key Market Segmentations

2. Research Methodology

2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations

3. Executive Summary

3.1. Overview of the Market
3.2. Overview of Key Market Segmentations
3.3. Overview of Key Market Players
3.4. Overview of Key Regions/Countries
3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Power Supply In Package Chip Market Outlook

5.1. Market Size & Forecast
- 5.1.1. By Value
5.2. Market Share & Forecast
- 5.2.1. By Product (PSiP, PwrSoC)
- 5.2.2. By Application (Telecom and IT, Automotive, Consumer Electronics, Medical Devices, Military & Defense)
- 5.2.3. By Region
- 5.2.4. By Company (2024)
5.3. Market Map

6. North America Power Supply In Package Chip Market Outlook

6.1. Market Size & Forecast
- 6.1.1. By Value
6.2. Market Share & Forecast
- 6.2.1. By Product
- 6.2.2. By Application
- 6.2.3. By Country
6.3. North America: Country Analysis
- 6.3.1. United States Power Supply In Package Chip Market Outlook
  - 6.3.1.1. Market Size & Forecast
    - 6.3.1.1.1. By Value
  - 6.3.1.2. Market Share & Forecast
    - 6.3.1.2.1. By Product
    - 6.3.1.2.2. By Application
- 6.3.2. Canada Power Supply In Package Chip Market Outlook
  - 6.3.2.1. Market Size & Forecast
    - 6.3.2.1.1. By Value
  - 6.3.2.2. Market Share & Forecast
    - 6.3.2.2.1. By Product
    - 6.3.2.2.2. By Application
- 6.3.3. Mexico Power Supply In Package Chip Market Outlook
  - 6.3.3.1. Market Size & Forecast
    - 6.3.3.1.1. By Value
  - 6.3.3.2. Market Share & Forecast
    - 6.3.3.2.1. By Product
    - 6.3.3.2.2. By Application

7. Europe Power Supply In Package Chip Market Outlook

7.1. Market Size & Forecast
- 7.1.1. By Value
7.2. Market Share & Forecast
- 7.2.1. By Product
- 7.2.2. By Application
- 7.2.3. By Country
7.3. Europe: Country Analysis
- 7.3.1. Germany Power Supply In Package Chip Market Outlook
  - 7.3.1.1. Market Size & Forecast
    - 7.3.1.1.1. By Value
  - 7.3.1.2. Market Share & Forecast
    - 7.3.1.2.1. By Product
    - 7.3.1.2.2. By Application
- 7.3.2. France Power Supply In Package Chip Market Outlook
  - 7.3.2.1. Market Size & Forecast
    - 7.3.2.1.1. By Value
  - 7.3.2.2. Market Share & Forecast
    - 7.3.2.2.1. By Product
    - 7.3.2.2.2. By Application
- 7.3.3. United Kingdom Power Supply In Package Chip Market Outlook
  - 7.3.3.1. Market Size & Forecast
    - 7.3.3.1.1. By Value
  - 7.3.3.2. Market Share & Forecast
    - 7.3.3.2.1. By Product
    - 7.3.3.2.2. By Application
- 7.3.4. Italy Power Supply In Package Chip Market Outlook
  - 7.3.4.1. Market Size & Forecast
    - 7.3.4.1.1. By Value
  - 7.3.4.2. Market Share & Forecast
    - 7.3.4.2.1. By Product
    - 7.3.4.2.2. By Application
- 7.3.5. Spain Power Supply In Package Chip Market Outlook
  - 7.3.5.1. Market Size & Forecast
    - 7.3.5.1.1. By Value
  - 7.3.5.2. Market Share & Forecast
    - 7.3.5.2.1. By Product
    - 7.3.5.2.2. By Application

8. Asia Pacific Power Supply In Package Chip Market Outlook

8.1. Market Size & Forecast
- 8.1.1. By Value
8.2. Market Share & Forecast
- 8.2.1. By Product
- 8.2.2. By Application
- 8.2.3. By Country
8.3. Asia Pacific: Country Analysis
- 8.3.1. China Power Supply In Package Chip Market Outlook
  - 8.3.1.1. Market Size & Forecast
    - 8.3.1.1.1. By Value
  - 8.3.1.2. Market Share & Forecast
    - 8.3.1.2.1. By Product
    - 8.3.1.2.2. By Application
- 8.3.2. India Power Supply In Package Chip Market Outlook
  - 8.3.2.1. Market Size & Forecast
    - 8.3.2.1.1. By Value
  - 8.3.2.2. Market Share & Forecast
    - 8.3.2.2.1. By Product
    - 8.3.2.2.2. By Application
- 8.3.3. Japan Power Supply In Package Chip Market Outlook
  - 8.3.3.1. Market Size & Forecast
    - 8.3.3.1.1. By Value
  - 8.3.3.2. Market Share & Forecast
    - 8.3.3.2.1. By Product
    - 8.3.3.2.2. By Application
- 8.3.4. South Korea Power Supply In Package Chip Market Outlook
  - 8.3.4.1. Market Size & Forecast
    - 8.3.4.1.1. By Value
  - 8.3.4.2. Market Share & Forecast
    - 8.3.4.2.1. By Product
    - 8.3.4.2.2. By Application
- 8.3.5. Australia Power Supply In Package Chip Market Outlook
  - 8.3.5.1. Market Size & Forecast
    - 8.3.5.1.1. By Value
  - 8.3.5.2. Market Share & Forecast
    - 8.3.5.2.1. By Product
    - 8.3.5.2.2. By Application

9. Middle East & Africa Power Supply In Package Chip Market Outlook

9.1. Market Size & Forecast
- 9.1.1. By Value
9.2. Market Share & Forecast
- 9.2.1. By Product
- 9.2.2. By Application
- 9.2.3. By Country
9.3. Middle East & Africa: Country Analysis
- 9.3.1. Saudi Arabia Power Supply In Package Chip Market Outlook
  - 9.3.1.1. Market Size & Forecast
    - 9.3.1.1.1. By Value
  - 9.3.1.2. Market Share & Forecast
    - 9.3.1.2.1. By Product
    - 9.3.1.2.2. By Application
- 9.3.2. UAE Power Supply In Package Chip Market Outlook
  - 9.3.2.1. Market Size & Forecast
    - 9.3.2.1.1. By Value
  - 9.3.2.2. Market Share & Forecast
    - 9.3.2.2.1. By Product
    - 9.3.2.2.2. By Application
- 9.3.3. South Africa Power Supply In Package Chip Market Outlook
  - 9.3.3.1. Market Size & Forecast
    - 9.3.3.1.1. By Value
  - 9.3.3.2. Market Share & Forecast
    - 9.3.3.2.1. By Product
    - 9.3.3.2.2. By Application

10. South America Power Supply In Package Chip Market Outlook

10.1. Market Size & Forecast
- 10.1.1. By Value
10.2. Market Share & Forecast
- 10.2.1. By Product
- 10.2.2. By Application
- 10.2.3. By Country
10.3. South America: Country Analysis
- 10.3.1. Brazil Power Supply In Package Chip Market Outlook
  - 10.3.1.1. Market Size & Forecast
    - 10.3.1.1.1. By Value
  - 10.3.1.2. Market Share & Forecast
    - 10.3.1.2.1. By Product
    - 10.3.1.2.2. By Application
- 10.3.2. Colombia Power Supply In Package Chip Market Outlook
  - 10.3.2.1. Market Size & Forecast
    - 10.3.2.1.1. By Value
  - 10.3.2.2. Market Share & Forecast
    - 10.3.2.2.1. By Product
    - 10.3.2.2.2. By Application
- 10.3.3. Argentina Power Supply In Package Chip Market Outlook
  - 10.3.3.1. Market Size & Forecast
    - 10.3.3.1.1. By Value
  - 10.3.3.2. Market Share & Forecast
    - 10.3.3.2.1. By Product
    - 10.3.3.2.2. By Application

11. Market Dynamics

11.1. Drivers
11.2. Challenges

12. Market Trends & Developments

12.1. Merger & Acquisition (If Any)
12.2. Product Launches (If Any)
12.3. Recent Developments

13. Global Power Supply In Package Chip Market: SWOT Analysis

14. Porter's Five Forces Analysis

14.1. Competition in the Industry
14.2. Potential of New Entrants
14.3. Power of Suppliers
14.4. Power of Customers
14.5. Threat of Substitute Products

15. Competitive Landscape

15.1. Infineon Technologies AG
- 15.1.1. Business Overview
- 15.1.2. Products & Services
- 15.1.3. Recent Developments
- 15.1.4. Key Personnel
- 15.1.5. SWOT Analysis
15.2. Texas Instruments Incorporated
15.3. Semiconductor Components Industries, LLC
15.4. STMicroelectronics International N.V.
15.5. Analog Devices, Inc.
15.6. NXP Semiconductors N.V.
15.7. Renesas Electronics Corporation
15.8. Vishay Intertechnology, Inc.
15.9. Panasonic Corporation
15.10. Lextar Electronics Corporation